公开(公告)号：US09000576B2

公开(公告)日：2015-04-07

申请号：US13590197

申请日：2012-08-21

Applicant: Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

Inventor： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

IPC: H01L23/02 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/49568 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/552 ,  H01L24/73 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal of the first conductive element is electrically connected to the top lead frame. The third terminal of the second conductive element is electrically connected to the bottom lead frame, and the fourth terminal of the second conductive element is electrically connected to the top lead frame. In one embodiment, a heat dissipation device is disposed on the top lead frame. In one embodiment, the molding compound is provided such that the outer leads of the top lead frame are exposed outside the molding compound.

Abstract translation: 本发明公开了一种用于更好散热或EMI性能的封装结构。 第一导电元件和第二导电元件都设置在顶部引线框架和底部引线框架之间。 第一导电元件的第一端子电连接到底部引线框架，并且第一导电元件的第二端子电连接到顶部引线框架。 第二导电元件的第三端子电连接到底部引线框架，并且第二导电元件的第四端子电连接到顶部引线框架。 在一个实施例中，散热装置设置在顶部引线框架上。 在一个实施方案中，模塑料被设置成使得顶部引线框架的外部引线暴露在模塑料外部。

公开(公告)号：US20140327031A1

公开(公告)日：2014-11-06

申请号：US13965737

申请日：2013-08-13

Applicant: CYNTEC CO., LTD.

Inventor： Yi-Geng Li ,  Chung-Hsiung Wang ,  Hung-Ming Lin

IPC: H05K1/11 ,  H01L33/38

CPC classification number: H05K3/4061 ,  H01L23/15 ,  H01L23/49827 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H05K1/0293 ,  H05K1/116 ,  H05K1/167 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A current conducting element including a substrate, a through hole, an electrode layer and a conductor structure is provided. The through hole is disposed through the substrate and has a first opening. The electrode layer is disposed on the substrate. A portion of the first opening is exposed from the electrode layer. The conductor structure is disposed in the through hole and contacted with the electrode layer. The electrode layer and the conductor structure form a current conducting path.

Abstract translation: 提供了包括基板，通孔，电极层和导体结构的电流传导元件。 通孔设置在基板上并具有第一开口。 电极层设置在基板上。 第一开口的一部分从电极层露出。 导体结构设置在通孔中并与电极层接触。 电极层和导体结构形成电流传导路径。

公开(公告)号：US20140266533A1

公开(公告)日：2014-09-18

申请号：US14294164

申请日：2014-06-03

Applicant: CYNTEC CO., LTD.

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: H01F27/255 ,  H01F41/02

CPC classification number: H01F27/255 ,  B22F3/12 ,  B22F3/16 ,  B22F5/00 ,  B22F7/08 ,  H01F1/22 ,  H01F17/04 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/292 ,  H01F27/32 ,  H01F41/0246 ,  H01F2017/048 ,  H05K1/18

Abstract: An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire.

Abstract translation: 一种电子设备，包括第一磁粉; 第二磁性粉末，其中所述第一磁性粉末的平均粒径大于所述第二磁性粉末的平均粒径，其中所述第一磁性粉末的平均粒径与所述第二磁性粉末的平均粒径之比 粉末大于2，第一磁粉与第二磁粉混合; 以及埋入第一磁粉和第二磁粉的混合物中的导线; 其中第一磁粉和第二磁粉的混合物和埋在其中的导线组合在一起，在低于导线熔点的温度下形成整体磁体。

公开(公告)号：US08675333B2

公开(公告)日：2014-03-18

申请号：US13894160

申请日：2013-05-14

Applicant: Cyntec Co., Ltd.

Inventor： Chung-Hsiung Wang ,  Hung-Ming Lin ,  Lang-Yi Chiang ,  Wen-Shiang Luo ,  Kuo-Shu Chen

IPC: H02H5/00

CPC classification number: H02H5/00 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0065 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H2085/466

Abstract: A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting.

Abstract translation: 提供了包括基板，导电部分和第一辅助介质的保护装置。 导电部分由衬底支撑，其中导电部分包括电连接在第一和第二电极之间的金属元件。 金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。 第一辅助介质设置在金属元件和基板之间，其中第一辅助介质的熔点低于金属元件的熔点。 第一辅助介质有助于熔化时金属元件的断裂。

公开(公告)号：US08593248B2

公开(公告)日：2013-11-26

申请号：US13681394

申请日：2012-11-19

Applicant: Cyntec Co., Ltd.

Inventor： Tsung-Chan Wu

IPC: H01F5/00

CPC classification number: H05K7/026 ,  H01F3/08 ,  H01F5/00 ,  H01F17/043 ,  H01F27/02 ,  H01F27/24 ,  H01F27/2828 ,  H01F27/29 ,  H01F27/292 ,  H01F37/00 ,  H05K1/18

Abstract: An inductor includes a first core, a conducting wire, a second core and a first lead frame. There is an accommodating space formed on a first side of the first core and there is a recess portion formed on a second side of the first core, wherein the first side is opposite to the second side. The first core has a first height. The conducting wire is disposed in the accommodating space. The second core is disposed on the first side of the first core and covers the accommodating space. The first lead frame has an embedded portion embedded in the recess portion. The embedded portion has a second height. After embedding the embedded portion in the recess portion of the first core, a total height of the embedded portion and the first core is smaller than the sum of the first height and the second height.

Abstract translation: 电感器包括第一芯，导线，第二芯和第一引线框架。 在第一芯体的第一侧上形成有容纳空间，在第一芯体的第二侧形成有凹部，其中第一面与第二面相反。 第一个核心有一个高度。 导线布置在容纳空间中。 第二芯设置在第一芯的第一侧上并覆盖容纳空间。 第一引线框架具有嵌入在凹部中的嵌入部分。 嵌入部分具有第二高度。 在嵌入部分嵌入第一芯部的凹部中之后，嵌入部分和第一芯部的总高度小于第一高度和第二高度之和。

公开(公告)号：US08518190B2

公开(公告)日：2013-08-27

申请号：US12703495

申请日：2010-02-10

Applicant: Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: H01F1/14 ,  H01F1/153 ,  H01F17/04

CPC classification number: H01F27/255 ,  B22F3/12 ,  B22F3/16 ,  B22F5/00 ,  B22F7/08 ,  H01F1/22 ,  H01F17/04 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/292 ,  H01F27/32 ,  H01F41/0246 ,  H01F2017/048 ,  H05K1/18

Abstract: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.

Abstract translation: 提供了包括磁体和电线的电子设备。 磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。 第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

公开(公告)号：US08471668B2

公开(公告)日：2013-06-25

申请号：US13179884

申请日：2011-07-11

Applicant: Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu

Inventor： Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu

IPC: H01F5/00

CPC classification number: B65D83/206 ,  H01F17/0013 ,  H01F17/04

Abstract: A coil device includes a first coil pattern, a second coil pattern, an insulating layer, a magnetic covering element and a number of conductive pillars. The second coil pattern is disposed above the first coil pattern, and is spaced apart from the first coil pattern. The insulating layer covers the first coil pattern and the second coil pattern and defines an opening surrounded by the first coil pattern and the second coil pattern. The magnetic covering element covers the insulating layer and extends into the opening. The conductive pillars are disposed within the magnetic covering element and are exposed from a bottom side of the magnetic covering element. A portion of the conductive pillars are electrically connected to the first coil pattern, and another portion of the conductive pillars are connected to the second coil pattern. The coil device can be easily manufactured.

Abstract translation: 线圈装置包括第一线圈图案，第二线圈图案，绝缘层，磁性覆盖元件和多个导电柱。 第二线圈图案设置在第一线圈图案之上，并且与第一线圈图案间隔开。 绝缘层覆盖第一线圈图案和第二线圈图案，并且限定由第一线圈图案和第二线圈图案包围的开口。 磁性覆盖元件覆盖绝缘层并延伸到开口中。 导电柱设置在磁性覆盖元件内并从磁性覆盖元件的底侧露出。 导电柱的一部分电连接到第一线圈图案，并且导电柱的另一部分连接到第二线圈图案。 线圈装置可以容易地制造。

公开(公告)号：US20130141886A1

公开(公告)日：2013-06-06

申请号：US13754910

申请日：2013-01-31

Applicant: Cyntec Co., Ltd.

Inventor： DA-JUNG CHEN ,  CHAU-CHUN WEN ,  CHUN-TIAO LIU

IPC: H05K1/18 ,  H05K9/00 ,  H05K3/30 ,  H01F27/29

CPC classification number: H05K1/18 ,  H01F27/027 ,  H01F27/29 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H05K3/30 ,  H05K3/3421 ,  H05K9/00 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49071 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

公开(公告)号：US08338928B2

公开(公告)日：2012-12-25

申请号：US11847351

申请日：2007-08-30

Applicant: Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC: H01L23/02

CPC classification number: H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.

公开(公告)号：US20120274413A1

公开(公告)日：2012-11-01

申请号：US13097072

申请日：2011-04-29

Applicant: Shih-Hsien Tseng

Inventor： Shih-Hsien Tseng

IPC: H01P5/12 ,  H01C17/06

CPC classification number: H03H7/48 ,  H03H7/21 ,  H03H2001/0021 ,  Y10T29/49099

Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.

Abstract translation: 在本发明中，单片功率分配器用于将一对输入差分信号分成两对输出差分信号。 单片功率分配器具有两个输入端子，用于接收一对输入差分信号，并且它具有集成在一个单个芯片中的两个1/2功率分配器，以将一对输入差分信号分成两对输出差分信号 功率。 并且，单片功率分配器具有四个输出端子以输出两对输出差分信号。 在一个实施例中，第一个逐个功率分配器和第二个逐个功率分配器在基板的相同表面上制成。 在另一个实施例中，第一个逐个功率分配器和第二个逐个功率分配器在衬底的相对表面上制成。 单片功率分配器可以基于功率分配器电路的倒数特性用作功率组合器。