公开(公告)号：US20080042252A1

公开(公告)日：2008-02-21

申请号：US11874531

申请日：2007-10-18

申请人： Walter Moden ,  David Corisis ,  Leonard Mess ,  Larry Kinsman

发明人： Walter Moden ,  David Corisis ,  Leonard Mess ,  Larry Kinsman

IPC分类号： H01L23/488

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

摘要翻译： 一种用于球栅阵列半导体器件的高温热应用的装置封装以及包装球栅阵列半导体器件的方法。

公开(公告)号：US20060051953A1

公开(公告)日：2006-03-09

申请号：US11263398

申请日：2005-10-31

申请人： David Corisis ,  Walter Moden ,  Leonard Mess ,  Larry Kinsman

发明人： David Corisis ,  Walter Moden ,  Leonard Mess ,  Larry Kinsman

IPC分类号： H01L21/44

CPC分类号： H01L24/06 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/145 ,  H05K3/222 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.

摘要翻译： 可堆叠形成高密度组件的球栅阵列封装以及堆叠球栅阵列的方法。 球栅阵列封装包括柔性或刚性衬底。 球栅阵列封装还包括用于连接到半导体器件的电路的阻抗的基本匹配的布置。

公开(公告)号：US20060049504A1

公开(公告)日：2006-03-09

申请号：US11263426

申请日：2005-10-31

申请人： David Corisis ,  Walter Moden ,  Leonard Mess ,  Larry Kinsman

发明人： David Corisis ,  Walter Moden ,  Leonard Mess ,  Larry Kinsman

IPC分类号： H01L23/02

CPC分类号： H01L24/06 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/145 ,  H05K3/222 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.

公开(公告)号：US20050146010A1

公开(公告)日：2005-07-07

申请号：US11063403

申请日：2005-02-22

申请人： Walter Moden ,  David Corisis ,  Leonard Mess ,  Larry Kinsman

发明人： Walter Moden ,  David Corisis ,  Leonard Mess ,  Larry Kinsman

IPC分类号： H01L23/13 ,  H01L25/10 ,  H01L21/48 ,  H01L23/52

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

公开(公告)号：US20050110135A1

公开(公告)日：2005-05-26

申请号：US11028361

申请日：2005-01-03

申请人： David Corisis ,  Walter Moden ,  Leonard Mess ,  Larry Kinsman

发明人： David Corisis ,  Walter Moden ,  Leonard Mess ,  Larry Kinsman

IPC分类号： H01L23/498 ,  H01L25/10 ,  H01L23/52

CPC分类号： H01L24/06 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/145 ,  H05K3/222 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.

摘要翻译： 可堆叠形成高密度组件的球栅阵列封装以及堆叠球栅阵列的方法。 球栅阵列封装包括柔性或刚性衬底。 球栅阵列封装还包括用于连接到半导体器件的电路的阻抗的基本匹配的布置。

公开(公告)号：US20060060957A1

公开(公告)日：2006-03-23

申请号：US11263509

申请日：2005-10-31

申请人： David Corisis ,  Walter Moden ,  Leonard Mess ,  Larry Kinsman

发明人： David Corisis ,  Walter Moden ,  Leonard Mess ,  Larry Kinsman

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： H01L24/06 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/145 ,  H05K3/222 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.

公开(公告)号：US20050029645A1

公开(公告)日：2005-02-10

申请号：US10933059

申请日：2004-09-01

申请人： Leonard Mess ,  Jerry Brooks ,  David Corisis

发明人： Leonard Mess ,  Jerry Brooks ,  David Corisis

IPC分类号： H01L23/495 ,  H01L25/065 ,  H01L29/06 ,  H01L21/44

CPC分类号： H01L23/3128 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked multiple offset chip device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a maximum density low profile device. A particularly useful application is the formation of stacked mass storage flash memory package.

公开(公告)号：US20070065987A1

公开(公告)日：2007-03-22

申请号：US11599223

申请日：2006-11-13

申请人： Leonard Mess ,  Jerry Brooks ,  David Corisis

发明人： Leonard Mess ,  Jerry Brooks ,  David Corisis

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked multiple offset chip device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a maximum density low profile device. A particularly useful application is the formation of stacked mass storage flash memory package.

公开(公告)号：US20050087909A1

公开(公告)日：2005-04-28

申请号：US11011624

申请日：2004-12-13

申请人： Derek Gochnour ,  Leonard Mess

发明人： Derek Gochnour ,  Leonard Mess

IPC分类号： H05K3/28 ,  H05K13/00 ,  B29C35/02

CPC分类号： H05K13/00 ,  H01L2924/3511 ,  H05K3/284

摘要： A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture maybe constructed so a slightbow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board.

摘要翻译： 一种用于在使用夹紧夹具组件的印刷电路板上施加和固化或干燥液体环氧树脂等期间防止板翘曲的方法和装置，其包括至少一个夹紧夹具支架和至少一个夹紧固定盖。 如果需要，可以使用适当的夹具组件来处理多个印刷电路板。 此外，夹持夹具可以构造成轻微的弯头或其曲率可以抵消印刷电路板的凸形或凹形弓形或曲率。

公开(公告)号：US20050148116A1

公开(公告)日：2005-07-07

申请号：US11059593

申请日：2005-02-16

申请人： Stuart Roberts ,  William Reeder ,  Leonard Mess

发明人： Stuart Roberts ,  William Reeder ,  Leonard Mess

IPC分类号： H01L23/495 ,  H01L23/544 ,  H01L21/48

CPC分类号： H01L23/544 ,  H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system

摘要翻译： 一种由自动引线接合系统形成的半导体器件。 半导体器件包括具有多个引线指和管芯焊盘的引线框架和安装到管芯焊盘的半导体管芯。 模板包括从模具延伸的多个眼点特征。 芯片包括第一多个接合焊盘，并且引线指包括第二多个接合焊盘。 第一和第二接合焊盘通过由自动引线接合系统安装的多个连接线互连。 引线接合系统获得引线框架的图像，并且识别图像内的管芯焊盘的眼点特征，以便更精确地确定引线框架的第二引线接合焊盘相对于引线接合系统的位置