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    Build-up package for integrated circuit devices, and methods of making same
    101.
    发明授权
    Build-up package for integrated circuit devices, and methods of making same 有权

    公开(公告)号：US10593607B2

    公开(公告)日：2020-03-17

    申请号：US15145760

    申请日：2016-05-03

    Applicant: Micron Technology, Inc.

    Inventor： Hong Wan Ng ,  Choon Kuan Lee ,  David J. Corisis ,  Chin Hui Chong

    IPC: H01L23/18 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/373 ,  H01L21/78

    Abstract: A device is disclosed which includes, in one illustrative example, an integrated circuit die having an active surface and a molded body extending around a perimeter of the die, the molded body having lips that are positioned above a portion of the active surface of the die. Another illustrative example includes an integrated circuit die having an active surface, a molded body extending around a perimeter of the die and a CTE buffer material formed around at least a portion of the perimeter of the die adjacent the active surface of the die, wherein the CTE buffer material is positioned between a portion of the die and a portion of the molded body and wherein the CTE buffer material has a coefficient of thermal expansion that is intermediate a coefficient of thermal expansion for the die and a coefficient of thermal expansion for the molded body.

    Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
    102.
    发明授权
    Semiconductor device assemblies including multiple shingled stacks of semiconductor dies 有权

    公开(公告)号：US10522507B2

    公开(公告)日：2019-12-31

    申请号：US16383903

    申请日：2019-04-15

    Applicant: Micron Technology, Inc.

    Inventor： Hong Wan Ng ,  Akshay N. Singh

    IPC: H01L21/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/50

    Abstract: A semiconductor device assembly includes a substrate having a plurality of external connections, a first shingled stack of semiconductor dies disposed directly over a first location on the substrate and electrically coupled to a first subset of the plurality of external connections, and a second shingled stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the plurality of external connections. The semiconductor device assembly further includes an encapsulant at least partially encapsulating the substrate, the first shingled stack and the second shingled stack.

    SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS OF SEMICONDUCTOR DIES
    103.
    发明申请
    SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS OF SEMICONDUCTOR DIES 审中-公开

    公开(公告)号：US20190244930A1

    公开(公告)日：2019-08-08

    申请号：US16383903

    申请日：2019-04-15

    Applicant: Micron Technology, Inc.

    Inventor： Hong Wan Ng ,  Akshay N. Singh

    IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/50

    Abstract: A semiconductor device assembly includes a substrate having a plurality of external connections, a first shingled stack of semiconductor dies disposed directly over a first location on the substrate and electrically coupled to a first subset of the plurality of external connections, and a second shingled stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the plurality of external connections. The semiconductor device assembly further includes an encapsulant at least partially encapsulating the substrate, the first shingled stack and the second shingled stack.

    Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
    104.
    发明授权
    Semiconductor device assemblies including multiple shingled stacks of semiconductor dies 有权

    公开(公告)号：US10312219B2

    公开(公告)日：2019-06-04

    申请号：US15806808

    申请日：2017-11-08

    Applicant: Micron Technology, Inc.

    Inventor： Hong Wan Ng ,  Akshay N. Singh

    IPC: H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L23/50

    Abstract: A semiconductor device assembly includes a substrate having a plurality of external connections, a first shingled stack of semiconductor dies disposed directly over a first location on the substrate and electrically coupled to a first subset of the plurality of external connections, and a second shingled stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the plurality of external connections. The semiconductor device assembly further includes an encapsulant at least partially encapsulating the substrate, the first shingled stack and the second shingled stack.

    Semiconductor devices including a controller and methods of forming such devices
    105.
    发明授权
    Semiconductor devices including a controller and methods of forming such devices 有权

    公开(公告)号：US10304808B2

    公开(公告)日：2019-05-28

    申请号：US16020642

    申请日：2018-06-27

    Applicant: Micron Technology, Inc.

    Inventor： Seng Kim Dalson Ye ,  Hong Wan Ng

    IPC: H01L23/50 ,  H01L25/065 ,  H01L25/00 ,  H01L23/13 ,  H01L23/498

    Abstract: Semiconductor device packages include a stack of semiconductor memory devices positioned over an interposer substrate, a controller element, and a redistribution substrate positioned laterally adjacent to the controller element. At least a portion of the controller element is positioned directly between the stack and the interposer substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate. Methods of manufacturing a semiconductor device package include positioning a redistribution substrate laterally adjacent to a controller element and attaching the redistribution substrate and the controller element to an interposer substrate. A stack of semiconductor memory devices is positioned over the controller element and the redistribution substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate.

    METHODS OF OPERATING SEMICONDCUTOR DEVICES INCLUDING A CONTROLLER
    106.
    发明申请
    METHODS OF OPERATING SEMICONDCUTOR DEVICES INCLUDING A CONTROLLER 审中-公开

    公开(公告)号：US20190088627A1

    公开(公告)日：2019-03-21

    申请号：US16194888

    申请日：2018-11-19

    Applicant: Micron Technology, Inc.

    Inventor： Seng Kim Dalson Ye ,  Hong Wan Ng

    IPC: H01L25/065 ,  H01L23/498 ,  H01L25/00 ,  H01L23/13 ,  H01L23/50

    Abstract: Semiconductor device packages include a stack of semiconductor memory devices positioned over an interposer substrate, a controller element, and a redistribution substrate positioned laterally adjacent to the controller element. At least a portion of the controller element is positioned directly between the stack and the interposer substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate. Methods of manufacturing a semiconductor device package include positioning a redistribution substrate laterally adjacent to a controller element and attaching the redistribution substrate and the controller element to an interposer substrate. A stack of semiconductor memory devices is positioned over the controller element and the redistribution substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate.

    Methods of manufacturing a semiconductor device package including a controller element
    107.
    发明授权
    Methods of manufacturing a semiconductor device package including a controller element 有权

    公开(公告)号：US10014281B2

    公开(公告)日：2018-07-03

    申请号：US15688308

    申请日：2017-08-28

    Applicant: Micron Technology, Inc.

    Inventor： Seng Kim Dalson Ye ,  Hong Wan Ng

    IPC: H01L25/00 ,  H01L23/50 ,  H01L25/065 ,  H01L23/13 ,  H01L23/498

    Abstract: Semiconductor device packages include a stack of semiconductor memory devices positioned over an interposer substrate, a controller element, and a redistribution substrate positioned laterally adjacent to the controller element. At least a portion of the controller element is positioned directly between the stack and the interposer substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate. Methods of manufacturing a semiconductor device package include positioning a redistribution substrate laterally adjacent to a controller element and attaching the redistribution substrate and the controller element to an interposer substrate. A stack of semiconductor memory devices is positioned over the controller element and the redistribution substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate.

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