公开(公告)号：US06621169B2

公开(公告)日：2003-09-16

申请号：US09940625

申请日：2001-08-29

申请人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Tadashi Uno ,  Takao Nishimura ,  Fumihiko Ando ,  Hiroshi Onodera ,  Hayato Okuda

发明人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Tadashi Uno ,  Takao Nishimura ,  Fumihiko Ando ,  Hiroshi Onodera ,  Hayato Okuda

IPC分类号： H01L2358

CPC分类号： H01L25/0652 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

公开(公告)号：US06781241B2

公开(公告)日：2004-08-24

申请号：US10272013

申请日：2002-10-17

申请人： Takao Nishimura ,  Tadashi Uno ,  Hiroshi Onodera ,  Akira Takashima

发明人： Takao Nishimura ,  Tadashi Uno ,  Hiroshi Onodera ,  Akira Takashima

IPC分类号： H01L2940

CPC分类号： H01L25/03 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A stacked-type semiconductor device has a reduced overall height and an improved reliability in the mechanical strength of the stacked structure. The semiconductor device also has an improved heat release characteristic. A first interposer has a surface on which first electrode pads are formed and a first semiconductor element is mounted with a circuit forming surface facing the first interposer. A second interposer has a surface on which second electrode pads are formed and a second semiconductor element is mounted with a circuit forming surface facing the second interposer. External connection terminals are provided on a surface of the second interposer opposite to the surface on which the second semiconductor element is mounted. The first and second interposers are electrically connected to each other by conductive members provided therebetween. A back surface of the first semiconductor element and a back surface of the second semiconductor element are fixed to each other by an adhesive.

摘要翻译： 叠层型半导体器件具有降低的整体高度和提高层叠结构的机械强度的可靠性。 该半导体器件还具有改善的放热特性。 第一插入件具有其上形成有第一电极焊盘的表面，并且第一半导体元件安装有面向第一插入件的电路形成表面。 第二插入件具有其上形成有第二电极焊盘的表面，并且第二半导体元件安装有面向第二插入件的电路形成表面。 外部连接端子设置在与安装有第二半导体元件的表面相对的第二插入件的表面上。 第一和第二插入件通过设置在它们之间的导电构件彼此电连接。 第一半导体元件的背面和第二半导体元件的背面通过粘合剂彼此固定。

公开(公告)号：US06960827B2

公开(公告)日：2005-11-01

申请号：US10817808

申请日：2004-04-06

申请人： Takao Nishimura ,  Tadashi Uno ,  Hiroshi Onodera ,  Akira Takashima

发明人： Takao Nishimura ,  Tadashi Uno ,  Hiroshi Onodera ,  Akira Takashima

IPC分类号： H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/11 ,  H01L23/34

CPC分类号： H01L25/03 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A stacked-type semiconductor device has a reduced overall height and an improved reliability in the mechanical strength of the stacked structure. The semiconductor device also has an improved heat release characteristic. A first interposer has a surface on which first electrode pads are formed and a first semiconductor element is mounted with a circuit forming surface facing the first interposer. A second interposer has a surface on which second electrode pads are formed and a second semiconductor element is mounted with a circuit forming surface facing the second interposer. External connection terminals are provided on a surface of the second interposer opposite to the surface on which the second semiconductor element is mounted. The first and second interposers are electrically connected to each other by conductive members provided therebetween. A back surface of the first semiconductor element and a back surface of the second semiconductor element are fixed to each other by an adhesive.

摘要翻译： 叠层型半导体器件具有降低的整体高度和提高层叠结构的机械强度的可靠性。 该半导体器件还具有改善的放热特性。 第一插入件具有其上形成有第一电极焊盘的表面，并且第一半导体元件安装有面向第一插入件的电路形成表面。 第二插入件具有其上形成有第二电极焊盘的表面，并且第二半导体元件安装有面向第二插入件的电路形成表面。 外部连接端子设置在与安装有第二半导体元件的表面相对的第二插入件的表面上。 第一和第二插入件通过设置在它们之间的导电构件彼此电连接。 第一半导体元件的背面和第二半导体元件的背面通过粘合剂彼此固定。

公开(公告)号：US06388333B1

公开(公告)日：2002-05-14

申请号：US09605687

申请日：2000-06-27

申请人： Fumihiko Taniguchi ,  Kouhei Orikawa ,  Tadashi Uno ,  Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

发明人： Fumihiko Taniguchi ,  Kouhei Orikawa ,  Tadashi Uno ,  Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

IPC分类号： H01L2940

CPC分类号： H01L25/50 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06593 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of semiconductor devices can be mounted on a mounting board in a three-dimensional structure by stacking one on another with a simple structure. A semiconductor element is mounted on a first surface of an interposer. Electrode pads connected to the semiconductor element are arranged around the semiconductor element on the first surface of the interposer. Protruding electrodes are provided on the respective electrode pads. Through holes are formed in the interposer so as to extend from a second surface opposite to the first surface of the redistribution substrate to the respective electrode pads. The semiconductor element is encapsulated by a seal resin. Each of the protruding electrodes is higher than the sealed portion of the semiconductor element.

摘要翻译： 多个半导体器件可以通过以简单的结构彼此堆叠而以三维结构安装在安装板上。 半导体元件安装在插入件的第一表面上。 连接到半导体元件的电极焊盘围绕该中介层的第一表面上的半导体元件布置。 突出电极设置在相应的电极焊盘上。 在插入器中形成通孔，从与再分布基板的第一表面相反的第二表面延伸到相应的电极焊盘。 半导体元件由密封树脂封装。 每个突出电极比半导体元件的密封部分高。

公开(公告)号：US06528348B2

公开(公告)日：2003-03-04

申请号：US10076580

申请日：2002-02-19

申请人： Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

发明人： Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

IPC分类号： H01L2940

CPC分类号： H01L25/50 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06593 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of semiconductor devices can be mounted on a mounting board in a three-dimensional structure by stacking one on another with a simple structure. A semiconductor element is mounted on a first surface of an interposer. Electrode pads connected to the semiconductor element are arranged around the semiconductor element on the first surface of the interposer. Protruding electrodes are provided on the respective electrode pads. Through holes are formed in the interposer so as to extend from a second surface opposite to the first surface of the redistribution substrate to the respective electrode pads. The semiconductor element is encapsulated by a seal resin. Each of the protruding electrodes is higher than the sealed portion of the semiconductor element.

公开(公告)号：US08820938B2

公开(公告)日：2014-09-02

申请号：US13069993

申请日：2011-03-23

申请人： Kazuhiro Tanaka ,  Hiroshi Yamanoi ,  Michiko Yamasaki ,  Hiroshi Onodera ,  Yuichiro Iwama ,  Toshizo Nishi

发明人： Kazuhiro Tanaka ,  Hiroshi Yamanoi ,  Michiko Yamasaki ,  Hiroshi Onodera ,  Yuichiro Iwama ,  Toshizo Nishi

IPC分类号： G03B21/16 ,  F21V29/02 ,  F21V29/00 ,  G03B21/20

CPC分类号： F21V29/83 ,  F21V29/02 ,  F21V29/67 ,  F21V29/677 ,  G03B21/16 ,  G03B21/2006 ,  G03B21/2093

摘要： A light source device includes: an arc tube having a light emission portion containing a pair of electrodes and configured to emit light by discharges induced between the pair of the electrodes; and a container body that accommodates the arc tube, the container body has a space in which the arc tube is accommodated, and a plurality of openings through that cooling fluids introduced from the outside of the container body are supplied into the space, the plural openings are formed at positions that allow the cooling fluids passing through the openings to collide with each other at a collision position above the light emission portion.

摘要翻译： 光源装置包括：发光管，具有包含一对电极的发光部，并且被配置为通过在所述一对电极之间感应的放电来发光; 以及收纳电弧管的容器主体，容器主体具有容纳电弧管的空间，通过从容器主体的外部导入的冷却流体供给多个开口，多个开口 形成在允许通过开口的冷却流体在发光部分上方的碰撞位置处彼此碰撞的位置处。

公开(公告)号：US20100103382A1

公开(公告)日：2010-04-29

申请号：US12578983

申请日：2009-10-14

申请人： Hiroshi Onodera ,  Takahiro Takizawa

发明人： Hiroshi Onodera ,  Takahiro Takizawa

IPC分类号： G03B21/16 ,  H01J61/52

CPC分类号： H01J61/523 ,  G03B21/16 ,  G03B21/2026 ,  G03B21/2066 ,  H01J61/025 ,  H01J61/526 ,  H01J61/86 ,  H04N9/3144

摘要： A light source device includes: an arc tube having a light emission portion; a first reflection mirror having a substantially concave surface for reflecting light emitted from the light emission portion; and a container which accommodates the arc tube and the first reflection mirror, wherein the container has a duct unit disposed above the arc tube. The duct unit includes a first opening open to the arc tube and disposed at a position shifted toward the traveling direction side from an opening end of the first reflection mirror, a wall portion which forms the edge of the first opening on the side opposite to the traveling direction side as a final end of the duct unit, and an inclined portion disposed in the vicinity of the edge of the first opening on the traveling direction side to bend the flowing direction of the cooling air toward the surface opposite to the surface having the first opening.

摘要翻译： 光源装置包括：具有发光部的电弧管; 第一反射镜，其具有用于反射从所述发光部发射的光的基本上凹的表面; 以及容纳所述电弧管和所述第一反射镜的容器，其中，所述容器具有设置在所述电弧管上方的管道单元。 所述管道单元包括：开口到所述电弧管的第一开口，并且设置在从所述第一反射镜的开口端朝向所述行进方向侧偏移的位置;壁部，其在与所述第一反射镜相反的一侧形成所述第一开口的边缘; 行进方向侧作为管道单元的最终端，以及倾斜部，其设置在行进方向侧的第一开口的边缘附近，以使冷却空气的流动方向朝向与具有 第一次开放

公开(公告)号：US08408714B2

公开(公告)日：2013-04-02

申请号：US12578983

申请日：2009-10-14

申请人： Hiroshi Onodera ,  Takahiro Takizawa

发明人： Hiroshi Onodera ,  Takahiro Takizawa

IPC分类号： G03B21/16 ,  G03B21/18 ,  G03B21/26 ,  F21V29/00 ,  B60Q1/06

CPC分类号： H01J61/523 ,  G03B21/16 ,  G03B21/2026 ,  G03B21/2066 ,  H01J61/025 ,  H01J61/526 ,  H01J61/86 ,  H04N9/3144

摘要： A light source device includes: an arc tube having a light emission portion; a first reflection mirror having a substantially concave surface for reflecting light emitted from the light emission portion; and a container which accommodates the arc tube and the first reflection mirror, wherein the container has a duct unit disposed above the arc tube. The duct unit includes a first opening open to the arc tube and disposed at a position shifted toward the traveling direction side from an opening end of the first reflection mirror, a wall portion which forms the edge of the first opening on the side opposite to the traveling direction side as a final end of the duct unit, and an inclined portion disposed in the vicinity of the edge of the first opening on the traveling direction side to bend the flowing direction of the cooling air toward the surface opposite to the surface having the first opening.

摘要翻译： 光源装置包括：具有发光部的电弧管; 第一反射镜，其具有用于反射从所述发光部发射的光的基本上凹的表面; 以及容纳所述电弧管和所述第一反射镜的容器，其中，所述容器具有设置在所述电弧管上方的管道单元。 所述管道单元包括：开口到所述电弧管的第一开口，并且设置在从所述第一反射镜的开口端朝向所述行进方向侧偏移的位置;壁部，其在与所述第一反射镜相反的一侧形成所述第一开口的边缘; 行进方向侧作为管道单元的最终端，以及倾斜部，其设置在行进方向侧的第一开口的边缘附近，以使冷却空气的流动方向朝向与具有 第一次开放

公开(公告)号：US09120176B2

公开(公告)日：2015-09-01

申请号：US13878579

申请日：2011-10-21

申请人： Harumi Nishiyama ,  Hiroshi Onodera ,  Masaki Adachi ,  Toshinori Abe

发明人： Harumi Nishiyama ,  Hiroshi Onodera ,  Masaki Adachi ,  Toshinori Abe

IPC分类号： B23K26/10 ,  B23K37/04 ,  B23K26/02 ,  B23K26/08 ,  B23K26/38 ,  B23K37/02 ,  B23K37/053

CPC分类号： B23K26/02 ,  B23K26/0823 ,  B23K26/0876 ,  B23K26/10 ,  B23K26/38 ,  B23K37/0235 ,  B23K37/04 ,  B23K37/0435 ,  B23K37/0533 ,  B23K2101/10 ,  B23K2101/28 ,  B23K2103/04

摘要： A laser processing machine includes a work head, a plate-like work working table for processing a plate-like work, a rod-like work working table including a rod-like work holder for processing a rod-like work, and a work area in which the work head is movably provided. The plate-like work working table is provided movably from one side of the work area into the work area. The rod-like work working table is provided movably from another side of the work area into the work area that is opposite side of the one side. According to the laser processing machine, when switching over between a processing of a plate-like work and a processing of a rod-like work, it is needed only to move/evacuate the plate-like work working table and the rod-like work working table to/from the work area, so that the switching-over operation can be easily done.

摘要翻译： 激光加工机包括工作头，用于加工板状工件的板状工作台，包括用于处理棒状工件的杆状工件保持器的杆状作业工作台和工作区域 其中工作头可移动地设置。 板状工作台从工作区域的一侧可移动地设置到工作区域。 杆状作业工作台从工作区域的另一侧可移动地设置到与一侧相对的工作区域。 根据激光加工机，在板状工件的加工与棒状加工之间进行切换时，仅需要移动/抽出板状工作台和棒状工件 工作台往返于工作区，从而可以轻松完成切换操作。

公开(公告)号：US20130193125A1

公开(公告)日：2013-08-01

申请号：US13878579

申请日：2011-10-21

申请人： Harumi Nishiyama ,  Hiroshi Onodera ,  Masaki Adachi ,  Toshinori Abe

发明人： Harumi Nishiyama ,  Hiroshi Onodera ,  Masaki Adachi ,  Toshinori Abe

IPC分类号： B23K26/02

CPC分类号： B23K26/02 ,  B23K26/0823 ,  B23K26/0876 ,  B23K26/10 ,  B23K26/38 ,  B23K37/0235 ,  B23K37/04 ,  B23K37/0435 ,  B23K37/0533 ,  B23K2101/10 ,  B23K2101/28 ,  B23K2103/04

摘要： A laser processing machine includes a work head, a plate-like work working table for processing a plate-like work, a rod-like work working table including a rod-like work holder for processing a rod-like work, and a work area in which the work head is movably provided. The plate-like work working table is provided movably from one side of the work area into the work area. The rod-like work working table is provided movably from another side of the work area into the work area that is opposite side of the one side. According to the laser processing machine, when switching over between a processing of a plate-like work and a processing of a rod-like work, it is needed only to move/evacuate the plate-like work working table and the rod-like work working table to/from the work area, so that the switching-over operation can be easily done.

摘要翻译： 激光加工机包括工作头，用于加工板状工件的板状工作台，包括用于处理棒状工件的杆状工件保持器的杆状作业工作台和工作区域 其中工作头可移动地设置。 板状工作台从工作区域的一侧可移动地设置到工作区域。 杆状作业工作台从工作区域的另一侧可移动地设置到与一侧相对的工作区域。 根据激光加工机，在板状工件的加工与棒状加工之间进行切换时，仅需要移动/抽出板状工作台和棒状工件 工作台往返于工作区，从而可以轻松完成切换操作。