公开(公告)号：US09736939B2

公开(公告)日：2017-08-15

申请号：US14848907

申请日：2015-09-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Suk Hyeon Cho ,  Yong Ho Baek ,  Young Gwan Ko ,  Yoong Oh ,  Young Kuk Ko

IPC: H05K3/46 ,  H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K1/0271 ,  H05K3/007 ,  H05K3/422 ,  H05K3/4605 ,  H05K3/4608 ,  H05K3/4682 ,  H05K2201/09827

Abstract: A printed circuit board may include: a first circuit layer; a first insulating layer disposed on the first circuit layer; a high-rigidity layer disposed on the first insulating layer; and a second circuit layer disposed on the high-rigidity layer and connected to the first circuit layer by a first via extending through the first insulating layer and the high-rigidity layer, wherein a rigidity of the high-rigidity layer is greater than a rigidity of the first insulating layer.

公开(公告)号：US09490056B2

公开(公告)日：2016-11-08

申请号：US14289302

申请日：2014-05-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Min Lee ,  Geun Young Park ,  Sang Yun Lee ,  Jae Sun Won ,  Suk Hyeon Cho ,  Tae Won Heo

IPC: H01F17/04 ,  H01F5/00 ,  H01F17/00 ,  H01F17/06

CPC classification number: H01F17/0013 ,  H01F17/0033 ,  H01F17/062

Abstract: A coil component may include: a base board having an accommodation portion disposed therein and having conductive patterns disposed within the accommodation portion; an annular core disposed in the accommodation portion; and a laminated board laminated on the base board and having conductive patterns disposed on one surface thereof. The conductive patterns of the laminated board are connected to the conductive patterns of the base board to form a coil.

Abstract translation: 线圈部件可以包括：基板，其具有设置在其中的容纳部分，并且具有布置在容纳部分内的导电图案; 设置在容纳部中的环状芯体; 以及叠层在基板上并且具有设置在其一个表面上的导电图案的层压板。 层压板的导电图案连接到基板的导电图案以形成线圈。

公开(公告)号：US20140151095A1

公开(公告)日：2014-06-05

申请号：US14097036

申请日：2013-12-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon Cho ,  Tae Hong Min ,  Seung Yeop Kook ,  Jung Han Lee ,  Hye Jin Kim

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/28

CPC classification number: H05K1/0306 ,  H05K1/03 ,  H05K3/108 ,  H05K3/426 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09563 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet.

Abstract translation: 这里公开了一种印刷电路板，包括：复合片，其包括绝缘材料和与绝缘材料接合的玻璃板; 以及形成在复合片上的电路层。

公开(公告)号：US20140027047A1

公开(公告)日：2014-01-30

申请号：US14042616

申请日：2013-09-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Joon LEE ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

IPC: H05K3/00

CPC classification number: H05K3/007 ,  B32B3/10 ,  B32B3/14 ,  B32B3/18 ,  B32B7/04 ,  B32B15/00 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/205 ,  H05K2201/0355 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/12 ,  Y10T428/12229 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/161 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/239 ,  Y10T428/24917

Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

Abstract translation: 公开了一种用于制造印刷电路板的载体，其包括第一载体，其包括具有第一开口的第一粘合剂和形成在第一粘合剂的第一开口中的第一金属层，以及与第一载体堆叠的第二载体， 包括具有第二开口的第二粘合剂和形成在第二粘合剂的第二开口中并且与第一金属层部分重叠的第二金属层，使得载体被简单地构造，并且粘结剂不仅形成在 金属层的侧面，也在其上表面，从而提高载体在周边的接合的可靠性。 还提供了制造载体的方法和使用该载体制造印刷电路板的方法。

公开(公告)号：US10045436B2

公开(公告)日：2018-08-07

申请号：US14537998

申请日：2014-11-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon Cho ,  Hyo Seung Nam ,  Yong Sam Lee ,  Seok Hwan Ahn

IPC: H05K1/02 ,  H05K3/42 ,  H05K3/00 ,  H05K3/46 ,  H05K1/11 ,  H05K1/03 ,  H01L23/00

Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.

公开(公告)号：US09736927B2

公开(公告)日：2017-08-15

申请号：US14875241

申请日：2015-10-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Suk Hyeon Cho ,  Yoong Oh ,  Young Gwan Ko ,  Yong Ho Baek ,  Young Kuk Ko

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0271 ,  H01L2224/16227 ,  H01L2924/15313 ,  H01L2924/15788 ,  H05K1/038 ,  H05K1/115 ,  H05K1/181 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0909 ,  H05K2201/09536 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10674

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.

公开(公告)号：US20150101851A1

公开(公告)日：2015-04-16

申请号：US14459320

申请日：2014-08-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Gwan Ko ,  Tae Hong Min ,  Sang Hoon Kim ,  Suk Hyeon Cho

IPC: H05K1/03 ,  C03B27/04 ,  H05K3/44 ,  H05K1/02 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/0306 ,  C03B27/04 ,  C03C21/002 ,  H05K1/0271 ,  H05K3/4605 ,  H05K2201/017

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes an insulating layer including a glass core and a tempering treatment layer formed on one surface of the glass core, such that a problem about warpage may be minimized and an effect capable of thinning the printed circuit board may be achieved.

Abstract translation: 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例的印刷电路板包括包括玻璃芯和形成在玻璃芯的一个表面上的回火处理层的绝缘层，使得可以使翘曲的问题最小化并且能够变薄的效果 可以实现印刷电路板。

公开(公告)号：US20150173197A1

公开(公告)日：2015-06-18

申请号：US14453289

申请日：2014-08-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon Cho ,  Yong Sam Lee ,  Jin O Yoo

IPC: H05K1/18 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F41/046 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49075

Abstract: A printed circuit board having an inductor embedded therein may include a conductive coil part embedded in an insulating layer; and a magnetic material part integrally formed so as to enclose a vicinity of the conductive coil part. In the printed circuit board having the inductor embedded therein, a gap between coils is narrowed and coils having a high height and a narrow width are formed, whereby resistance may be decreased and a higher inductance value may be implemented in a narrow area.

Abstract translation: 具有嵌入其中的电感器的印刷电路板可以包括嵌入在绝缘层中的导电线圈部分; 以及整体形成为包围导电线圈部分附近的磁性材料部分。 在具有嵌入其中的电感器的印刷电路板中，线圈之间的间隙变窄，并且形成具有高高度和窄宽度的线圈，从而可以减小电阻并且可以在较窄的区域中实现更高的电感值。

公开(公告)号：US20150114553A1

公开(公告)日：2015-04-30

申请号：US14460434

申请日：2014-08-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hong MIN ,  Suk Hyeon Cho ,  Sang Hoon Kim ,  Hye Jin Kim ,  Young Gwan Ko ,  Jung Han Lee

IPC: H05K3/00 ,  B32B38/10 ,  B32B37/18 ,  B32B38/00

CPC classification number: B32B37/18 ,  B32B38/0004 ,  B32B38/0008 ,  B32B38/0036 ,  B32B38/10 ,  B32B2311/12 ,  B32B2315/08 ,  B32B2457/08 ,  H01L21/481 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/022 ,  H05K3/4605 ,  H05K2203/1545 ,  H01L2924/00

Abstract: Disclosed herein is a method of manufacturing a glass core capable of continuously manufacturing the glass core by an automated process. The method includes: providing a glass sheet; laminating an insulating sheet on the glass sheet; laminating a copper clad sheet on the insulating sheet to manufacture the glass core; laminating a buffering sheet on the copper clad sheet; pressing and temporarily hardening the buffering sheet; delaminating the temporarily hardened buffering sheet; thermally hardening the glass core by a heater after the delaminating of the temporarily hardened buffering sheet; and cutting the glass core at a predetermined size after the thermal hardening of the glass core.

Abstract translation: 本文公开了一种制造能够通过自动化方法连续制造玻璃核心的玻璃核心的方法。 该方法包括：提供玻璃板; 在玻璃板上层叠绝缘片; 在绝缘片上层叠铜箔片以制造玻璃芯; 将缓冲片层压在铜包覆片上; 按压并暂时硬化缓冲片; 剥离临时硬化的缓冲片; 在暂时硬化的缓冲片分层之后，通过加热器对玻璃芯进行热硬化; 并且在玻璃芯的热硬化之后将玻璃芯切割成预定尺寸。

公开(公告)号：US20150107880A1

公开(公告)日：2015-04-23

申请号：US14319743

申请日：2014-06-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin KIM ,  Hyo Seung Nam ,  Tae Hong Min ,  Sang Hoon Kim ,  Suk Hyeon Cho ,  Jung Han Lee

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/185 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/0979

Abstract: Disclosed herein is a multilayer printed circuit board. The multilayer printed circuit board according to the present invention includes: a stack via stacked in an upper portion of a core layer; staggered vias formed at both sides of the stack via and stacked on the core layer; and a solder resist layer stacked in a lower portion of the core layer and stacked on an insulating film except for open regions of the stack via and the staggered vias, such that the plurality of vias formed in the staggered via may increase rigidity to prevent warpage of the multilayer printed circuit board from being generated.

Abstract translation: 这里公开了一种多层印刷电路板。 根据本发明的多层印刷电路板包括：堆叠体，堆叠在芯层的上部; 形成在堆叠的两侧的交错通孔并堆叠在芯层上; 以及堆叠在芯层的下部并且堆叠在除了堆叠通孔的开口区域和交错通孔之外的绝缘膜上的阻焊层，使得形成在交错通孔中的多个通孔可以增加刚性以防止翘曲 的多层印刷电路板。