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    METHOD AND ARRANGEMENT FOR PRODUCING A THREE-DIMENSIONAL MATERIAL COMPOSITE USING AN EXPANSION BODY
    92.
    发明申请
    METHOD AND ARRANGEMENT FOR PRODUCING A THREE-DIMENSIONAL MATERIAL COMPOSITE USING AN EXPANSION BODY 审中-公开
    使用膨胀体生产三维材料复合材料的方法和装配

    公开(公告)号：US20160107252A1

    公开(公告)日：2016-04-21

    申请号：US14895466

    申请日：2014-04-29

    申请人： Gerhard BETZ

    发明人： Gerhard Betz

    IPC分类号： B23K1/00 ,  B23K3/04 ,  B23K1/19

    CPC分类号： B23K1/0006 ,  B23K1/19 ,  B23K3/04 ,  B23K20/026 ,  B23K20/16 ,  B23K20/227 ,  B23K2103/04 ,  B23K2103/12 ,  B23K2103/166 ,  B23K2103/22

    摘要： A method and arrangement for producing a three-dimensional material composite using an expansion body includes at least two metal bodies having surface regions resting loosely against one another. The composite is heated to a target temperature and the surface regions are pressed against one another so that an integral connection is established. At least one expansion cavity having a predefined initial volume is arranged in one of the metal bodies or in an additional expansion body resting against one of the metal bodies in such a manner that when the expansion cavity expands, the surface regions to be connected are pressed against one another. A predefined quantity of at least one substance which is gaseous at least at a target temperature is hermetically enclosed in the expansion cavity before the target temperature is reached.

    摘要翻译： 使用膨胀体制造三维材料复合体的方法和装置包括至少两个金属体，其具有松散地彼此搁置的表面区域。 将复合体加热到目标温度，并且将表面区域彼此压紧，从而建立整体连接。 具有预定初始体积的至少一个膨胀腔被布置在一个金属体中或在另一个膨胀体中，以相当于金属体之一的方式安置，使得当膨胀腔膨胀时，要连接的表面区域被按压 相互对抗 在达到目标温度之前，预定量的至少一种至少在目标温度下是气态的物质气密地封闭在膨胀腔中。

    SOLDER ALLOY AND JOINT THEREOF
    93.
    发明申请
    SOLDER ALLOY AND JOINT THEREOF 审中-公开
    焊接合金及其接头

    公开(公告)号：US20160032424A1

    公开(公告)日：2016-02-04

    申请号：US14775013

    申请日：2014-03-12

    申请人： NIHON SUPERIOR CO., LTD.

    发明人： Tetsuro NISHIMURA ,  Shoichi SUENAGA ,  Takashi NOZU ,  Motonori MIYAOKA ,  Yasufumi SHIBATA

    IPC分类号： C22C13/00 ,  B23K1/00 ,  B23K1/19

    CPC分类号： C22C13/00 ,  B23K1/0006 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/007 ,  B23K35/282 ,  B23K35/3006 ,  B23K2101/36 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/18

    摘要： A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 μm or less.

    摘要翻译： 通过在凝固点积极地最小化银 - 锌金属间化合物的粒径而获得具有高接合强度的银电极接头。 使用包含2-9重量％的锌，0.0001-0.1重量％的锰和余量由锡组成的焊料合金将至少与其表面层相连的包含银的接合体连接到被接合物上， 具有接合界面的焊接接头，其中由作为被接合物的表面层的银和焊料合金中的锌形成的银 - 锌金属间化合物的粒径为5μm以下。