公开(公告)号：US5384484A

公开(公告)日：1995-01-24

申请号：US21345

申请日：1993-02-22

Applicant: Werner Haug

Inventor： Werner Haug

IPC: G11C5/00 ,  H05K1/14 ,  H05K3/36 ,  H01L23/10 ,  H01L23/32

CPC classification number: H05K1/141 ,  H05K2201/049 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K3/368

Abstract: An electronic read-only memory module having an inner casing and an outer casing cap. The inner casing is located on a secondary circuit board from whose edge which projects laterally from the inner casing project contact elements for producing a plug contact with contact counterelements located on a circuit board of a device, which is to be equipped with the ROM module. The outer casing cap has lateral internal gaps which protectively receive the contact elements. Due to the fact that the free ends of the contact elements are set back inwardly with respect to the open edge of the outer casing cap, the contact elements are protected against damage. This also greatly simplifies the loading of a device with the ROM module, because as a result of a simple plugging movement numerous contact elements can be brought into reliable contact with the contact counterelements.

Abstract translation: 一种具有内壳和外壳盖的电子只读存储模块​​。 内部壳体位于二次电路板上，从其内侧突出的边缘突出的边缘，用于产生与设置有ROM模块的装置的电路板上的接触件的插头接触。 外壳盖具有侧向内部间隙，其保护性地接收接触元件。 由于接触元件的自由端相对于外壳盖的开口边缘向内设置，因此保护接触元件免受损坏。 这也极大地简化了装有ROM模块的装置，因为由于简单的堵塞运动，许多接触元件可以与接触件进行可靠的接触。

公开(公告)号：US5278524A

公开(公告)日：1994-01-11

申请号：US881427

申请日：1992-05-11

Applicant: Urban E. Mullen

Inventor： Urban E. Mullen

IPC: H01P3/08 ,  H05K1/00 ,  H05K1/02 ,  H05K3/22

CPC classification number: H01P3/088 ,  H05K1/0219 ,  H05K1/0246 ,  H05K3/222 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0287 ,  H05K1/0298 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10022 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10689

Abstract: A multi-layered printed circuit board for mounting and interconnecting the terminals of multi-terminal electronic components. The circuit board mounts the electronic components one side of the circuit board and provides for interconnecting the terminals of the electronic components. A transmission line arrangement is configured from layers of the circuit board for distributing a signal with fast rise and fall times to electronic components mounted on the circuit board. The transmission line arrangement includes a narrow conductive strip surrounded by four constant voltage conductors spaced from the narrow conductive strip by dielectric material. The constant voltage conductors comprise a first planar conductive layer above the narrow conductive strip and spaced therefrom by one of the dielectric layers, a second planar conductive layer below the narrow conductive strip and spaced therefrom by the other dielectric layer, and a pair of coplanar conductive strips between the two layers of dielectric material and lying parallel to and coplanar with the narrow conductive strip, one on each side of the narrow conductive strip. The invention additionally encompasses a panel board embodiment in which the transmission line arrangement, including at least two constant voltage planes surrounding the narrow conductive strip, is embedded in the multi-layered board.

Abstract translation: 一种用于安装和互连多端子电子部件的端子的多层印刷电路板。 电路板将电子部件的一侧安装在电路板的一侧，并且用于互连电子部件的端子。 传输线布置由电路板的层构成，用于将具有快速上升和下降时间的信号分配到安装在电路板上的电子部件。 传输线布置包括由四个恒电压导体围绕的狭窄导电条，该导电条通过电介质材料与窄导电条间隔开。 所述恒压导体包括位于所述窄导电条上方的第一平面导电层，并且通过所述介电层中的一个间隔开所述第一平面导电层，所述第二平面导电层位于所述窄导电带下方并与其另一介电层隔开的第二平面导电层，以及一对共面导电 在两层电介质材料之间并且与窄导电条平行并共面并且与窄导电条的每一侧平行放置。 本发明另外包括面板基板实施例，其中包括围绕窄导电条的至少两个恒定电压平面的传输线布置被嵌入在多层板中。

公开(公告)号：US4882656A

公开(公告)日：1989-11-21

申请号：US258242

申请日：1988-10-14

Applicant: L. William Menzies, Jr. ,  Stephen W. Menzies

Inventor： L. William Menzies, Jr. ,  Stephen W. Menzies

IPC: H01G4/228 ,  H01G2/06 ,  H01G4/35 ,  H01G4/40 ,  H01L23/64 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10

CPC classification number: H01G2/065 ,  H01G4/35 ,  H01G4/40 ,  H01L23/642 ,  H05K1/0231 ,  H05K1/141 ,  H05K7/1092 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10939 ,  H05K3/3447 ,  H05K3/368 ,  Y02P70/611

Abstract: A decoupling capacitor is mounted on a thin auxiliary board and connected by metallization traces on the board to a single pair of plug-in contacts press-fitted into a pair of apertures in a pair of integral tabs extending from the board. The auxiliary board and capacitor height is not more than about 0.070 inches. The plug-in contacts are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board with its attached capacitor is sandwiched between a surface of a printed circuit board having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package. At least two leads of the DIP package are inserted into the pair of insertable contacts in the auxliary isulative board while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board. In one embodiment, other DIP leads pass through clearance holes in a second pair of integral tabs. Another embodiment provides for redundant capacitors each connected to separate pairs of contacts on the auxiliary board for interconnection of two ground leads and two power leads of the DIP to respective PC board sockets.

Abstract translation: 去耦电容器安装在薄的辅助板上，并通过板上的金属化迹线连接到一对插入式触点，该插入式触点压配合到从板延伸的一对整体的一对孔中的一对孔中。 辅助板和电容器高度不超过约0.070英寸。 插入式触点可插入印刷电路板中的一对插座中。 具有附加电容器的辅助绝缘板被夹在具有多个插座的印刷电路板的表面和双列直插（DIP）集成电路封装的下侧之间。 DIP封装的至少两个引线插入辅助绝缘板中的一对可插入触点中，而其余DIP封装引线直接插入到印刷电路板的其他插槽中。 在一个实施例中，其它DIP引线通过第二对整体接头中的间隙孔。 另一个实施例提供了冗余电容器，每个冗余电容器连接到辅助板上的分离的触点对，用于将两个接地引线和DIP的两个电源引线互连到相应的PC板插槽。

公开(公告)号：US4524240A

公开(公告)日：1985-06-18

申请号：US523766

申请日：1983-08-17

Applicant: Rodney D. Stock ,  Gary H. Newman

Inventor： Rodney D. Stock ,  Gary H. Newman

IPC: H05K1/00 ,  H05K3/22 ,  H05K1/02

CPC classification number: H05K1/0295 ,  H05K1/029 ,  H05K1/0287 ,  H05K1/0298 ,  H05K2201/09954 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10689 ,  H05K3/222

Abstract: A universal multilayer circuit prototyping board is provided having a predefined universal pattern of socket pin perforations which accommodates all standard DIP integrated circuit packages at virtually any position on the board. The universal board allows high density circuit packing while maintaining excellent electrical performance with high speed circuits.

Abstract translation: 提供通用多层电路原型板，其具有预定义的插座针穿孔通用图案，其在板上几乎任何位置处容纳所有标准DIP集成电路封装。 通用板允许高密度电路封装，同时通过高速电路保持优异的电气性能。

公开(公告)号：US4494172A

公开(公告)日：1985-01-15

申请号：US343576

申请日：1982-01-28

Applicant: Burton Leary ,  Shaun Silverio

Inventor： Burton Leary ,  Shaun Silverio

IPC: H01R12/16 ,  H01L23/52 ,  H01R12/34 ,  H01R33/76 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/22 ,  H05K3/46

CPC classification number: H05K3/4641 ,  H05K3/222 ,  H05K1/0231 ,  H05K1/0287 ,  H05K1/162 ,  H05K2201/0191 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2201/10333

Abstract: A panel board has a first voltage layer sandwiched between two ground layers at a close spacing to produce a large distributed capacitance; the two ground layers are connected by plated-through conductive holes spaced regularly across the board; a second (exposed) voltage layer is connected by regularly spaced plated-through holes to the first voltage layer, increasing the current carrying capacity of, and reducing the resistance across, the board; the plated-through holes are arranged in rows and columns in a pattern permitting the mounting of decoupling capacitors, at any point on the board, in a position parallel to the rows or parallel to the columns; and a socket terminal can be electrically connected directly to the exposed voltage layer or to the exposed ground layer using a ring connector.

Abstract translation: 面板板具有紧密间隔夹在两个接地层之间的第一电压层，以产生大的分布电容; 两个接地层通过穿过板间隔开的镀通孔导电孔连接; 第二（曝光）电压层通过规则间隔的电镀通孔连接到第一电压层，增加板的电流承载能力和降低电阻; 电镀通孔以行和列布置，允许在板上的任何点处安装去耦电容器，平行于行或平行于列的位置; 并且插座端子可以使用环形连接器直接电连接到暴露的电压层或暴露的接地层。

公开(公告)号：US4442938A

公开(公告)日：1984-04-17

申请号：US477622

申请日：1983-03-22

Applicant: James V. Murphy

Inventor： James V. Murphy

IPC: B23P19/02 ,  B23P19/00 ,  B23P21/00 ,  B65D73/00 ,  H01R4/02 ,  H01R43/20 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04 ,  B65D73/02 ,  B65D85/24

CPC classification number: B65D73/0042 ,  H01R12/58 ,  H01R12/65 ,  H05K3/306 ,  H01R4/02 ,  H01R43/205 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2203/0195 ,  Y10T29/4987 ,  Y10T29/49876

Abstract: An improved method and construction for positioning a plurality of socket terminals on an electrical circuit board in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material is provided with a plurality of holes in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head including an intermediate groove such that the heads extend into the holes and are adapted for frictional snap engagement with the sheet. The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the board. Thereafter, the sheet may be removed. The enlarged head of the circuit terminal is provided with leading edge sheet contacting surface to enable the terminals to be push positioned into the holes without injuring the sheet.

Abstract translation: 一种改进的方法和结构，用于在与焊料连接之前以预定配置将多个插座端子定位在电路板上。 电绝缘的，柔性的，树脂的塑料材料片具有阵列中的多个孔，其符合电路板上插座的期望定位。 插座端子设置有包括中间槽的扩大的大致圆柱形的头部，使得头部延伸到孔中并且适于与片材摩擦卡扣接合。 由此临时保持的具有插座阵列的片材定位在电路板上，然后通常将其焊接以将插座电气和机械地固定到电路板。 此后，可以去除片材。 电路端子的扩大头部设置有前缘片接触表面，以使端子能够被推入定位到孔中而不损伤片材。

公开(公告)号：US4149764A

公开(公告)日：1979-04-17

申请号：US844516

申请日：1977-10-20

Applicant: William R. Mattingly, Jr.

Inventor： William R. Mattingly, Jr.

IPC: H05K1/14 ,  H05K3/30 ,  H05K3/36

CPC classification number: H05K3/368 ,  H01R12/523 ,  H05K1/144 ,  H05K2201/10333 ,  H05K2201/10962 ,  H05K3/308

Abstract: A stack of printed circuit boards are mechanically and electrically interconnected by a plurality of double ended contact members mounted in coaxial relationship in the boards. Each double ended contact member comprises a shrouded pin contact having a socket contact extending in a direction opposite to the pin contact. The socket contact of one double ended contact member in one board slidably engages with the shrouded pin contact of the double ended contact member in the next adjacent board. The contact members in the respective boards have cooperating standoff shoulders which space the boards apart a predetermined distance.

Abstract translation: 印刷电路板的堆叠通过以板状的同轴关系安装的多个双端触点构件机械地和电气地互连。 每个双端接触构件包括具有在与销接触件相反的方向延伸的插座接触件的被覆盖的销触头。 一个单板中的一个双端接触构件的插座触点与下一个相邻板中的双端接触构件的被覆盖的销触点可滑动地接合。 相应板中的接触构件具有将板分隔开预定距离的配合的支座。

公开(公告)号：US3880486A

公开(公告)日：1975-04-29

申请号：US33783873

申请日：1973-03-05

Applicant: EPIS CORP

Inventor： AVAKIAN EMIK A

IPC: H01R12/71 ,  H05K3/30 ,  H05K7/12

CPC classification number: H05K3/308 ,  H01R12/58 ,  H01R12/714 ,  H05K2201/0314 ,  H05K2201/10333 ,  H05K2201/10962

Abstract: A connector element or plug for use in circuit boards is a double-ended plug with an interconnecting shank between the larger head portion at one end and a smaller head or retainer portion at the other end, and this plug is positioned in a hole in a circuit board with the larger head overlying one surface of the board and a circuit thereon, and with the retainer extending beyond the hole at the opposite side of the board to hold the plug in position. The connector element establishes an electrical connection from the circuit contacted thereby to another circuit or to another connector element in another circuit board overlying the first board. Alternatively, the connector element has a central recess to receive a connector pin from a circuit external to the circuit board as, for example, a pin in a dualin-line package or a contact on a leadless IC package and makes a connection from said pin to the circuit on the board contacted by the connector element.

Abstract translation: 用于电路板的连接器元件或插头是双头插头，在一端的较大的头部之间具有互连柄，另一端具有较小的头部或保持器部分，并且该插头位于 电路板，其中较大的头部覆盖在板的一个表面上，并且其上具有电路，并且保持器延伸超过板的相对侧处的孔以将插头保持在适当位置。 连接器元件从与其接触的电路建立电连接到另一个电路或覆盖在第一板上的另一个电路板中的另一个连接器元件。 或者，连接器元件具有中心凹部，以从电路板外部的电路接收连接器引脚，例如作为双列直插封装的引脚或无引线IC封装上的触点，并从 所述引脚连接到由连接器元件接触的板上的电路。

公开(公告)号：US3865455A

公开(公告)日：1975-02-11

申请号：US42243673

申请日：1973-12-06

Applicant: DU PONT

Inventor： BERG QUENTIN

IPC: H01R12/58 ,  H05K3/34 ,  H01R9/12 ,  H01R11/00 ,  H05K1/02

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H05K2201/10333 ,  H05K2201/2081

Abstract: A tubular circuit board socket having an open end to receive a lead with a non-solder adherent collar surrounding the open end to prevent molten solder from flowing through the open end into the interior of the socket during wave soldering.

Abstract translation: 一种管状电路板插座，其具有开口端，用于接收具有围绕开口端的非焊料粘附环的引线，以防止熔融焊料在波峰焊期间流过插座的内部。

公开(公告)号：US2994058A

公开(公告)日：1961-07-25

申请号：US73889858

申请日：1958-05-29

Applicant: SANDERS ASSOCIATES INC

Inventor： DAHLGREN VICTOR F

IPC: H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/326 ,  H05K1/118 ,  H05K3/3405 ,  H05K2201/10333 ,  H05K2201/10984 ,  H05K2203/0315 ,  H05K2203/0415 ,  H05K2203/1189 ,  Y10T29/49124