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    Method for producing a plurality of radiation-emitting semiconductor chips
    1.
    发明授权
    Method for producing a plurality of radiation-emitting semiconductor chips 有权
    用于制造多个辐射发射半导体芯片的方法

    公开(公告)号：US09590151B2

    公开(公告)日：2017-03-07

    申请号：US14785620

    申请日：2014-04-14

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Richter ,  Alexander Baumgartner ,  Hans-Christoph Gallmeier ,  Tony Albrecht

    IPC: H01L33/50 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60

    CPC classification number: H01L33/507 ,  H01L33/0095 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

    Abstract: A method is provided for producing a plurality of radiation-emitting semiconductor chips, having the following steps: providing a plurality of semiconductor bodies (1) which are suitable for emitting electromagnetic radiation from a radiation exit face (3), applying the semiconductor bodies (1) to a carrier (2), applying a first mask layer (4) to regions of the carrier (2) between the semiconductor bodies (1), applying a conversion layer (5) to the entire surface of the semiconductor bodies (1) and the first mask layer (4) using a spray coating method, and removing the first mask layer (4), such that in each case a conversion layer (5) arises on the radiation exit faces (3) of the semiconductor bodies (1).

    Abstract translation: 提供了一种用于制造多个辐射发射半导体芯片的方法，具有以下步骤：提供适于从辐射出射面（3）发射电磁辐射的多个半导体本体（1），施加半导体本体（ 1）到载体（2）上，在半导体体（1）之间的载体（2）的区域上施加第一掩模层（4），在半导体本体（1）的整个表面上施加转换层 ）和第一掩模层（4），并且去除第一掩模层（4），使得在每种情况下，在半导体主体的辐射出射面（3）上出现转换层（5） 1）。

    RING LIGHT MODULE
    2.
    发明申请
    RING LIGHT MODULE 有权
    环形灯模块

    公开(公告)号：US20150247616A1

    公开(公告)日：2015-09-03

    申请号：US14430898

    申请日：2013-09-17

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tony Albrecht ,  Thomas Schlereth ,  Roland Schulz ,  Christian Gaertner ,  Albert Schneider ,  Markus Kirsch ,  Michael Bestele ,  Stefan Handl

    IPC: F21V7/04 ,  F21K99/00 ,  F21V13/04 ,  F21V7/00 ,  F21V13/10

    CPC classification number: F21V7/04 ,  F21K9/60 ,  F21V7/0008 ,  F21V9/30 ,  F21V13/04 ,  F21V13/10 ,  F21Y2101/00 ,  F21Y2103/33 ,  F21Y2115/10

    Abstract: In at least one embodiment, the ring light module (1) comprises a plurality of optoelectronic semiconductor components (2) for producing electromagnetic radiation (R). A reflector (3) of the ring light module (1) comprises a reflective surface (30). The semiconductor components (2) are mounted on a support (4). Viewed in plan view of a main radiation side (45) of the ring light module (1), the reflector (3) comprises at most two planes of symmetry. The reflector (3) tapers in the direction towards the main radiation side (45). At least some of the main emission directions (20) of adjacent semiconductor components (2) are oriented differently from each other. The main emission directions (20) point towards the reflective surface (30).

    Abstract translation: 在至少一个实施例中，环形光模块（1）包括用于产生电磁辐射（R）的多个光电子半导体部件（2）。 环形光模块（1）的反射器（3）包括反射表面（30）。 半导体部件（2）安装在支撑件（4）上。 在环形光模块（1）的主辐射侧（45）的平面图中观察，反射器（3）包括至多两个对称平面。 反射器（3）朝向主辐射侧（45）的方向逐渐变细。 相邻半导体部件（2）的主要发射方向（20）的至少一部分彼此不同。 主发射方向（20）指向反射表面（30）。

    OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT
    4.
    发明申请
    OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190157522A1

    公开(公告)日：2019-05-23

    申请号：US16097769

    申请日：2017-05-10

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tony Albrecht ,  Tamas Lamfalusi ,  Christian Gatzhammer

    IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L33/00

    Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including a first potting body; and a second potting body, wherein the first potting body covers all lateral side surfaces and a top surface of the semiconductor chip, the first potting body has a bottom surface flush with a connection surface of the semiconductor chip, the second potting body has a bottom surface flush with the bottom surface of the first potting body, the second potting body completely covers all side surfaces of the first potting body facing away from the semiconductor chip, a top surface of the second potting body on the opposite of the connection surface is convexly curved, and the optoelectronic semiconductor chip has exclusively on its connection surface exposed electrical contact surfaces via which the semiconductor chip is electrically connectable and operable.

    Monolithic semiconductor chip array
    7.
    发明授权
    Monolithic semiconductor chip array 有权
    单片半导体芯片阵列

    公开(公告)号：US09379161B2

    公开(公告)日：2016-06-28

    申请号：US14767245

    申请日：2014-02-05

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas Schlereth ,  Markus Kirsch ,  Christian Gaertner ,  Tony Albrecht

    IPC: H01L27/15 ,  H01L33/38 ,  H01L33/14 ,  H01L33/62 ,  H01L33/48 ,  H01L33/40 ,  H01L33/44

    CPC classification number: H01L27/156 ,  H01L33/14 ,  H01L33/382 ,  H01L33/405 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor chip (10) is provided which comprises: a semiconductor layer sequence (20) with a p-type semiconductor region (5) and an n-type semiconductor region (3), a plurality of p-contacts (11a, 11b), which are connected electrically conductively with the p-type semiconductor region (5), and a plurality of n-contacts (12a, 12b), which are connected electrically conductively with the n-type semiconductor region (3), wherein: the p-contacts (11a, 11b) and the n-contacts (12a, 12b) are arranged on a rear side of the semiconductor chip (10), the semiconductor chip (10) comprises a plurality of regions (21, 22) arranged adjacent one another, and the regions (21, 22) each comprise one of the p-contacts (11a, 11b) and one of the n-contacts (12a, 12b).

    Abstract translation: 提供一种半导体芯片（10），其包括：具有p型半导体区域（5）和n型半导体区域（3）的半导体层序列（20），多个p型触点（11a，11b） ，其与p型半导体区域（5）电连接，以及与n型半导体区域（3）导电连接的多个n型触点（12a，12b），其中：p 所述半导体芯片（10）包括与所述半导体芯片（10）相邻的多个区域（21,22），所述半导体芯片（10）具有与所述半导体芯片（10）相邻的多个区域（21,22） 另一个，并且区域（21,22）各自包括p触点（11a，11b）中的一个和n触点（12a，12b）中的一个。

    Ring light module
    10.
    发明授权
    Ring light module 有权
    环形灯模块

    公开(公告)号：US09494295B2

    公开(公告)日：2016-11-15

    申请号：US14430898

    申请日：2013-09-17

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tony Albrecht ,  Thomas Schlereth ,  Roland Schulz ,  Christian Gaertner ,  Albert Schneider ,  Markus Kirsch ,  Michael Bestele ,  Stefan Handl

    IPC: F21V7/04 ,  F21K99/00 ,  F21V13/04 ,  F21V7/00 ,  F21V13/10 ,  F21V9/16 ,  F21Y101/00

    CPC classification number: F21V7/04 ,  F21K9/60 ,  F21V7/0008 ,  F21V9/30 ,  F21V13/04 ,  F21V13/10 ,  F21Y2101/00 ,  F21Y2103/33 ,  F21Y2115/10

    Abstract: A ring light module having a plurality of optoelectronic semiconductor components for producing electromagnetic radiation, a reflector of the ring light module comprising a reflective surface, and a support. The semiconductor components are mounted on the support. In a plan view of a main radiation side of the ring light module, the reflector comprises at most two planes of symmetry. The reflector tapers in the direction towards the main radiation side. At least some of the main emission directions of adjacent optoelectronic semiconductor components are oriented differently from each other, and the main emission directions point towards the reflective surface.

    Abstract translation: 一种环形光模块，具有用于产生电磁辐射的多个光电子半导体部件，所述环形光模块的反射器包括反射表面和支撑体。 半导体部件安装在支撑件上。 在环形灯模块的主辐射侧的平面图中，反射器至少包括两个对称平面。 反射体在朝向主辐射侧的方向上逐渐变细。 相邻光电子半导体部件的主要发射方向的至少一些取向彼此不同，并且主发射方向指向反射表面。

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