公开(公告)号：US11506709B2

公开(公告)日：2022-11-22

申请号：US16199092

申请日：2018-11-23

Applicant: Intel Corporation

Inventor： Mario Pacheco ,  Deepak Goyal

IPC: G01N23/04 ,  G01R31/303

Abstract: Embodiments may relate an x-ray filter. The x-ray filter may be configured to be positioned between an x-ray source output and a device under test (DUT) that is to be x-rayed. The x-ray filter may include at least 80% titanium (Ti) by weight. Other embodiments may be described or claimed.

公开(公告)号：US11346818B2

公开(公告)日：2022-05-31

申请号：US16881025

申请日：2020-05-22

Applicant: Intel Corporation

Inventor： Mario Pacheco ,  Odissei Touzanov ,  Jacob Woolsey ,  Deepak Goyal

IPC: G01R31/28 ,  G01N29/22 ,  G01N29/04

Abstract: According to various examples, a method for non-destructive detection of defects in a semiconductor die is described. The method may include positioning an emitter above the semiconductor die. The method may include generating an emitted wave using the emitter that is directed to a focal point on a surface of the die. The method may include generating a reflected wave from the focal point. The focal point may act as a point source reflecting the emitted wave. The method may include positioning a receiver above the die to receive the reflected wave. The method may also include measuring the reflected wave to detect modulations in amplitude in the reflected wave.

公开(公告)号：US20190293708A1

公开(公告)日：2019-09-26

申请号：US16302555

申请日：2016-05-17

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Chengqing Hu ,  Jong-Ru Guo ,  Zuoguo Wu ,  Deepak Goyal

IPC: G01R31/28 ,  G01R31/11

Abstract: Disclosed herein are systems and methods for the characterization of transmission media, among other embodiments. For example, a system for characterizing a transmission medium may include: a waveform generator to generate an initial input waveform; waveform pre-processing circuitry to process the initial waveform to generate a processed input waveform for provision to the transmission medium, wherein the processed input waveform has a maximum amplitude greater than a maximum amplitude of the initial input waveform; and waveform output circuitry to display or store data representative of an initial output waveform, wherein the initial output waveform is output from the transmission medium as a reflection or transmission of the processed input waveform.

公开(公告)号：US20180254256A1

公开(公告)日：2018-09-06

申请号：US15762837

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Pilin Liu ,  Purushotham Kaushik Muthur Srinath ,  Deepak Goyal

IPC: H01L23/00 ,  B23K35/26 ,  B23K35/02 ,  H01L21/768

CPC classification number: H01L24/81 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/264 ,  H01L21/76843 ,  H01L23/48 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13113 ,  H01L2224/13147 ,  H01L2224/16147 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01322

Abstract: Some forms relate to an electronic assembly includes a first substrate that has a copper pad mounted to the first substrate. The electronic assembly further includes a second substrate that includes a copper redistribution layer mounted on the second substrate. The electronic assembly further includes bismuth-rich solder that includes 10-40 w.t. % tin. The bismuth-rich solder is electrically engaged with the copper pad and the copper redistribution layer. In some forms, the copper redistribution layer is another copper pad. The first substrate may include a memory die and the second substrate may include a logic die. In other forms, the first and second substrates may be part of a variety of different electronic components. The types of electronic components that are associated with the first and second substrates will depend on part on the application where the electronic assembly is be utilized (among other factors).

公开(公告)号：US20160274044A1

公开(公告)日：2016-09-22

申请号：US14664726

申请日：2015-03-20

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Deepak Goyal ,  Thomas J. Begala

IPC: G01N25/00

CPC classification number: G01N25/72

Abstract: Circuit device inspection system using temperature gradients. In some embodiments, a system may include an infrared camera, first and second temperature sources, controller circuitry to cause the infrared camera to capture an infrared image of a region of a circuit device and to cause the first and second temperature sources to generate first and second temperature outputs to be applied to first and second locations on the circuit device, and processing circuitry to generate temperature gradient data. The temperature gradient data may be indicative of discontinuities in traces in the circuit device.

Abstract translation: 电路设备检查系统采用温度梯度。 在一些实施例中，系统可以包括红外相机，第一和第二温度源，控制器电路，用于使红外相机捕获电路设备的区域的红外图像，并且使第一和第二温度源首先产生和 要施加到电路装置上的第一和第二位置的第二温度输出，以及用于产生温度梯度数据的处理电路。 温度梯度数据可以指示电路装置中的迹线中的不连续性。

公开(公告)号：US20160245758A1

公开(公告)日：2016-08-25

申请号：US15146812

申请日：2016-05-04

Applicant: Intel Corporation

Inventor： Shuhong Liu ,  Zhiyong Wang ,  Nilanjan Z. Ghosh ,  Deepak Goyal

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01B9/0203 ,  G01B9/0209 ,  G01B11/0675 ,  G01B2210/56 ,  G01N21/956 ,  G02B21/0016

Abstract: Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.

Abstract translation: 实施例包括使用具有倾斜物镜的白光干涉仪（WLI）显微镜的装置，系统和方法，以执行两种抗蚀剂基础缺陷和导电迹线底切缺陷的在线监测。 可以在干膜抗蚀剂（DFR）基底与在封装衬底的绝缘层顶表面上发现的导电迹线基底之间的界面处检测到缺陷。 这种基础和底切缺陷可能被认为是“隐藏的缺陷”。 使用具有倾斜物镜的WLI显微镜为非破坏性，非接触式在线监测提供了高吞吐量和低成本的计量和工具。

公开(公告)号：US20160011122A1

公开(公告)日：2016-01-14

申请号：US14329686

申请日：2014-07-11

Applicant: Intel Corporation

Inventor： Mario Pacheco ,  Deepak Goyal

IPC: G01N21/95 ,  G01N21/88 ,  G01N21/21 ,  H01L21/67

CPC classification number: G01N21/9505 ,  G01N21/21 ,  G01N21/8806 ,  G01N2021/216 ,  G01N2201/0612 ,  H01L21/67288

Abstract: Generally discussed herein are systems, apparatuses, and methods that can detect a defect in a die. According to an example, a method can include transmitting a first beam of light with a wavelength and optical power configured to produce a reflected beam with at least one milli-Watt of power, linearly polarizing the first beam of light in a specific direction, circularly polarizing the linearly polarized light by a quarter wavelength to create circularly polarized light, directing the circularly polarized light to a device under test, linearly polarizing light reflected off the device under test by a quarter wavelength, or creating an image of the linearly polarized light reflected off the device under test.

Abstract translation: 这里通常讨论的是可以检测模具中的缺陷的系统，装置和方法。 根据一个示例，一种方法可以包括传输具有波长和光功率的第一光束，其被配置为产生具有至少一毫瓦功率的反射光束，以沿着特定方向将第一光束线性偏振 将线性偏振光偏振四分之一波长以产生圆偏振光，将圆偏振光引导到被测器件，将被测器件反射的光线线偏振四分之一波长，或产生反射的线性偏振光的图像 关闭被测设备。

公开(公告)号：US11791237B2

公开(公告)日：2023-10-17

申请号：US16019899

申请日：2018-06-27

Applicant: Intel Corporation

Inventor： Peng Li ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal ,  Ken Hackenberg

IPC: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3736 ,  H01L24/29

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.

公开(公告)号：US11226353B2

公开(公告)日：2022-01-18

申请号：US16493503

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Chengqing Hu ,  Mayue Xie ,  Simranjit S. Khalsa ,  Deepak Goyal

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/11 ,  G01R31/28

Abstract: An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.

公开(公告)号：US20210407833A1

公开(公告)日：2021-12-30

申请号：US16911466

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Chandrashekara Shashank Kaira ,  Phillip C. Miller ,  Purushotham Kaushik Muthur Srinath ,  Deepak Goyal

IPC: H01L21/67 ,  G01J5/00

Abstract: According to the various examples, a fully integrated system and method for failure analysis using RF-based thermometry enable the detection and location of defects and failures in complex semiconductor packaging architectures. The system provides synchronous amplified RF signals to generate unique thermal signatures at defect locations based on dielectric relaxation loss and heating.