Abstract:
A mounting structure for a bumper rail of a front end module carrier for a vehicle includes an upper horizontal member that supports an upper portion of the carrier; a lower horizontal member that supports a lower portion of the carrier; left and right vertical members and that are formed with fastening holes and connect respective left and right sides of the upper and lower horizontal members to each other to support side portions of the carrier; and a bumper rail formed to be convexly curved forward and fixedly fastened to side rail members located at rear ends of the left and right vertical members and by bolts through the fastening holes. Each of the fastening holes includes a seating hole portion that receives and confines the bolt therein and a guide hole portion laterally extending from the seating hole portion.
Abstract:
The present invention relates to an invisible passenger airbag door, and more particularly, to an invisible passenger airbag door that is constructed by defining an incision portion through processing of micro holes on an instrument panel. In the invisible passenger airbag door, an incision portion is constructed at a portion of an instrument panel where a passenger airbag is installed, by processing micro holes at a corresponding portion of an inner surface of the instrument panel to conform to an outer contour of the passenger airbag. The micro holes constructing the incision portion are filled with a filling material that comprises fine particles with no viscosity.
Abstract:
An electrical interconnect structure on a substrate, includes a first porous dielectric layer with surface region from which a porogen has been removed; and an etch stop layer disposed upon the first porous dielectric layer so that the etch stop layer extends to partially fill pores in the surface region of the first porous dielectric layer from which the porogen has been removed, thus improving adhesion during subsequent processing. The porogen may be removed from the surface region by heating, and in particular by hot plate baking. A second porous dielectric layer, which may have the same composition as the first porous dielectric layer, may be formed over the etch stop layer. Electrical vias and lines may be formed in the first and second porous dielectric layer, respectively. The layers may be part of a multilayer stack, wherein all of the layers are cured simultaneously in a spin application tool porous dielectric layer.
Abstract:
An upper tray mounted on an instrument panel of a vehicle includes a receiving member mounted on an upper portion of the instrument panel. A hinge member is movably attached to the receiving member. A cover member is joined to the hinge member to rotate about a fixed pivot and configured to close the receiving member. A coil spring connects the hinge member with the receiving member. The coil spring is configured to provide a force in a direction that the cover member opens.
Abstract:
An alignment-film in which the pretilt angle is changed by ultraviolet irradiation, a material for forming the same, a liquid crystal display device using the alignment film, a method for producing an alignment-film formation material, and a method for producing an alignment film. Ultraviolet irradiation causes large changes in pretilt angle but few changes in electrical characteristics, and a liquid crystal display device free from deterioration of the liquid crystal, image sticking, or the occurrence of flicker results. A first polymer forms the underlying principal layer and a second polymer forms thereon a surface layer thinner than the principal layer. The first polymer may exhibit a small change in electrical characteristics due to ultraviolet radiation and the second polymer may exhibit a large change in pretilt angle due to ultraviolet radiation.
Abstract:
The surface of a substrate made of substantially crystalline polyimide is converted to form a layer of substantially amorphous polyimide. The substantially amorphous layer is formed by treating the crystalline polimide surface with a base followed by treatment with an acid to form a polyamic acid layer, which is reimidized to form a substantially amorphous layer by a low temperature heat cycle. Metals or polyimides can be deposited onto this amorphous layer, which is then cured to convert the amorphous layer to substantially crystalline polyimide. This process enhances the adhesion of the metal or polyimide layer without introducing contamination (new foreign materials or new functional groups) from surface treatments of adhesion layers.
Abstract:
The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
Abstract:
The present invention is directed to flux compositions. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups.
Abstract:
A compressor is provided in which a rotary member suspended on a stationary member is rotated to compress a refrigerant. The rotary member is suspended on a first stationary member and rotatably supported on a second stationary member spaced apart from the first stationary member, which achieves the structural stability and allows the components to be easily centered and assembled. A refrigerant suction passage and a refrigerant discharge passage are such that the refrigerant may be sucked and discharged without a valve.
Abstract:
Methods of forming an integrated circuit device include forming an interlayer dielectric layer on a first surface of a semiconductor substrate and then forming an interconnect hole that extends through the interlayer dielectric layer and into the semiconductor substrate. A first sidewall spacer layer is formed on a sidewall of the interconnect hole. The semiconductor substrate at a bottom of the interconnect hole is isotropically etched to define an undercut recess in the semiconductor substrate. This etching step is performed using the first sidewall spacer layer as an etching mask. The interconnect hole and the uncut recess are then filled with a through-via electrode. A second surface of the semiconductor substrate is removed for a sufficient duration to expose the uncut recess containing the through-via electrode.