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1.发明授权公开(公告)号：US09755114B2
公开(公告)日：2017-09-05
申请号：US14763157
申请日：2013-12-12
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tony Albrecht , Thomas Schlereth , Albert Schneider
CPC classification number: H01L33/502 , H01L24/97 , H01L25/0753 , H01L33/0095 , H01L33/486 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/16245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2924/12041 , H01L2924/181 , H01L2924/18301 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: The invention relates to a method for producing a plurality of optoelectronic components, comprising the following steps: —providing an auxiliary support wafer (1) having contact structures (4), wherein the auxiliary support wafer comprises glass, sapphire, or a semiconductor material, —applying a plurality of radiation-emitting semiconductor bodies (5) to the contact structures (4), —encapsulating an least the contact structures (4) with a potting mass (10), and —removing the auxiliary support wafer (1). The invention further relates to an optoelectronic component.
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2.发明申请公开(公告)号：US20150233534A1
公开(公告)日：2015-08-20
申请号：US14432007
申请日：2013-09-24
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Stephan Kaiser , Tony Albrecht , Michael Bestele , Jan Marfeld , Albert Schneider , Markus Kirsch
CPC classification number: F21V14/04 , F21V7/0066 , G01J1/0414 , G01J1/42 , G01J1/4228 , H01L25/10 , H01L25/13 , H01L33/60 , H01L2924/0002 , H01L2924/00
Abstract: An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.
Abstract translation: 光电子部件装置包括提供和/或吸收电磁辐射的多个光电子部件; 布置在所述多个光电子部件的电磁辐射的光束路径中并且具有相对于所提供的电磁辐射至少部分反射的表面的反射器; 其中所述多个光电子部件至少部分地围绕所述反射器或至少部分地被所述反射器包围; 并且反射器反射所提供的电磁辐射，使得反射的电磁辐射的预定场分布形成在光电子部件装置的图像平面中。
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公开(公告)号：US20150247616A1
公开(公告)日：2015-09-03
申请号：US14430898
申请日：2013-09-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tony Albrecht , Thomas Schlereth , Roland Schulz , Christian Gaertner , Albert Schneider , Markus Kirsch , Michael Bestele , Stefan Handl
CPC classification number: F21V7/04 , F21K9/60 , F21V7/0008 , F21V9/30 , F21V13/04 , F21V13/10 , F21Y2101/00 , F21Y2103/33 , F21Y2115/10
Abstract: In at least one embodiment, the ring light module (1) comprises a plurality of optoelectronic semiconductor components (2) for producing electromagnetic radiation (R). A reflector (3) of the ring light module (1) comprises a reflective surface (30). The semiconductor components (2) are mounted on a support (4). Viewed in plan view of a main radiation side (45) of the ring light module (1), the reflector (3) comprises at most two planes of symmetry. The reflector (3) tapers in the direction towards the main radiation side (45). At least some of the main emission directions (20) of adjacent semiconductor components (2) are oriented differently from each other. The main emission directions (20) point towards the reflective surface (30).
Abstract translation: 在至少一个实施例中，环形光模块（1）包括用于产生电磁辐射（R）的多个光电子半导体部件（2）。 环形光模块（1）的反射器（3）包括反射表面（30）。 半导体部件（2）安装在支撑件（4）上。 在环形光模块（1）的主辐射侧（45）的平面图中观察，反射器（3）包括至多两个对称平面。 反射器（3）朝向主辐射侧（45）的方向逐渐变细。 相邻半导体部件（2）的主要发射方向（20）的至少一部分彼此不同。 主发射方向（20）指向反射表面（30）。
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4.发明申请公开(公告)号：US20150200138A1
公开(公告)日：2015-07-16
申请号：US14405393
申请日：2013-05-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schlereth , Michael Bestele , Christian Gaertner , Tobias Gebuhr , Hans-Christoph Gallmeier , Peter Holzer , Karlheinz Arndt , Albert Schneider
IPC: H01L21/78 , H01L23/495 , H01L21/66 , H01L21/50
CPC classification number: H01L21/78 , G01R31/2635 , H01L21/50 , H01L22/10 , H01L23/49541 , H01L23/49565 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: In one embodiment, the method is configured for producing optoelectronic semiconductor components (1) and includes the steps of: providing a leadframe assembly (20) with a multiplicity of leadframes (2), each having at least two leadframe parts (21, 22); forming at least a part of the leadframe assembly (20) with a housing material for housing bodies (4); dividing the leadframe assembly (20) between at least one part of the columns (C) and/or the rows (R), wherein the leadframes (2) remain arranged in a matrix-like manner; equipping the leadframes (2) with at least one optoelectronic semiconductor chip (3); testing at least one part of the leadframes (2) equipped with the semiconductor chips (3) and formed with the housing material after the step of dividing; and separating to form the semiconductor components (1) after the step of forming and after the step of testing.
Abstract translation: 在一个实施例中，该方法被配置用于制造光电子半导体部件（1），并且包括以下步骤：提供具有多个引线框架（2）的引线框组件（20），每个引线框架（2）具有至少两个引线框部件（21,22） ; 用用于壳体（4）的壳体材料形成所述引线框架组件（20）的至少一部分; 在所述列（C）的至少一部分和/或所述行（R）之间划分所述引线框架组件（20），其中所述引线框架（2）保持以矩阵状方式布置; 将引线框架（2）装配至少一个光电半导体芯片（3）; 测试配备有半导体芯片（3）的引线框（2）的至少一部分，并在分割步骤之后形成外壳材料; 并且在成型步骤和测试步骤之后分离形成半导体部件（1）。
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Patent Agency Ranking
公开(公告)号：US20210336101A1
公开(公告)日：2021-10-28
申请号：US17284167
申请日：2019-10-09
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Albert Schneider , Kathy Schmidtke , David Racz
Abstract: In an embodiment an optoelectronic device includes an optoelectronic component with a first main surface, a second main surface and a plurality of side surfaces interconnecting the first and second main surfaces and a conversion element arranged at the first main surface of the optoelectronic component, wherein the conversion element includes a frame of a reflective material and a conversion material located within the frame, wherein an interface between the frame and the conversion material runs slanted having an angle of smaller than 180° and larger than 90° between the interface and an adjacent side surface of the plurality of side surfaces, and wherein the frame protrudes laterally beyond a light emitting area of the first main surface of the optoelectronic component.
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公开(公告)号：US09664342B2
公开(公告)日：2017-05-30
申请号：US14432007
申请日：2013-09-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stephan Kaiser , Tony Albrecht , Michael Bestele , Jan Marfeld , Albert Schneider , Markus Kirsch
IPC: H01L31/0232 , F21K99/00 , G01J1/04 , G01J1/42 , H01L25/13 , H01L25/10 , F21V7/00 , F21V14/04 , F21Y105/00
CPC classification number: F21V14/04 , F21V7/0066 , G01J1/0414 , G01J1/42 , G01J1/4228 , H01L25/10 , H01L25/13 , H01L33/60 , H01L2924/0002 , H01L2924/00
Abstract: An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.
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公开(公告)号：US09494295B2
公开(公告)日：2016-11-15
申请号：US14430898
申请日：2013-09-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tony Albrecht , Thomas Schlereth , Roland Schulz , Christian Gaertner , Albert Schneider , Markus Kirsch , Michael Bestele , Stefan Handl
CPC classification number: F21V7/04 , F21K9/60 , F21V7/0008 , F21V9/30 , F21V13/04 , F21V13/10 , F21Y2101/00 , F21Y2103/33 , F21Y2115/10
Abstract: A ring light module having a plurality of optoelectronic semiconductor components for producing electromagnetic radiation, a reflector of the ring light module comprising a reflective surface, and a support. The semiconductor components are mounted on the support. In a plan view of a main radiation side of the ring light module, the reflector comprises at most two planes of symmetry. The reflector tapers in the direction towards the main radiation side. At least some of the main emission directions of adjacent optoelectronic semiconductor components are oriented differently from each other, and the main emission directions point towards the reflective surface.
Abstract translation: 一种环形光模块，具有用于产生电磁辐射的多个光电子半导体部件，所述环形光模块的反射器包括反射表面和支撑体。 半导体部件安装在支撑件上。 在环形灯模块的主辐射侧的平面图中，反射器至少包括两个对称平面。 反射体在朝向主辐射侧的方向上逐渐变细。 相邻光电子半导体部件的主要发射方向的至少一些取向彼此不同，并且主发射方向指向反射表面。
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公开(公告)号：US11430922B2
公开(公告)日：2022-08-30
申请号：US16479198
申请日：2018-02-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jörg Frischeisen , Angela Eberhardt , Florian Peskoller , Thomas Huckenbeck , Michael Schmidberger , Jürgen Bauer , Dominik Eisert , Albert Schneider
IPC: H01L33/50 , C09J183/04 , C09K11/02 , C09K11/08 , C09K11/77
Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a semiconductor layer sequence having an active region configured to emit radiation at least via a main radiation exit surface during operation and a self-supporting conversion element arranged in a beam path of the semiconductor layer sequence, wherein the self-supporting conversion element includes a substrate and subsequently a first layer, wherein the first layer includes at least one conversion material embedded in a matrix material, wherein the matrix material includes at least one condensed sol-gel material, wherein the condensed sol-gel material has a proportion between 10 and 70 vol % in the first layer, and wherein the substrate is free of the sol-gel material and the conversion material and mechanically stabilizes the first layer.
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公开(公告)号：US09741616B2
公开(公告)日：2017-08-22
申请号：US14405393
申请日：2013-05-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schlereth , Michael Bestele , Christian Gaertner , Tobias Gebuhr , Hans-Christoph Gallmeier , Peter Holzer , Karlheinz Arndt , Albert Schneider
IPC: G01R31/27 , H01L21/78 , H01L33/00 , H01L33/62 , H01L21/50 , H01L21/66 , G01R31/26 , H01L33/48 , H01L23/495
CPC classification number: H01L21/78 , G01R31/2635 , H01L21/50 , H01L22/10 , H01L23/49541 , H01L23/49565 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: In one embodiment, the method is configured for producing optoelectronic semiconductor components (1) and includes the steps of: providing a leadframe assembly (20) with a multiplicity of leadframes (2), each having at least two leadframe parts (21, 22); forming at least a part of the leadframe assembly (20) with a housing material for housing bodies (4); dividing the leadframe assembly (20) between at least one part of the columns (C) and/or the rows (R), wherein the leadframes (2) remain arranged in a matrix-like manner; equipping the leadframes (2) with at least one optoelectronic semiconductor chip (3); testing at least one part of the leadframes (2) equipped with the semiconductor chips (3) and formed with the housing material after the step of dividing; and separating to form the semiconductor components (1) after the step of forming and after the step of testing.
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