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    Laser processing method and land laser processed product
    3.
    发明授权
    Laser processing method and land laser processed product 有权
    激光加工方法和陆地激光加工产品

    公开(公告)号：US09566663B2

    公开(公告)日：2017-02-14

    申请号：US12663185

    申请日：2008-06-05

    申请人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

    发明人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

    IPC分类号： B23K26/00 ,  B23K26/02 ,  B23K26/38 ,  B23K26/40

    CPC分类号： B23K26/02 ,  B23K26/38 ,  B23K26/402 ,  B23K2103/42 ,  B23K2103/50 ,  B29C2791/009 ,  B29C2793/00

    摘要： There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.

    摘要翻译： 提供了一种激光束处理方法，其中当使用激光束对由聚合物材料制成的工件执行加工方法时，可以抑制来自切割的异物的产生并且可以减少工件的表面的污染，并且 激光加工产品。 此外，本发明提供一种激光束处理方法中使用的激光束处理装置。 激光束处理方法技术领域本发明涉及一种用于使用激光束处理由聚合物材料制成的工件的激光束处理方法，其中在激光束的光轴沿前进方向倾斜的状态下用激光束照射工件 相对于工件的垂直方向进行规定的角度的处理。

    LASER BEAM PROCESSING METHOD AND LASER PROCESSED PRODUCT
    4.
    发明申请
    LASER BEAM PROCESSING METHOD AND LASER PROCESSED PRODUCT 有权
    激光束加工方法和激光加工产品

    公开(公告)号：US20100167076A1

    公开(公告)日：2010-07-01

    申请号：US12663185

    申请日：2008-06-05

    申请人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

    发明人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

    IPC分类号： B23K26/00 ,  B29C35/08

    CPC分类号： B23K26/02 ,  B23K26/38 ,  B23K26/402 ,  B23K2103/42 ,  B23K2103/50 ,  B29C2791/009 ,  B29C2793/00

    摘要： There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.

    摘要翻译： 提供了一种激光束处理方法，其中当使用激光束对由聚合物材料制成的工件执行加工方法时，可以抑制来自切割的异物的产生并且可以减少工件的表面的污染，并且 激光加工产品。 此外，本发明提供一种激光束处理方法中使用的激光束处理装置。 激光束处理方法技术领域本发明涉及一种用于使用激光束处理由聚合物材料制成的工件的激光束处理方法，其中在激光束的光轴沿前进方向倾斜的状态下用激光束照射工件 相对于工件的垂直方向进行规定的角度的处理。

    Through hole forming method
    6.
    发明授权
    Through hole forming method 失效
    通孔成型方法

    公开(公告)号：US07665208B2

    公开(公告)日：2010-02-23

    申请号：US11766129

    申请日：2007-06-21

    申请人： Kanji Nishida ,  Naoyuki Matsuo ,  Masakatsu Urairi

    发明人： Kanji Nishida ,  Naoyuki Matsuo ,  Masakatsu Urairi

    IPC分类号： H01K3/10 ,  B05D5/12

    CPC分类号： H05K3/0038 ,  H05K3/0055 ,  H05K3/386 ,  H05K3/427 ,  H05K2203/107 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A first through hole is formed in a laminate by trepanning machining using laser light, for example. The trepanning machining refers to a process for irradiating laser light along such a trajectory that the laser light is first irradiated onto a substantially central area of a first through hole to be formed, the laser light is irradiated along a circumference corresponding to the bore diameter of the first through hole to be formed, and the laser light is finally irradiated onto the substantially central area of the first through hole to be formed again. A second through hole being substantially concentric with and having a larger bore diameter than the first through hole is formed by irradiating the laser light, similarly to the first through hole.

    摘要翻译： 例如，通过使用激光进行加工来形成层叠体中的第一贯通孔。 扫描加工是指沿着激光首先照射到要形成的第一通孔的大致中心区域的轨迹照射激光的处理，激光沿着对应于要形成的第一通孔的圆周照射 要形成的第一通孔，并且最终将激光照射到要再次形成的第一通孔的大致中心区域上。 与第一通孔类似地，通过照射激光来形成与第一通孔大致同心并且具有比第一通孔更大的第二通孔。