公开(公告)号：US20190123253A1

公开(公告)日：2019-04-25

申请号：US16222581

申请日：2018-12-17

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/48 ,  H01L31/0203 ,  H01L23/00 ,  H01L31/02

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US20190088825A1

公开(公告)日：2019-03-21

申请号：US16150255

申请日：2018-10-02

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L23/00

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20190035981A1

公开(公告)日：2019-01-31

申请号：US16150259

申请日：2018-10-02

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/56 ,  B29C45/00 ,  H01L33/50 ,  H01L23/00 ,  B29C45/14 ,  H01L33/62 ,  H01L33/64

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20160056357A1

公开(公告)日：2016-02-25

申请号：US14928550

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20140315338A1

公开(公告)日：2014-10-23

申请号：US14321672

申请日：2014-07-01

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohide MIKI ,  Tomoya TSUKIOKA ,  Tomohisa KISHIMOTO

IPC: H01L33/56 ,  H01L33/36 ,  H01L33/60

CPC classification number: H01L33/36 ,  C08G59/3245 ,  C08K3/013 ,  C08K5/005 ,  H01L33/32 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Abstract translation: 公开了一种发光装置，其包括由发光峰值波长不小于430nm的氮化镓系化合物半导体构成的发光元件（10） 设置有具有安装有发光元件（10）的底面的凹部和侧面的成型体（40） 以及含有包含三嗪衍生物环氧树脂的环氧树脂或含硅树脂的密封构件（50）。 成型体（40）通过使用基本上含有包含三嗪衍生物环氧树脂的环氧树脂的热固性环氧树脂组合物的固化物得到，并且在不小于430nm的波长下具有不小于70％的反射率 。

公开(公告)号：US20200287096A1

公开(公告)日：2020-09-10

申请号：US16883714

申请日：2020-05-26

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L23/00 ,  H01L33/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20180083169A1

公开(公告)日：2018-03-22

申请号：US15823575

申请日：2017-11-28

Applicant: NICHIA CORPORATION

Inventor： Ryoji NAKA ,  Atsushi BANDO ,  Tomohide MIKI ,  Kimihiro MIYAMOTO

IPC: H01L33/56 ,  H01L33/52 ,  H01L33/48 ,  H01L33/08 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/486 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a package having a recess which includes a bottom surface and an inner peripheral surface around a periphery of the bottom surface. The package includes a first lead to define a first part of the bottom surface, a second lead to define a second part of the bottom surface, and a resin body to provide the inner peripheral surface and a remaining part of the bottom surface. The bottom surface includes a light emitting element mounting region in the first part and a groove surrounding the light emitting element mounting region. A light emitting element is mounted on the light emitting element mounting region. A light-transmissive resin is provided in the recess to be in at least a part of a groove surface. A light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin.

公开(公告)号：US20170141273A1

公开(公告)日：2017-05-18

申请号：US15360316

申请日：2016-11-23

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/50 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20150001563A1

公开(公告)日：2015-01-01

申请号：US14316546

申请日：2014-06-26

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI

IPC: H01L33/44 ,  H01L33/60 ,  H01L33/58

CPC classification number: H01L33/56 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00012

Abstract: There is provided a light emitting device including a light emitting element, a covering member for covering a side surface of the light emitting element, and a light-transmissive member disposed on upper surfaces in a light emitting direction of the light emitting element and the covering member and having an end face on substantially the same plane as an end face of the covering member, wherein the covering member has a recess portion or a convex portion on the upper surface, a light emitting surface of the light emitting element and an upper surface other than the recess portion or the convex portion of the covering member are arranged on substantially the same plane, and the light-transmissive member is provided in contact with the recess portion or the convex portion.

Abstract translation: 提供了一种发光装置，其包括发光元件，用于覆盖发光元件的侧表面的覆盖构件和设置在发光元件的发光方向上的上表面上的透光构件和覆盖物 构件，并且在与覆盖构件的端面基本相同的平面上具有端面，其中覆盖构件在上表面上具有凹部或凸部，发光元件的发光表面和上表面 覆盖部件的凹部或凸部以外的部分布置在基本上相同的平面上，并且透光部件设置成与凹部或凸部接触。

公开(公告)号：US20140042488A1

公开(公告)日：2014-02-13

申请号：US14059243

申请日：2013-10-21

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L31/0203

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。