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公开(公告)号：US20190319176A1
公开(公告)日：2019-10-17
申请号：US16380601
申请日：2019-04-10
Applicant: NICHIA CORPORATION
Inventor： Yoshiki SATO
Abstract: A light-emitting device includes: a light-emitting element which includes an upper surface and a first lateral surface; a light-transmitting member disposed above the light-emitting element, the light-transmitting member having a substantially rectangular shape with a pair of first sides and a pair of second sides; a wavelength conversion member having a plurality of lateral surfaces; and a reflecting member. The light-transmitting member has a pair of second lateral surfaces each including a corresponding one of the first sides, and a pair of third lateral surfaces each including a corresponding one of the second sides. The reflecting member covers the first lateral surface, an entirety of the plurality of lateral surfaces of the wavelength conversion member, and an entirety of the pair of second lateral surfaces of the light-transmitting member. Each of the pair of third lateral surfaces of the light-transmitting member is partially exposed out of the reflecting member.
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公开(公告)号：US20220302341A1
公开(公告)日：2022-09-22
申请号：US17830148
申请日：2022-06-01
Applicant: NICHIA CORPORATION
Inventor： Yoshiki SATO , Masaaki KATSUMATA , Shinichi DAIKOKU , Yoshikazu MATSUDA , Ryuma MARUME , Eiko MINATO
IPC: H01L33/00 , H01L25/075
Abstract: A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively. The paired wirings are formed by irradiation of laser light on a metal paste layer continuously covering the paired electrodes and the first covering member to remove the metal paste layer between the paired electrodes, the metal paste layer comprising a mixture of a resin and metal powder.
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公开(公告)号：US20190103534A1
公开(公告)日：2019-04-04
申请号：US16146521
申请日：2018-09-28
Applicant: NICHIA CORPORATION
Inventor： Yoshiki SATO
Abstract: A method of manufacturing a light emitting device in which a plurality of light emitting devices are formed collectively and then separated into individual light emitting devices, wherein each light emitting device includes a light emitting element, the method including, a base member providing step of providing a base member including: a wiring electrode to be connected to the light emitting elements, and an alignment mark, wherein the wiring electrode and the alignment mark are disposed on an upper surface of the base member; a mounting step of mounting each of the light emitting elements at a predetermined position; an alignment mark covering step of covering the alignment mark with a light-transmissive resin; a reflective resin forming step of forming a reflective resin surrounding the light emitting element so as to expose at least a part of a surface of the light-transmissive resin, the reflective resin reflecting light from the light emitting element; and a cutting step of recognizing the alignment mark through the exposed surface of the light-transmissive resin, and cutting the reflective resin and the base member with reference to the alignment mark to perform singulation into individual light emitting devices.
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公开(公告)号：US20160351762A1
公开(公告)日：2016-12-01
申请号：US15169747
申请日：2016-06-01
Applicant: NICHIA CORPORATION
Inventor： Yoshiki SATO
CPC classification number: H01L33/56 , H01L33/44 , H01L33/507 , H01L33/54 , H01L2933/0041 , H01L2933/005
Abstract: A method for producing a light emitting device includes: spraying a resin mixture onto a light emitting element to deposit the resin mixture on the light emitting element, the resin mixture including a thixotropy imparting agent; and curing the resin mixture to form an outermost layer of a light transmissive member and to have an outermost surface having protrusions and recesses on the outermost layer, light emitted from the light emitting element being capable to transmit to an outside of the light emitting device via the light transmissive member.
Abstract translation: 发光装置的制造方法包括：将树脂混合物喷射到发光元件上，将树脂混合物沉积在发光元件上，所述树脂混合物包含触变性赋予剂; 并且固化树脂混合物以形成透光构件的最外层，并且在最外层具有最外表面具有突起和凹陷，从发光元件发射的光能够透过至发光器件的外部经由 透光构件。
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公开(公告)号：US20200243711A1
公开(公告)日：2020-07-30
申请号：US16774614
申请日：2020-01-28
Applicant: NICHIA CORPORATION
Inventor： Yoshiki SATO , Masaaki KATSUMATA , Shinichi DAIKOKU , Yoshikazu MATSUDA , Ryuma MARUME , Eiko MINATO
IPC: H01L33/00 , H01L25/075
Abstract: A method for manufacturing a light-emitting device includes preparing an intermediate product; the product includes a light-emitting element provided with paired electrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed. A metal paste layer is formed, continuously covering the exposed portion of the paired electrodes and the first covering member. Paired wirings are formed for preventing the paired electrodes from being short-circuited. The metal paste layer on the paired electrodes and the metal paste layer on the first covering member are irradiated with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.
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Patent Agency Ranking
公开(公告)号：US20180108813A1
公开(公告)日：2018-04-19
申请号：US15837434
申请日：2017-12-11
Applicant: NICHIA CORPORATION
Inventor： Yukiko OSHIMA , Yoshiki SATO , Toshiyuki OKAZAKI , Takayoshi WAKAKI
CPC classification number: H01L33/44 , H01L33/486 , H01L33/644 , H01L2224/48247 , H01L2224/48257 , Y10T29/49002
Abstract: A method for manufacturing a light emitting device includes: integrally molding a package and a lead, the package arranged to form at least part of an inner peripheral face of a recess portion in which the light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material; and covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation.
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公开(公告)号：US20150023026A1
公开(公告)日：2015-01-22
申请号：US14332274
申请日：2014-07-15
Applicant: Nichia Corporation
Inventor： Masakazu SAKAMOTO , Yoshiki SATO , Yasuo KATO
IPC: F21V7/22
CPC classification number: H01L33/60 , H01L33/44 , H01L33/62 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/00011 , H01L2924/01005 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01004
Abstract: A light emitting device includes a light emitting element; a light reflecting member having an Ag-containing layer on a surface thereof and a protective film having a thickness of 1 nm to 300 nm and covering a surface of the light reflecting member, the protective film covering a surface of the light reflecting member, in which the Ag-containing layer has a thickness of 0.1 μm to 0.5 μm.
Abstract translation: 发光器件包括发光元件; 在其表面上具有含Ag层的光反射部件和厚度为1nm〜300nm的保护膜，覆盖光反射部件的表面，保护膜覆盖光反射部件的表面， 含Ag层的厚度为0.1μm〜0.5μm。
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公开(公告)号：US20170033267A1
公开(公告)日：2017-02-02
申请号：US15220681
申请日：2016-07-27
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI , Yoshiki SATO , Yoichi BANDO
CPC classification number: H01L33/52 , H01L33/46 , H01L33/50 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/60 , H01L2224/16225 , H01L2224/73253 , H01L2933/0025 , H01L2933/0041 , H01L2933/005
Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.
Abstract translation: 提供了一种发光器件。 发光装置包括发光元件，波长转换构件，透光构件，粘合构件和光反射构件。 波长转换构件具有上表面和侧表面，包含荧光物质，并且被放置在发光元件上。 透光构件覆盖波长转换构件的上表面。 粘合剂构件插入在发光元件和波长转换构件之间，并且覆盖波长转换构件的侧表面。 光反射构件通过粘合构件覆盖波长转换构件的侧表面。
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公开(公告)号：US20130257264A1
公开(公告)日：2013-10-03
申请号：US13852332
申请日：2013-03-28
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI , Takayoshi WAKAKI , Tadao HAYASHI , Yoshiki SATO , Daisuke OYAMATSU , Takafumi SUGIYAMA , Takao KOSUGI
IPC: H01L31/055 , H05B33/12 , B05D5/06 , F21V7/00
CPC classification number: F21V9/30 , B05D5/06 , C23C16/45525 , F21K9/60 , F21V7/00 , F21V13/08 , F21Y2115/10 , F21Y2115/30 , H01L31/055 , H01L33/502 , H01L33/505 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H05B33/12 , Y02E10/52 , Y10T428/24364 , Y10T428/24372 , Y10T428/24413 , Y10T428/24421 , H01L2924/00014
Abstract: A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.
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公开(公告)号：US20190280170A1
公开(公告)日：2019-09-12
申请号：US16270137
申请日：2019-02-07
Applicant: NICHIA CORPORATION
Inventor： Yoshiki SATO , Kazuya TAMURA
Abstract: A method for manufacturing a light emitting device includes: a substrate preparation step for preparing a substrate having a first region on which a plurality of light emitting devices are formed, and a second region surrounding the first region; a reinforcing member forming step for forming a reinforcing member by applying a resin material on the second region and hardening the resin material; a mounting step for mounting a plurality of light emitting elements on the first region; a light-transmissive member placing step for forming a plurality of light-transmissive members respectively on the light emitting elements; a sealing member forming step for sealing the plurality of light emitting elements and the plurality of light-transmissive members using a sealing member; and a cutting step for cutting. the substrate and the sealing member and separating into individual light emitting devices,
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