公开(公告)号：US20230199362A1

公开(公告)日：2023-06-22

申请号：US17560179

申请日：2021-12-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Yi WU ,  Hung Yi LIN ,  Jenchun CHEN

IPC: H04R1/10

CPC classification number: H04R1/1016 ,  H04R1/1058 ,  H04R1/1091

Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.

公开(公告)号：US20230197600A1

公开(公告)日：2023-06-22

申请号：US17555227

申请日：2021-12-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Shun CHANG ,  Sheng-Wen YANG ,  Teck-Chong LEE ,  Yen-Liang HUANG

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/12

CPC classification number: H01L23/5226 ,  H01L23/31 ,  H01L23/12

Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

公开(公告)号：US20230197487A1

公开(公告)日：2023-06-22

申请号：US18112466

申请日：2023-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Bo Hua CHEN ,  Yan Ting SHEN ,  Fu Tang CHU ,  Wen-Pin HUANG

IPC: H01L21/673 ,  H01L23/00 ,  H01L21/78

CPC classification number: H01L21/67346 ,  H01L23/562 ,  H01L21/78

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

公开(公告)号：US20230187387A1

公开(公告)日：2023-06-15

申请号：US18109787

申请日：2023-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  An-Ping CHIEN

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/38 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L23/49838 ,  H01L21/4846 ,  H01Q1/38 ,  H01L23/552 ,  H01L2223/6677

Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

公开(公告)号：US20230187374A1

公开(公告)日：2023-06-15

申请号：US17548333

申请日：2021-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hui-Ping JIAN ,  Ming-Hung CHEN ,  Jia-Feng HO

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/13 ,  H01L21/56 ,  H01Q1/22

CPC classification number: H01L23/552 ,  H01L23/49838 ,  H01L23/13 ,  H01L21/561 ,  H01Q1/2283 ,  H01L23/49822 ,  H01L23/3121

Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.

公开(公告)号：US11676912B2

公开(公告)日：2023-06-13

申请号：US17133365

申请日：2020-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu Huang ,  Chun Chen Chen ,  Wei Chih Cho ,  Shao-Lun Yang

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.

公开(公告)号：US20230164920A1

公开(公告)日：2023-05-25

申请号：US18095511

申请日：2023-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Fan CHEN ,  Chien-Hao WANG

IPC: H05K1/18 ,  H01L21/48 ,  H01L23/538 ,  H01L21/56

CPC classification number: H05K1/183 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5383 ,  H01L21/568 ,  H01L23/5386 ,  H05K2201/10 ,  H01L2924/15153 ,  H01L2224/04105 ,  H01L2924/11

Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

公开(公告)号：US20230163091A1

公开(公告)日：2023-05-25

申请号：US17535407

申请日：2021-11-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jen WANG ,  Yi Dao WANG ,  Tung Yao LIN

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L24/73 ,  H01L23/49822 ,  H01L24/81 ,  H01L2224/10122 ,  H01L2224/10145 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/16227 ,  H01L2224/81203 ,  H01L2224/81224

Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.

公开(公告)号：US11655992B2

公开(公告)日：2023-05-23

申请号：US15895701

申请日：2018-02-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun Hung Tsai ,  Hsuan Yu Chen

IPC: F24F11/30 ,  F24F1/04 ,  F24F1/022 ,  F24F110/10 ,  F24F11/80 ,  F24F13/24

CPC classification number: F24F11/30 ,  F24F1/022 ,  F24F1/04 ,  F24F11/80 ,  F24F2013/247 ,  F24F2110/10

Abstract: A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.

公开(公告)号：US11631734B2

公开(公告)日：2023-04-18

申请号：US17102258

申请日：2020-11-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Syu-Tang Liu ,  Huang-Hsien Chang ,  Tsung-Tang Tsai ,  Hung-Jung Tu

IPC: H01L49/02 ,  H01L21/02 ,  H01L23/522 ,  H01L21/308 ,  H01L21/3105 ,  H01L21/285

Abstract: A vertical capacitor structure includes a substrate, at least a pillar, a first conductive layer, a first dielectric layer and a second conductive layer. The substrate defines a cavity. The pillar is disposed in the cavity. The first conductive layer covers and is conformal to the cavity of the substrate and the pillar, and is insulated from the substrate. The first dielectric layer covers and is conformal to the first conductive layer. The second conductive layer covers and is conformal to the first dielectric layer. The first conductive layer, the first dielectric layer and the second conductive layer jointly form a capacitor component.