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    Methods for installing a circuit device
    1.
    发明授权
    Methods for installing a circuit device 失效
    安装电路装置的方法

    公开(公告)号：US07065868B2

    公开(公告)日：2006-06-27

    申请号：US10747333

    申请日：2003-12-29

    申请人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    发明人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    IPC分类号： H01R9/00

    CPC分类号： H05K7/1415 ,  B25B27/00 ,  H05K3/301 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49169 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53209 ,  Y10T29/53257 ,  Y10T29/53261 ,  Y10T29/53265

    摘要： A method is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

    摘要翻译： 提供了一种用于将电路组件（诸如存储器件）安装在诸如插座的支撑件中的方法。 要安装的设备支撑在支架或外壳中。 保持器定位在接收插座中的支撑区域上方。 将手动执行器压入保持器中以将装置从保持器中排出并将装置安装在支撑件中。 保持器可以被配置为保持单个设备，或者多个设备在由分区定义的槽中对齐。 可以提供多装置托盘用于将装置向分度装置移动到排出槽，通过这些装置通过手动驱动排放致动器来安装装置。 该技术在安装之前和安装期间为设备提供保护，并且便于手动安装这些设备，而不需要在安装之前或安装期间直接与设备接触。

    Method and apparatus for installing a circuit device
    2.
    发明授权
    Method and apparatus for installing a circuit device 失效
    用于安装电路装置的方法和装置

    公开(公告)号：US06681480B1

    公开(公告)日：2004-01-27

    申请号：US09258764

    申请日：1999-02-26

    申请人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    发明人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    IPC分类号： B23P1900

    CPC分类号： H05K7/1415 ,  B25B27/00 ,  H05K3/301 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49169 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53209 ,  Y10T29/53257 ,  Y10T29/53261 ,  Y10T29/53265

    摘要： A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

    摘要翻译： 提供了一种技术，用于将诸如存储设备的电路组件安装在诸如插座的支撑件中。 要安装的设备支撑在支架或外壳中。 保持器定位在接收插座中的支撑区域上方。 将手动执行器压入保持器中以将装置从保持器中排出并将装置安装在支撑件中。 保持器可以被配置为保持单个设备，或者多个设备在由分区定义的槽中对齐。 可以提供多装置托盘用于将装置向分度装置移动到排出槽，通过这些装置通过手动驱动排放致动器来安装装置。 该技术在安装之前和安装期间为设备提供保护，并且便于手动安装这些设备，而不需要在安装之前或安装期间直接与设备接触。

    Methods for installing a plurality of circuit devices
    3.
    发明授权
    Methods for installing a plurality of circuit devices 失效
    安装多个电路装置的方法

    公开(公告)号：US07600314B2

    公开(公告)日：2009-10-13

    申请号：US11218995

    申请日：2005-09-01

    申请人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    发明人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    IPC分类号： H01R9/00 ,  H05K3/00

    CPC分类号： H05K7/1415 ,  B25B27/00 ,  H05K3/301 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49169 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53209 ,  Y10T29/53257 ,  Y10T29/53261 ,  Y10T29/53265

    摘要： A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

    摘要翻译： 提供了一种技术，用于将诸如存储设备的电路组件安装在诸如插座的支撑件中。 要安装的设备支撑在支架或外壳中。 保持器定位在接收插座中的支撑区域上方。 将手动执行器压入保持器中以将装置从保持器中排出并将装置安装在支撑件中。 保持器可以被配置为保持单个设备，或者多个设备在由分区定义的槽中对齐。 可以提供多装置托盘用于将装置向分度装置移动到排出槽，通过这些装置通过手动驱动排放致动器来安装装置。 该技术在安装之前和安装期间为设备提供保护，并且便于手动安装这些设备，而不需要在安装之前或安装期间直接与设备接触。

    Method and apparatus for installing a circuit device
    4.
    发明申请
    Method and apparatus for installing a circuit device 失效
    用于安装电路装置的方法和装置

    公开(公告)号：US20060048382A1

    公开(公告)日：2006-03-09

    申请号：US11218995

    申请日：2005-09-01

    申请人： Larry Kinsman ,  Mike Brooks ,  Warren Farnworth ,  Walter Moden ,  Terry Lee

    发明人： Larry Kinsman ,  Mike Brooks ,  Warren Farnworth ,  Walter Moden ,  Terry Lee

    IPC分类号： H01R43/20

    CPC分类号： H05K7/1415 ,  B25B27/00 ,  H05K3/301 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49169 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53209 ,  Y10T29/53257 ,  Y10T29/53261 ,  Y10T29/53265

    摘要： A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

    摘要翻译： 提供了一种技术，用于将诸如存储设备的电路组件安装在诸如插座的支撑件中。 要安装的设备支撑在支架或外壳中。 保持器定位在接收插座中的支撑区域上方。 将手动执行器压入保持器中以将装置从保持器中排出并将装置安装在支撑件中。 保持器可以被配置为保持单个设备，或者多个设备在由分区定义的槽中对齐。 可以提供多装置托盘用于将装置向分度装置移动到排出槽，通过这些装置通过手动驱动排放致动器来安装装置。 该技术在安装之前和安装期间为设备提供保护，并且便于手动安装这些设备，而不需要在安装之前或安装期间直接与设备接触。

    Method and apparatus for a semiconductor package for vertical surface mounting
    9.
    发明授权
    Method and apparatus for a semiconductor package for vertical surface mounting 失效
    用于垂直表面安装的半导体封装的方法和装置

    公开(公告)号：US06777261B2

    公开(公告)日：2004-08-17

    申请号：US10304911

    申请日：2002-11-26

    申请人： Warren Farnworth ,  Larry Kinsman ,  Walter Moden

    发明人： Warren Farnworth ,  Larry Kinsman ,  Walter Moden

    IPC分类号： H01L2144

    CPC分类号： H01L25/0657 ,  H01L23/3171 ,  H01L23/528 ,  H01L2224/05553 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/30107 ,  H01L2924/00

    摘要： A method for packaging a semiconductor device includes connecting a plurality of wire leads to a corresponding plurality of electrical connection pads on the semiconductor device, covering at least a portion of the semiconductor device and at least a portion of each of the wire leads with an encapsulating material, and removing a portion of the encapsulating material and a portion of each of the wire leads to form a packaged semiconductor device wherein each of the wire leads has an exposed portion only at an end. The invention also includes a packaged semiconductor device having an integrated circuit device with a plurality of electrical connection pads, a plurality of wire leads coupled to the plurality of electrical connection pads, and a covering of encapsulating material covering at least a portion of the integrated circuit device and covering each of the wire leads, wherein each of the wire leads has an exposed end. The present invention contemplates wire bonding and encapsulation of individual die as well as multiple die on a single wafer.

    摘要翻译： 一种用于封装半导体器件的方法包括将多个引线引线连接到半导体器件上的对应的多个电连接焊盘，覆盖半导体器件的至少一部分以及每个引线的至少一部分具有封装 并且去除所述封装材料的一部分和所述导线引线中的每一个的一部分以形成封装的半导体器件，其中所述引线中的每一个仅在一端具有暴露部分。 本发明还包括具有集成电路器件的封装半导体器件，该集成电路器件具有多个电连接焊盘，耦合到多个电连接焊盘的多个引线引线以及覆盖该集成电路的至少一部分的封装材料的覆盖物 装置并且覆盖每个导线，其中每个导线具有暴露端。 本发明设想在单个晶片上引线接合和封装单个管芯以及多个管芯。