公开(公告)号：US20080138935A1

公开(公告)日：2008-06-12

申请号：US11891134

申请日：2007-08-08

申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： A chip scale package structure and a method for fabricating the same are disclosed. The method includes forming metal pads on a predetermined part of a carrier; mounting chips on the carrier, each of the chips having a plurality of conductive bumps soldered to the metal pads; forming an encapsulant on the carrier to encapsulate the chips and the conductive bumps; removing the carrier to expose the metal pads and even the metal pads with a surface of the encapsulant; forming on the encapsulant a plurality of first conductive traces electrically connected to the metal pads; applying a solder mask on the first conductive traces, and forming a plurality of openings on the solder mask to expose a predetermined part of the first conductive traces; forming a plurality of conductive elements on the predetermined part; and cutting the encapsulant to form a plurality of chip scale package structures.

摘要翻译： 公开了一种芯片级封装结构及其制造方法。 该方法包括在载体的预定部分上形成金属垫; 在载体上安装芯片，每个芯片具有焊接到金属焊盘的多个导电凸块; 在载体上形成密封剂以封装芯片和导电凸块; 移除载体以暴露金属垫和甚至具有密封剂表面的金属垫; 在所述密封剂上形成电连接到所述金属焊盘的多个第一导电迹线; 在所述第一导电迹线上施加焊接掩模，以及在所述焊接掩模上形成多个开口以暴露所述第一导电迹线的预定部分; 在所述预定部分上形成多个导电元件; 以及切割所述密封剂以形成多个芯片级封装结构。

公开(公告)号：US07364944B2

公开(公告)日：2008-04-29

申请号：US11362419

申请日：2006-02-23

申请人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/97 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83385 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00

摘要： A thermally enhanced semiconductor package and a fabrication method thereof are provided. A plurality of conductive bumps are formed on bond pads on an active surface of a chip. A heat sink is attached to an inactive surface of the chip and has a surface area larger than that of the chip. An encapsulation body encapsulates the heat sink, chip and conductive bumps, while exposing a bottom or surfaces, not for attaching the chip, of the heat sink and ends of the conductive bumps outside. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with a plurality of openings for exposing predetermined portions of the conductive traces. A solder ball is implanted on each exposed portion of the conductive traces.

摘要翻译： 提供一种热增强型半导体封装及其制造方法。 在芯片的有源表面上的接合焊盘上形成多个导电凸块。 散热器附着在芯片的非活性表面上，其表面积大于芯片的表面积。 封装体封装散热器，芯片和导电凸块，同时暴露散热片的底部或表面，而不是将散热片和导电凸块的端部外露。 多个导电迹线形成在封装主体上并电连接到导电凸块的端部。 焊接掩模层施加在导电迹线上并形成有多个用于暴露导电迹线的预定部分的开口。 在导电迹线的每个暴露部分上注入焊球。

公开(公告)号：US20070200228A1

公开(公告)日：2007-08-30

申请号：US11647832

申请日：2006-12-29

申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L21/563 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253

摘要： A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.

摘要翻译： 提供了具有散热装置的半导体封装和半导体封装的制造方法。 芯片安装在基板上。 散热装置安装在芯片上，并且包括容纳室，以及与容纳室连通的第一开口和第二开口。 在散热装置和衬底之间形成密封剂以封装芯片。 执行切割处理以去除结构的非电气部分，并使第一和第二开口与密封剂暴露。 冷却流体容纳在容纳室中以吸收和散发由芯片产生的热量。 散热装置覆盖密封剂和芯片，以为半导体封装提供最大的传热面积。

公开(公告)号：US07196414B2

公开(公告)日：2007-03-27

申请号：US11212182

申请日：2005-08-26

申请人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

发明人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

IPC分类号： H01L23/10 ,  H01L23/12

CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

公开(公告)号：US07177155B2

公开(公告)日：2007-02-13

申请号：US11212290

申请日：2005-08-26

申请人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

发明人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

摘要翻译： 提供了具有散热器的半导体封装，其中至少一个芯片安装在基板上并被散热器覆盖。 散热器在与基板接触的位置处形成有多个凹槽或孔，允许将粘合材料施加在散热器和基板之间并填充到用于将散热器附接到基板上的凹槽或孔中。 填充到槽或孔中的粘合剂材料提供了将散热器牢固地定位在基板上的锚固效果。 因此，不需要在基板上形成预定的孔，用于连接诸如螺栓的固定构件，并且散热器的结合不会影响迹线布线性以及衬底上的诸如焊球的输入/输出连接的布置 不会导致芯片的裂纹。

公开(公告)号：US20060249852A1

公开(公告)日：2006-11-09

申请号：US11417548

申请日：2006-05-03

申请人： Shih-Kuang Chiu ,  Mei-Yi Sung ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Shih-Kuang Chiu ,  Mei-Yi Sung ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/48

CPC分类号： H01L23/36 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01L2224/0401

摘要： A flip-chip semiconductor device is proposed, including a substrate, a plurality of stiffeners disposed at peripheral areas of the substrate, with a gap formed between each of the adjacent stiffeners; at least a semiconductor chip mounted on an area of the substrate surrounded by the stiffeners via flip-chip technique; and a beat sink attached to the semiconductor chip. By such arrangement, warpage of the semiconductor device may be prevented. As an opening is formed at an appropriate position of the stiffener structure, distortion of the stiffener may be avoided. Further, as the beat sink is not attached to the stiffener, solder bumps may be free from thermal stress due to mismatch in coefficient of thermal expansion between the heat sink and the substrate while preventing delamination of the heat sink caused by thermal stress.

摘要翻译： 提出了一种倒装芯片半导体器件，包括基板，设置在基板的周边区域的多个加强件，在每个相邻的加强件之间形成间隙; 至少半导体芯片安装在通过倒装芯片技术被加强件包围的基板的区域上; 和连接到半导体芯片的节流槽。 通过这样的布置，可以防止半导体器件的翘曲。 当开口形成在加强结构的适当位置时，可以避免加强件的变形。 此外，由于散热器不附着在加强件上，所以由于散热器和基板之间的热膨胀系数不匹配，焊料凸点可能没有热应力，同时防止热应力引起的散热片分层。

公开(公告)号：US20060051954A1

公开(公告)日：2006-03-09

申请号：US11026919

申请日：2004-12-29

申请人： Ying-Ren Lin ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

发明人： Ying-Ren Lin ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11902 ,  H01L2224/13018 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/0723 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/013

摘要： A bump structure of a semiconductor package and a method for fabricating the same are provided. The bump structure is used to connect a semiconductor element to a carrier of the semiconductor package. The fabrication method primarily employs an electroplating process to form the bump structure including an under bump metallurgy (UBM) layer, at least one I-shaped conductive pillar, and a solder material. This allows fine-pitch electrical connection pads to be arranged in the semiconductor package, and also provides an enhanced support structure and a sufficient height between the semiconductor element and the carrier.

摘要翻译： 提供半导体封装的凸块结构及其制造方法。 凸块结构用于将半导体元件连接到半导体封装的载体。 该制造方法主要采用电镀工艺来形成凸块结构，其包括凸块下金属（UBM）层，至少一个I形导电柱和焊料材料。 这允许在半导体封装中布置细间距电连接焊盘，并且还提供增强的支撑结构和在半导体元件和载体之间的足够的高度。

公开(公告)号：US07002245B2

公开(公告)日：2006-02-21

申请号：US10643375

申请日：2003-08-18

申请人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/053

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor package having conductive bumps on a chip and a fabrication method thereof are provided. A plurality of the conductive bumps are deposited respectively on bond pads of the chip. An encapsulation body encapsulates the chip and conductive bumps while exposing ends of the conductive bumps. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the exposed ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with openings for exposing predetermined portions of the conductive traces. The exposed portions of the conductive traces are connected to a plurality of solder balls respectively.

摘要翻译： 提供了一种在芯片上具有导电凸块的半导体封装及其制造方法。 多个导电凸块分别沉积在芯片的接合焊盘上。 封装体封装芯片和导电凸块，同时暴露导电凸块的端部。 多个导电迹线形成在封装主体上并与导电凸块的暴露端电连接。 焊接掩模层施加在导电迹线上并形成有用于暴露导电迹线的预定部分的开口。 导电迹线的暴露部分分别连接到多个焊球。

公开(公告)号：US20050040519A1

公开(公告)日：2005-02-24

申请号：US10719726

申请日：2003-11-21

申请人： Chien-Ping Huang ,  Cheng-Hsu Hsiao ,  Shih-Kuang Chiu

发明人： Chien-Ping Huang ,  Cheng-Hsu Hsiao ,  Shih-Kuang Chiu

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/10

CPC分类号： H01L23/367 ,  H01L21/4882 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A semiconductor package includes a substrate having a top surface and a bottom surface; at least one chip mounted on the top surface of the substrate and electrically connected to the substrate; a heat sink attached to the top surface of the substrate by an adhesive material applied therebetween; and a plurality of solder balls implanted on the bottom surface of the substrate. The heat sink has a flat portion and a support portion connected to the flat portion. The support portion has at least one recess portion facing toward the top surface of the substrate and at least one burr formed on an interior surface of the recess portion such that the adhesive material can fill the recess portion and submerge the burr to provide an anchoring effect to firmly secure the heat sink in position on the substrate.

摘要翻译： 半导体封装包括具有顶表面和底表面的衬底; 至少一个芯片安装在所述基板的顶表面上并电连接到所述基板; 通过施加在其之间的粘合剂材料附接到基板的顶表面的散热器; 以及注入到所述基板的底面上的多个焊球。 散热器具有平坦部分和连接到平坦部分的支撑部分。 所述支撑部分具有至少一个面向所述基板的顶表面的凹部和至少一个形成在所述凹部的内表面上的毛刺，使得所述粘合剂材料可以填充所述凹陷部分并浸没所述毛刺以提供锚固效果 以将散热器牢固地固定在基板上的适当位置。

公开(公告)号：US06844622B2

公开(公告)日：2005-01-18

申请号：US09916021

申请日：2001-07-26

申请人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L23/34

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor package with a heat sink is proposed, in which a chip has its first surface attached to a chip carrier, while a second surface of the chip is attached to a heat sink through an adhesive, allowing heat generated by the chip to be transmitted to the heat sink. Moreover, in a molding process, a molding resin is used to form an encapsulant for encapsulating the chip, while a top surface and side surfaces connected to the top surface of the heat sink are exposed to outside of the encapsulant, that is, the heat sink merely has its bottom surface bonded to the encapsulant. This makes the generated heat directly dissipated to the atmosphere through the heat sink. Furthermore, the top surface of the heat sink is coated with an interface layer, while adhesion between the interface layer and the molding resin is smaller than that between the heat sink and the encapsulant. This allows the molding resin remained on the interface layer to be easily removed after completing the molding process, while delamination can be prevented from occurrence between the heat sink or the chip and the encapsulant, and also the chip can be prevented from cracking due to clamping force generated during molding.

摘要翻译： 提出了具有散热器的半导体封装，其中芯片的第一表面附着到芯片载体上，而芯片的第二表面通过粘合剂附接到散热器，从而允许芯片产生的热量被传输 到散热器 此外，在成型工艺中，使用模塑树脂形成用于封装芯片的密封剂，同时连接到散热器的顶表面的顶表面和侧表面暴露于密封剂的外部，即热量 水槽只有其底表面与密封剂结合。 这使得所产生的热量通过散热器直接耗散到大气中。 此外，散热器的顶表面涂覆有界面层，而界面层和模制树脂之间的粘合力小于散热器和密封剂之间的粘合。 这允许在完成模制过程之后容易地去除界面层上的模塑树脂，同时可以防止散热片或芯片与密封剂之间发生分层，并且还可以防止芯片由于夹紧而开裂 成型时产生的力。