公开(公告)号：US07616452B2

公开(公告)日：2009-11-10

申请号：US11331969

申请日：2006-01-13

Applicant: James Douglas Wehrly, Jr. ,  Paul Goodwin ,  Russell Rapport

Inventor： James Douglas Wehrly, Jr. ,  Paul Goodwin ,  Russell Rapport

IPC: H05K1/11

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.

Abstract translation: 所提供的电路模块采用装有集成电路（IC）的灵活电路。 柔性电路围绕刚性衬底设置。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 柔性电路的应变消除部分优选地比柔性电路的布置集成电路的部分更少的层，并且还可以表现出比装有集成电路的柔性电路的部分更多的灵活性。 底物形式优选地由导热材料设计。

公开(公告)号：US07606042B2

公开(公告)日：2009-10-20

申请号：US11869644

申请日：2007-10-09

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K1/00

CPC classification number: G11C5/04 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two more conductive layers, and may have changes in the layered structure of have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.

Abstract translation: 多个DIMM电路或实例被呈现在单个模块中。 在一些实施例中，存储器集成电路（优选CSP）和伴随的AMB或伴随的存储器寄存器被布置在柔性电路的每一侧的两个场中的两个等级中。 柔性电路具有沿着一侧设置的扩展触点。 柔性电路围绕支撑衬底或板设置，以在构造的模块的每一侧上放置一个完整的DIMM电路或实例化。 在替代但也优选的实施例中，最靠近基板的柔性电路一侧的IC至少部分地设置在优选实施例中在基板中的窗口，凹穴或切口区域中。 其他实施例可以仅填充柔性电路的一侧，或者可以仅移除足够的衬底材料以减少但不消除整个衬底对整体轮廓的贡献。 柔性电路可以表现出一个或两个更多的导电层，并且可以具有分层的层状结构的变化。 其他实施例可能错开或偏移IC或包括更多数量的IC。

公开(公告)号：US20090229957A1

公开(公告)日：2009-09-17

申请号：US12379796

申请日：2009-03-02

Applicant: Takeshi Nishimiya ,  Yutaka Matsunaga

Inventor： Takeshi Nishimiya ,  Yutaka Matsunaga

IPC: H01H9/02

CPC classification number: H02K7/145 ,  B25F5/008 ,  H01L2924/0002 ,  H02K11/33 ,  H05K1/0203 ,  H05K7/20463 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2924/00

Abstract: An electrical power tool may include a switching device capable of controlling output power of a motor, a circuit board supporting the switching device, and a metal case receiving the circuit board. The switching device includes a conductive part and an insulated portion that is covered by an insulating covering material. The conductive part of the switching device contacts the circuit board The insulated portion of the switching device contacts the metal case via the insulating covering material.

Abstract translation: 电动工具可以包括能够控制电动机的输出功率的开关装置，支撑开关装置的电路板以及接收电路板的金属壳体。 开关装置包括被绝缘覆盖材料覆盖的导电部分和绝缘部分。 开关装置的导电部分接触电路板开关装置的绝缘部分经由绝缘覆盖材料接触金属壳体。

公开(公告)号：US20090168368A1

公开(公告)日：2009-07-02

申请号：US12396108

申请日：2009-03-02

Applicant: Elio MARIONI

Inventor： Elio MARIONI

IPC: H05K7/20 ,  H05K3/30

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

Abstract: The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die.

Abstract translation: 本发明涉及一种基本上包装状的分立电子部件，其类型包括主电源电路，主体或壳体，基本上平行六面体的电连接销和连接在主体内的所述电路的电连接销，并从所述主体突出以进行电连接 在电子印刷电路板上。 主体具有散热头部，其具有至少一个从主体出来并放置在平面上的表面，而销从主体突出出来，第一部分最初平行于平面延伸。 有利的是，在第一部分平行于平面之后，一对销具有基本上U形的弯曲，以便在焊接到散热中间管芯的步骤期间允许部件的更稳定的轴承。

公开(公告)号：US20090121342A1

公开(公告)日：2009-05-14

申请号：US12136117

申请日：2008-06-10

Applicant: Atsushi MINAKAWA ,  Mamoru SEKIYA ,  Norio UMEZU

Inventor： Atsushi MINAKAWA ,  Mamoru SEKIYA ,  Norio UMEZU

IPC: H01L23/36 ,  H01L21/58

CPC classification number: H01L23/4006 ,  H01L25/112 ,  H01L2023/4056 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/14 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.

Abstract translation: 根据本发明的优选实施例的半导体器件是包括主衬底和一个或多个子衬底的半导体器件，并且半导体器件包括安装在子衬底上的第一发热器件，安装到第一衬底的子衬底散热器 发热装置和安装在主基板上的主基板散热器，其中，辅助基板散热器和主基板散热器彼此固定，使得在子基板和主基板之间存在预定的位置关系 。

公开(公告)号：US07511969B2

公开(公告)日：2009-03-31

申请号：US11345910

申请日：2006-02-02

Applicant: James Douglas Wehrly, Jr.

Inventor： James Douglas Wehrly, Jr.

IPC: H05K1/11

CPC classification number: H05K1/141 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A circuit module is provided in which at least one secondary substrate and preferably two such secondary substrates are populated with integrated circuits (ICs). A rigid core substrate for the circuit module is comprised of a structural member and a connective member. In a preferred embodiment, the structural member is comprised of thermally conductive material while the connective member is comprised of conventional PWB material. The secondary substrate(s) are connected to the connective member with a variety of techniques and materials while, in a preferred embodiment, the connective member exhibits, in a preferred embodiment, traditional module contacts which provide an edge connector capability to allow the module to supplant traditional DIMMs.

Abstract translation: 提供了一种电路模块，其中至少一个辅助衬底，优选地两个这样的辅助衬底填充有集成电路（IC）。 用于电路模块的刚性芯基板由结构构件和连接构件组成。 在优选实施例中，结构构件由导热材料构成，而连接构件由常规PWB材料构成。 第二基底通过各种技术和材料连接到连接构件，而在优选实施例中，在优选实施例中，连接构件表现出传统的模块触点，其提供边缘连接器能力以允许模块 取代传统DIMM。

公开(公告)号：US20080316273A1

公开(公告)日：2008-12-25

申请号：US12142689

申请日：2008-06-19

Applicant: Toru Yamashita

Inventor： Toru Yamashita

IPC: B41J2/14 ,  H05K1/18

CPC classification number: H05K1/189 ,  B41J2/055 ,  B41J2/14209 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14491 ,  B41J2202/08 ,  H05K1/0203 ,  H05K1/182 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/1056 ,  H05K2201/10674

Abstract: An electronic apparatus includes an electrical load and a flexible wiring member, on which a circuit element is mounted, and which transmits a signal from an external signal source to the electrical load via the circuit element, by a plurality of electroconductive wires. The flexible wiring member is a band-shaped member, and on one surface of the flexible wiring member, an output electrode for connecting to the electrical load is formed in an area facing the electrical load and a connecting electrode for mounting the circuit element is formed in a drawing area in which the electroconductive wires are drawn from the electrical load. An opening is formed in the drawing area and the flexible wiring member is folded such that the circuit element is exposed, through the opening to a side of the other surface of the flexible wiring member.

Abstract translation: 电子装置包括电负载和柔性布线构件，电路元件安装在该电负载上，并且通过多根导电线将来自外部信号源的信号经由电路元件发送到电负载。 柔性布线构件是带状构件，并且在柔性布线构件的一个表面上，在面向电负载的区域中形成用于连接到电负载的输出电极，并且形成用于安装电路元件的连接电极 在导电线从电负载拉出的绘图区域中。 在绘图区域形成开口，并且柔性布线构件被折叠，使得电路元件通过开口暴露于柔性布线构件的另一个表面的一侧。

公开(公告)号：US20080307643A1

公开(公告)日：2008-12-18

申请号：US11818840

申请日：2007-06-15

Applicant: Wayne A. Sozansky

Inventor： Wayne A. Sozansky

IPC: H05K3/34

CPC classification number: H05K7/20509 ,  H01L23/42 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/1056 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00

Abstract: An improved process for assembling a plurality of power packages and a thermal heat sink to a printed circuit board involves securing the power packages to the heat sink before soldering the electrical leads of the power packages to the printed circuit board. The improved process allows the electrical leads of the power packages to move freely in lead holes in the printed circuit board as intimate planar surface to planar surface contact between the heat sink and the power packages is achieved, thereby eliminating or at least substantially reducing lead bending that occurs in conventional processes wherein attachment of the heat sink to the power packages occurs after the leads of the power packages have been soldered to the printed circuit board.

Abstract translation: 将多个功率封装和热散热器组装到印刷电路板的改进方法包括在将功率封装的电引线焊接到印刷电路板之前将功率封装固定到散热器。 改进的过程允许功率封装的电引线在印刷电路板的引线孔中自由移动，因为实现了散热器和功率封装之间的平坦的平坦表面到平坦的表面接触，从而消除或至少基本上减少了引线弯曲 这在常规工艺中发生，其中在功率封装的引线已经被焊接到印刷电路板之后发生散热器附接到功率封装。

公开(公告)号：US07459784B2

公开(公告)日：2008-12-02

申请号：US11961477

申请日：2007-12-20

Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

公开(公告)号：US07456047B2

公开(公告)日：2008-11-25

申请号：US11839120

申请日：2007-08-15

Applicant: Debendra Mallik ,  Robert L. Sankman

Inventor： Debendra Mallik ,  Robert L. Sankman

IPC: H01L21/50

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/49816 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H05K1/182 ,  H05K2201/09054 ,  H05K2201/1056 ,  H05K2201/10734 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method and apparatus for making a package having improved heat conduction characteristics and high frequency response. A relatively thick package substrate, such as copper, has a wiring layer bonded to one face, leaving the opposite face exposed, for example, to be a surface for connection to a heat sink. One or more chips are bonded to the wiring layer, and an array of connectors, such as solder balls are provided around the periphery of the chip(s) for connection to a printed circuit board. In some embodiments, the printed circuit board has a hole that the chip(s) extend into to allow smaller external-connection solder balls. In some embodiments, a second heat sink is connected to the back of the chip through the PCB hole.

Abstract translation: 一种用于制造具有改善的热传导特性和高频响应的封装的方法和装置。 诸如铜的相对厚的封装衬底具有结合到一个面的布线层，使相对的面露出，例如是用于连接到散热器的表面。 将一个或多个芯片接合到布线层，并且在芯片的周边周围设置连接器阵列（例如焊球），以连接到印刷电路板。 在一些实施例中，印刷电路板具有一个孔，芯片延伸进入以允许更小的外部连接焊球。 在一些实施例中，第二散热器通过PCB孔连接到芯片的背面。