公开(公告)号：US20170294419A1

公开(公告)日：2017-10-12

申请号：US15480460

申请日：2017-04-06

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Tadaaki IKEDA

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L33/483 ,  H01L33/502 ,  H01L33/504 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device includes a first light emitting element having a first front surface and a first lateral surface, and a second light emitting element having a second front surface and a second lateral surface. A substrate includes a substrate front surface in which an intermediate wiring is provided. The light reflective covering member is provided on the substrate front surface to cover the first lateral surface and the second lateral surface. The light reflective covering member includes an external surface opposite to a substrate front surface in the front-back direction and a first recess having a recess opening on the external surface and a recess bottom opposite to the recess opening in the front-back direction. The recess bottom is positioned between the intermediate wiring and both of the first front surface and the second front surface in the front-back direction.

公开(公告)号：US20170244016A1

公开(公告)日：2017-08-24

申请号：US15588863

申请日：2017-05-08

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Akira HORI

IPC: H01L33/64 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/32

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/16225

Abstract: A light emitting device includes a substrate, a light emitting element, a sealing member, a light transmissive member and a heat dissipation terminal. The substrate has a first main surface, a second main surface, and a mounting surface that is adjacent to at least the second main surface. The substrate includes an insulating base material and a pair of connection terminals. The light emitting element is mounted on the first main surface of the substrate. The sealing member is in contact with at least a part of a side surface of the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface. The heat dissipation terminal is arranged generally in the center on the second main surface of the substrate and has a recess portion as viewed along a direction normal to the second main surface.

公开(公告)号：US20170229627A1

公开(公告)日：2017-08-10

申请号：US15494801

申请日：2017-04-24

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Yoshitaka BANDO ,  Hiroto TAMAKI

IPC: H01L33/62 ,  H01L21/48 ,  H01L23/495

CPC classification number: H01L23/49537 ,  H01L21/4828 ,  H01L23/49503 ,  H01L23/49544 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49582 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A lead frame includes a plurality of units connected together. Each unit includes a pair of lead portions spaced apart from and opposite to each other. The lead portions are configured to mount a semiconductor element and to be electrically connected to a pair of electrodes of the semiconductor element. Each lead portion includes two hook-shaped portions respectively extending from the lead portion. The hook-shaped portions of one lead portion are arranged to surround tip portions of the hook-shaped portions of the other lead portion respectively, at both sides respective to a center line of the unit.

公开(公告)号：US20170200868A1

公开(公告)日：2017-07-13

申请号：US15468540

申请日：2017-03-24

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Takeshi IKEGAMI ,  Tadaaki IKEDA ,  Tadao HAYASHI ,  Hiroto TAMAKI

IPC: H01L33/48 ,  H01L25/13 ,  H01L33/54 ,  H01L33/38 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L25/13 ,  H01L33/387 ,  H01L33/502 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.

公开(公告)号：US20160308104A1

公开(公告)日：2016-10-20

申请号：US15194530

申请日：2016-06-27

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L25/13 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L25/13 ,  H01L27/156 ,  H01L33/486 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4909 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A light emitting apparatus includes a package and a first light emitting device. The package has a package bottom surface and defining recessed portion having a recessed portion bottom surface therein. The package includes a first leadframe, a second leadframe and resin portion. Each of the first and second leadframes has a leadframe upper surface which is partially exposed at the recessed portion bottom surface and a leadframe bottom surface exposed at the package bottom surface. The first light emitting device is mounted in the recessed portion. The first and second leadframes are spaced apart each other via an separation area having a bending portion and a liner portion connected to the bending portion and extended substantially straight along a boundary line between the first leadframe main body and the first leadframe extension portion at the package bottom surface.

Abstract translation: 发光装置包括封装和第一发光器件。 封装具有封装底表面，并且在其中具有凹陷部底面的凹部。 该封装包括第一引线框，第二引线框和树脂部。 第一引线框架和第二引线框架中的每一个具有引导框架上表面，该引线框架上表面部分地露出在凹部底部表面处，引线框架底表面暴露在封装底表面处。 第一发光装置安装在凹部中。 第一引线框架和第二引线框架经由具有弯曲部分和连接到弯曲部分的衬垫部分的分隔区彼此间隔开，并且在包装处沿着第一引线框架主体和第一引线框架延伸部分之间的边界线基本上直线延伸 底面。

公开(公告)号：US20160079506A1

公开(公告)日：2016-03-17

申请号：US14950136

申请日：2015-11-24

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Hiroto TAMAKI

IPC: H01L33/62 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/282 ,  H05K2201/0209 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer disposed on an upper surface of the uppermost ceramic layer, an internal conductive layer interposed between the ceramic layers, and a lower conductive layer disposed on a lower surface of the lowermost ceramic layer. The conductive member defines vias electrically connecting the upper conductive layer, the internal conductive layer, and the lower conductive layer. A total number of a first vias connected to the lower conductive layer is larger than a total number of a second vias connected to the upper conductive layer.

Abstract translation: 布线基板包括陶瓷层和导电构件。 陶瓷层具有最上层的陶瓷层和最下层的陶瓷层。 导电构件包括设置在最上层陶瓷层的上表面上的上导电层，介于陶瓷层之间的内导电层和设置在最下陶瓷层下表面的下导电层。 导电构件限定了将上导电层，内导电层和下导电层电连接的通孔。 连接到下导电层的第一通孔的总数大于连接到上导电层的第二通孔的总数。

公开(公告)号：US20150181711A1

公开(公告)日：2015-06-25

申请号：US14582282

申请日：2014-12-24

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Hiroto TAMAKI

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/09 ,  H01L33/48 ,  H05K1/03

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/282 ,  H05K2201/0209 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Discoloration is suppressed in a wiring substrate including a conductive member including silver. A wiring substrate includes a ceramic layer and a conductive member including a conductive layer disposed on an upper surface of the ceramic layer. The conductive member includes silver and at least a portion of an upper surface of the conductive layer is covered with a covering layer. The covering layer includes an inorganic reflecting layer and a glass layer stacked on the inorganic reflecting layer.

Abstract translation: 在包括含有银的导电构件的布线基板中抑制了变色。 布线基板包括陶瓷层和包括设置在陶瓷层的上表面上的导电层的导电构件。 导电构件包括银，并且导电层的上表面的至少一部分被覆盖层覆盖。 覆盖层包括层叠在无机反射层上的无机反射层和玻璃层。

公开(公告)号：US20150171281A1

公开(公告)日：2015-06-18

申请号：US14568256

申请日：2014-12-12

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Takeshi IKEGAMI ,  Tadaaki IKEDA ,  Tadao HAYASHI ,  Hiroto TAMAKI

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L25/13 ,  H01L33/387 ,  H01L33/502 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: Provided is a small and thin light emitting device which has no connection failure, a high life, high performance and good light extraction efficiency. The light emitting device includes a base body comprising a base material having a pair of connection terminals on at least a first main surface, a light emitting element connected to the connection terminals, and a sealing member that seals the light emitting element, wherein the base material has a linear expansion coefficient within ±10 ppm/° C. of the linear expansion coefficient of the light emitting element.

Abstract translation: 提供了一种小而薄的发光装置，其没有连接故障，高寿命，高性能和良好的光提取效率。 发光器件包括：基体，其包括在至少第一主表面上具有一对连接端子的基底材料，连接到连接端子的发光元件和密封发光元件的密封构件，其中基底 材料的线性膨胀系数在发光元件的线性膨胀系数的±10ppm /℃以内。

公开(公告)号：US20150001559A1

公开(公告)日：2015-01-01

申请号：US14315332

申请日：2014-06-26

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L25/13

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L25/13 ,  H01L27/156 ,  H01L33/486 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4909 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: The present invention provides a package for light emitting apparatus has a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view, and includes first, second and third leadframes, and a resin portion. The first and second leadframes are arranged on the both sides in the long-length direction. The third leadframe is arranged between the first and second leadframes. The resin portion is integrally formed with the first, second and third leadframes. The first and second leadframes include main portions, and first and second extension portions that extend from the main portions toward the second and first leadframes, respectively, and have a width smaller than the main portions.

Abstract translation: 本发明提供了一种发光装置的封装，其具有从俯视图看的长度方向和长度方向的长度方向，并且包括第一，第二和第三引线框以及树脂部。 第一引线框架和第二引线框架沿长度方向布置在两侧。 第三引线框架布置在第一引线框架和第二引线框架之间。 树脂部分与第一，第二和第三引线框一体形成。 第一引线框架和第二引线框架包括主要部分，以及分别从主要部分朝向第二引线框架和第一引线框架延伸并且具有小于主要部分的宽度的第一和第二延伸部分。

公开(公告)号：US20140252401A1

公开(公告)日：2014-09-11

申请号：US14196754

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Yoshitaka BANDO ,  Hiroto TAMAKI

IPC: H01L33/62 ,  H01L23/495

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to a light emitting element, and a light emitting device of high reliability which utilizing the lead frame. A lead frame includes a clad material which is a stacked layer of at least a first metal layer and a second metal layer, the second metal layer made of a metal which is different from the metal of the first metal layer, and a through portion. In the through-portion, an end surface of the first metal layer and an end surface of the second metal layer are covered with a plated layer. The end surface of either the first metal layer or the second metal layer protrudes farther into the through-portion than the end surface of the other metal layer.

Abstract translation: 可以承受与发光元件的直接接合的高质量的引线框架和利用引线框架的高可靠性的发光器件。 引线框架包括作为至少第一金属层和第二金属层的堆叠层的包覆材料，由与第一金属层的金属不同的金属制成的第二金属层和贯通部。 在贯通部中，第一金属层的端面和第二金属层的端面被电镀层覆盖。 第一金属层或第二金属层的端面比另一金属层的端面进一步向贯通部突出。