公开(公告)号：US06774467B2

公开(公告)日：2004-08-10

申请号：US09812276

申请日：2001-03-20

申请人： Michio Horiuchi ,  Takashi Kurihara ,  Tomio Nagaoka ,  Masao Aoki ,  Shigeru Mizuno

发明人： Michio Horiuchi ,  Takashi Kurihara ,  Tomio Nagaoka ,  Masao Aoki ,  Shigeru Mizuno

IPC分类号： H01L23495

CPC分类号： H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/97 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

摘要： Thin semiconductor device, especially a thin package, which reduces and achieves uniform mounting height, not requiring mounting of individual chips, improves manufacturing yield, without being affected by variation in chip thickness, enables testing alltogether, and process for producing same, the semiconductor mounted with back surface exposed upward, on top of an insulating substrate having throughholes in thickness direction, the area around semiconductor side surfaces being sealed by a resin layer, metal interconnections on the bottom surface of the substrate define bottom portions of throughholes of the substrate, a solder resist layer having throughholes in the thickness direction covers the bottom surface of metal interconnections and substrate, terminals extending downward from the active surface of the semiconductor are inserted into throughholes of the substrate, conductive filler fills gaps between the terminals and the throughholes of the substrate, and connection terminal and interconnections are electrically connected.

摘要翻译： 薄型半导体器件，特别是薄封装，其减少并实现均匀的安装高度，而不需要安装单个芯片，提高了制造成品率，而不受芯片厚度变化的影响，能够进行全面测试，以及制造工艺，半导体安装 背面向上露出，在厚度方向上具有通孔的绝缘基板的顶部，半导体侧面的周围的区域被树脂层密封，在基板的底面上的金属互连限定了基板的通孔的底部， 在厚度方向上具有通孔的阻焊层覆盖金属互连和基板的底面，从半导体的有源表面向下延伸的端子插入到基板的通孔中，导电填料填充端子之间的间隙和基板的通孔 ，连接终端 并且互连电连接。

公开(公告)号：US06469260B2

公开(公告)日：2002-10-22

申请号：US09792991

申请日：2001-02-24

申请人： Michio Horiuchi ,  Takashi Kurihara

发明人： Michio Horiuchi ,  Takashi Kurihara

IPC分类号： H01R909

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L21/4885 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49816 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48699 ,  H01L2224/49 ,  H01L2224/81801 ,  H01L2224/85444 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K3/20 ,  H05K2201/10287 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A wiring board comprising a substrate having applied on the same side surface thereof one or more terminals for connecting a semiconductor element and one or more terminals for external connection, in which the terminals for connecting the semiconductor element and the terminals for external connection are electrically connected, by a wire, with each other in the interior of the wiring board, and a semiconductor device comprising the wiring board having packaged thereon semiconductor elements. Processes for the production of the wiring board and the semiconductor device are also disclosed.

摘要翻译： 一种布线基板，其特征在于，具有与上述半导体元件连接的半导体元件的一个或多个端子和一个以上的外部连接端子连接的半导体元件用端子和外部连接端子电连接的同一侧面的基板 通过导线彼此连接在布线板的内部，以及半导体器件，包括其上封装有半导体元件的布线板。 还公开了用于制造布线板和半导体器件的工艺。

公开(公告)号：US4875542A

公开(公告)日：1989-10-24

申请号：US213022

申请日：1988-06-29

申请人： Koh Uchida ,  Takashi Kurihara ,  Makoto Miyoshi

发明人： Koh Uchida ,  Takashi Kurihara ,  Makoto Miyoshi

IPC分类号： B62D6/02 ,  B62D6/00

CPC分类号： B62D6/00

摘要： A variable assist power steering system employing a fluid distributor circuit of the open center type is disclosed. The fluid distributor circuit includes two parallel fluid flow paths connected to both chambers of a power cylinder respectively to produce a pressure differential between the both cylinder chambers in response to steering torque. For modulating the valve characteristics, two additional variable flow restrictors are arranged in series with two main variable flow restrictors and two bypass paths are arranged to bypass the main variable flow restrictors, respectively. The bypass paths are provided with variable flow orifice valves, respectively, which valves are controlled in response to a turning direction of a steering wheel and also to some external signal, such as vehicle speed.

摘要翻译： 公开了一种采用开放式中心型流体分配器电路的可变辅助动力转向系统。 流体分配器电路包括分别连接到动力缸的两个腔室的两个平行的流体流动路径，以响应于转向扭矩而在两个气缸室之间产生压力差。 为了调节阀门特性，两个附加的可变流量限制器与两个主要可变流量限制器串联布置，并且两个旁路路径分别布置成绕过主要可变流量限制器。 旁通路径分别设置有可变流量节流阀，其响应于方向盘的转向方向以及诸如车辆速度的某些外部信号而被控制。

公开(公告)号：US4860846A

公开(公告)日：1989-08-29

申请号：US138490

申请日：1987-12-28

申请人： Koh Uchida ,  Takashi Kurihara ,  Makoto Miyoshi

发明人： Koh Uchida ,  Takashi Kurihara ,  Makoto Miyoshi

IPC分类号： B62D5/06 ,  B62D5/083 ,  B62D6/00

CPC分类号： B62D6/00

摘要： A control valve includes valve elements relatively displaceable in response to a predetermined variable (e.g., a steering torque) to define therebetween two parallel fluid flow paths connected between a fluid source and a fluid reservoir to produce pressure different in a power cylinder. The control valve a variable flow orifice that is arranged in series with regard to one of variable flow orifices of the parallel fluid flow paths, and a bypass path including has an externally controlled variable flow orifice valve that has an orifice area variable in response to a second predetermined variable which is different from the first predetermined variable.

摘要翻译： 控制阀包括响应于预定变量（例如，转向扭矩）相对可移位的阀元件，以在两个平行的流体流动路径之间限定两个平行的流体流动路径，其连接在流体源和流体储存器之间以产生在动力缸中不同的压力。 所述控制阀是可变流量孔口，其相对于所述平行流体流动路径的可变流动孔口中的一个排列成串联，并且旁路路径包括外部控制的可变流量孔口阀，其具有响应于 与第一预定变量不同的第二预定变量。

公开(公告)号：US4860635A

公开(公告)日：1989-08-29

申请号：US44065

申请日：1987-04-29

申请人： Koh Uchida ,  Takashi Kurihara

发明人： Koh Uchida ,  Takashi Kurihara

IPC分类号： B62D5/083 ,  B62D6/00

CPC分类号： B62D6/00 ,  B62D5/083 ,  Y10T137/86662 ,  Y10T137/87177

摘要： A steering control valve for a power steering system for a vehicle includes a valve structure which defines a plurality of variable flow orifices as steering input torque is applied thereby creating pressure differential acting on fluid motor. A solenoid operated variable flow orifice valve is operable in response to a control factor, such as vehicle speed, other than the steering input torque defines a variable flow orifice connected in series with one of the plurality of variable flow orifices.

公开(公告)号：US4852462A

公开(公告)日：1989-08-01

申请号：US151121

申请日：1988-02-01

申请人： Koh Uchida ,  Takashi Kurihara ,  Makoto Miyoshi

发明人： Koh Uchida ,  Takashi Kurihara ,  Makoto Miyoshi

IPC分类号： B62D5/07 ,  B62D6/00 ,  B62D6/02 ,  B62D101/00 ,  B62D119/00

CPC分类号： B62D6/02 ,  Y10T137/86662 ,  Y10T137/87177

摘要： A power assist steering system comprises a control valve which defines a fluid flow distributor circuit which includes two parallel first and second fluid flow paths connected between the hydraulic fluid source and the fluid reservoir. Inflow control variable flow orifices are arranged in series with two auxiliary variable flow orifices, respectively, which are disposed downstream with regard to the power cylinder, and the outflow control variable flow orifices are arranged in series with another two auxiliary variable flow orifices which are disposed downstream with regard to the power cylinder.

摘要翻译： 动力辅助转向系统包括限定流体流量分配器回路的控制阀，流体分配器回路包括连接在液压流体源和流体储存器之间的两个平行的第一和第二流体流路。 流量控制可变流量孔分别与两个辅助可变流量孔相连接，这两个辅助可变流量孔相对于动力缸设置在下游，并且流出控制可变流量孔与另外两个辅助可变流量孔排列， 关于动力缸的下游。

公开(公告)号：US4844126A

公开(公告)日：1989-07-04

申请号：US150949

申请日：1988-02-01

申请人： Koh Uchida ,  Takashi Kurihara ,  Makato Miyoshi

发明人： Koh Uchida ,  Takashi Kurihara ,  Makato Miyoshi

IPC分类号： B62D6/02 ,  B62D5/07 ,  B62D5/083 ,  B62D7/14

CPC分类号： B62D5/083 ,  Y10T137/86638

摘要： A rotary type power steering control valve comprises a groove arrangement which includes two first grooves spaced longitudinally along a longitudinal axis, and a second longtudinally extending groove which has one circumferential side overlapping the two first grooves to define two variable flow orifices. The direction of fluid is reversed by the second longitudinally extending groove so that both of the variable flow orifices are arranged in series.

摘要翻译： 旋转式动力转向控制阀包括槽布置，其包括沿着纵向轴线纵向间隔开的两个第一槽和第二长拖槽，其具有与两个第一槽重叠以限定两个可变流动孔的一个周向侧。 流体的方向被第二纵向延伸的槽反转，使得两个可变流动孔都串联排列。

公开(公告)号：US4716650A

公开(公告)日：1988-01-05

申请号：US34240

申请日：1987-04-06

申请人： Masaaki Utsui ,  Makoto Shimizu ,  Noriyuki Hoshina ,  Nobuyuki Adachi ,  Takashi Kurihara ,  Tatsuo Shiino

发明人： Masaaki Utsui ,  Makoto Shimizu ,  Noriyuki Hoshina ,  Nobuyuki Adachi ,  Takashi Kurihara ,  Tatsuo Shiino

IPC分类号： G11B23/00 ,  B23P21/00 ,  G11B23/03 ,  G11B23/033 ,  G11B23/113 ,  B21D39/03 ,  B23P11/00

CPC分类号： G11B23/0326 ,  B23P21/00 ,  Y10T29/49829 ,  Y10T29/5191 ,  Y10T29/53 ,  Y10T29/53539

摘要： A magnetic recording disk cartridge comprises a magnetic disk unit rotatably accommodated in a casing. A method of assembling the magnetic recording disk cartridge comprises a first conveying step of conveying a lower half of the casing by a first conveyor, a second conveying step of conveying an upper half of the casing by a second conveyor, a disk assembling step of receiving a magnetic disk sheet and a core part and securing the magnetic disk sheet to the core part to form a magnetic disk unit, a disk unit placing step of placing the magnetic disk unit on the lower half of the casing on the first conveyor, and a casing assembling step of transferring both the upper half of the casing on the second conveyor and the lower half of the casing with the magnetic disk unit on the first conveyor to an assembly table, receiving mechanical parts, incorporating the mechanical parts in the lower half on the assembly table, subsequently connecting the upper and lower halves and transferring the integrated casing to a third conveyor. The disk unit placing step is carried out by the intermittent-stop-and-wait system.

摘要翻译： 磁记录盘盒包括可旋转地容纳在壳体中的磁盘单元。 一种组装磁记录盘盒的方法，包括：第一输送步骤，通过第一输送器输送壳体的下半部;第二输送步骤，通过第二输送器输送壳体的上半部;盘组装步骤， 磁盘片和芯部，并且将磁盘片固定到芯部以形成磁盘单元;盘单元放置步骤，用于将磁盘单元放置在第一传送器上的壳体的下半部上;以及 壳体组装步骤，将第二输送机上的壳体的上半部分和壳体的下半部分用第一传送器上的磁盘单元传送到组装台，接收机械部件，将下半部分中的机械部件合并在 组装台，随后连接上半部分和下半部分，并将集成的壳体传送到第三传送器。 盘单元放置步骤由间歇停止系统执行。

公开(公告)号：US08886416B2

公开(公告)日：2014-11-11

申请号：US13819225

申请日：2012-02-08

申请人： Ryo Fukano ,  Hisashi Asada ,  Takashi Kurihara

发明人： Ryo Fukano ,  Hisashi Asada ,  Takashi Kurihara

IPC分类号： E02F9/26 ,  E02F9/20

CPC分类号： E02F9/26 ,  E02F9/2033 ,  E02F9/2037 ,  E02F9/262 ,  E02F9/264 ,  G05B2219/45012

摘要： In a hydraulic shovel operability range display device, a calculation unit is configured to set a boundary between an operability range and an underbody area along a vertical direction in a global coordinate system when a vehicle body is horizontally oriented. When the vehicle body is tilted forward, the calculation unit is configured to set the boundary so as to be maintained along the vertical direction in the global coordinate system. When the vehicle body is tilted backwards, the calculation unit is configured to correct the boundary between the operability range and the underbody area so that an angle formed by the boundary and the ground surface on which the vehicle body is positioned is at least 90°.

摘要翻译： 在液压铲可操作范围显示装置中，计算单元被配置为当车身水平定向时，在全局坐标系中沿垂直方向设置可操作范围和底体区域之间的边界。 当车体向前倾斜时，计算单元被配置成在全局坐标系中沿垂直方向设置边界。 当车身向后倾斜时，计算单元被配置为校正可操作性范围和底部区域之间的边界，使得由边界和车体所在的地面形成的角度至少为90°。

公开(公告)号：US08720519B2

公开(公告)日：2014-05-13

申请号：US13117584

申请日：2011-05-27

申请人： Takatoyo Yamakami ,  Hidehiko Kira ,  Takashi Kubota ,  Kiyoshi Oi ,  Kiyoaki Iida ,  Takashi Kurihara

发明人： Takatoyo Yamakami ,  Hidehiko Kira ,  Takashi Kubota ,  Kiyoshi Oi ,  Kiyoaki Iida ,  Takashi Kurihara

IPC分类号： B32B37/02

CPC分类号： H01L24/83 ,  H01L24/75 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81001 ,  H01L2224/83001 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

摘要： A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.

摘要翻译： 接合工具将下部芯片保持抵靠由吸力保持的释放带。 接合工具具有电子部件吸入口，下部芯片被保持在该电子元件吸入口周围，并且围绕电子部件吸入口，容纳释放带的沟槽。 下芯片通过压在底部填充材料上被加热，因此，形成上部芯片安装的区域，使得底部填充材料从下部芯片突出。 在加热过程中，由于由于热而膨胀的释放带的扩张部分被插入到沟槽中，所以在底部填充材料的上表面上没有形成折线。