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    Single layer capacitor with dissimilar metallizations
    111.
    发明授权
    Single layer capacitor with dissimilar metallizations 有权
    具有不同金属化的单层电容器

    公开(公告)号：US06917509B1

    公开(公告)日：2005-07-12

    申请号：US10301335

    申请日：2002-11-21

    Applicant: Daniel F. Devoe ,  Lambert Devoe ,  Alan D. Devoe

    Inventor： Daniel F. Devoe ,  Lambert Devoe ,  Alan D. Devoe

    IPC: H01G2/06 ,  H01G4/228 ,  H05K3/32 ,  H05K3/34 ,  H01G4/008 ,  H01G4/06

    CPC classification number: H01G4/228 ,  H01G2/065 ,  H01L2224/48091 ,  H01L2924/19107 ,  H05K3/328 ,  H05K3/341 ,  H05K2201/10643 ,  H05K2201/10659 ,  H05K2201/10909 ,  H05K2203/049 ,  H01L2924/00014

    Abstract: A single layer ceramic capacitor for wire bonding or solder or epoxy attachment wherein a bottom metallization is of a lesser purity than a top metallization whereby the bottom metallization may be effectively soldered without leaching of the metal and the top metallization may be wire bonded. In an exemplary embodiment, the top metallization is essentially pure gold and the bottom metallization is an alloy of gold and platinum and/or palladium. The top and bottom metallizations are provided on a dielectric body that advantageously comprises a ceramic having a sintering temperature below the melting point of gold. In a further exemplary embodiment, the capacitance of the capacitor may be enhanced by providing one or more interior metallization planes parallel to the exterior metallizations and connected thereto by conductive vias.

    Abstract translation: 用于引线接合或焊料或环氧树脂附着的单层陶瓷电容器，其中底部金属化的纯度比顶部金属化的纯度低，由此底部金属化可以有效地焊接而不会浸出金属，并且顶部金属化可以是引线键合的。 在示例性实施例中，顶部金属化基本上是纯金，底部金属化是金和铂和/或钯的合金。 顶部和底部金属化物提供在电介质体上，其有利地包括具有低于金熔点的烧结温度的陶瓷。 在另一示例性实施例中，可以通过提供一个或多个内部金属化平面平行于外部金属化并通过导电通孔与其连接的电容来增强电容器的电容。

    Electrical devices
    113.
    发明申请
    Electrical devices 有权
    电气设备

    公开(公告)号：US20040246092A1

    公开(公告)日：2004-12-09

    申请号：US10721478

    申请日：2003-11-25

    Inventor： Gregory A. Graves ,  Michael Mengruo Zhang ,  Daniel Chandler ,  Chi-Ming Chan ,  Shou-Mean Fang ,  Dennis Siden ,  Mark Thompson

    IPC: H01C007/10

    CPC classification number: H05K1/184 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H01C17/06586 ,  H05K1/182 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613 ,  Y10T29/49085 ,  Y10T29/49101 ,  Y10T29/49103

    Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals. Preferably preferred devices contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes. The cross-conductor permits connection to both electrodes from the same side of the device, and also makes it possible to carry out the steps for preparing such devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.

    Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，所述装置包括（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分和主体部分 电阻元件的一部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 与电阻元件的主要部分。 这样的装置可以以各种方式固定到电路板，并且可弹性变形的端子。 优选地，优选的装置包含两个层状电极，其间具有PTC元件，并且穿过该器件的厚度并且仅与两个电极中的一个接触的交叉导体。 交叉导体允许从设备的同一侧连接到两个电极，并且还使得可以在对应于多个单独设备的组件上执行用于准备这样的设备的步骤，将组件划分为 最后一步。

    Optical detector-preamplifier subassembly
    116.
    发明申请
    Optical detector-preamplifier subassembly 审中-公开
    光学检测器 - 前置放大器子组件

    公开(公告)号：US20020134919A1

    公开(公告)日：2002-09-26

    申请号：US09816984

    申请日：2001-03-24

    Inventor： Theodore E. Washburn ,  Harvey B. Serreze

    IPC: G02B006/42

    CPC classification number: G02B6/4201 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/49113 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/10643 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A detector-preamplifier subassembly for an optical receiver comprising a header base having a top surface and a bottom surface, a plurality of leads passing through the top and bottom surfaces of the header base, a preamplifier mounted to the top surface of the header base, a standoff mounted to the top surface of the header base, a photodetector mounted to the standoff, and said standoff comprising a single-layer capacitor, wherein the single-layer capacitor functions as both a capacitor for the detector-preamplifier subassembly and a standoff for properly positioning the photodetector above the top surface of the header base. In this manner, the separate capacitors and several wire bonds are eliminated, thus increasing available surface area on the header base and improving performance and reliability of the detector-preamplifier subassembly and the optical receiver.

    Abstract translation: 一种用于光学接收器的检测器前置放大器子组件，包括具有顶表面和底表面的头部基座，穿过头部基座的顶表面和底表面的多个引线，安装到头部基座的顶表面的前置放大器， 安装到集管基座的顶表面上的隔离物，安装到支架的光电检测器，所述支架包括单层电容器，其中单层电容器用作检测器 - 前置放大器子组件的电容器和用于 将光电检测器正确地定位在标头基座的顶表面之上。 以这种方式，消除了单独的电容器和几个引线键，从而增加了头部基座上的可用表面积，并提高了检测器 - 前置放大器子组件和光接收器的性能和可靠性。

    Thin-profile battery circuits and constructions, button-type battery circuits and constructions, methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions
    117.
    发明授权
    Thin-profile battery circuits and constructions, button-type battery circuits and constructions, methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions 有权
    薄型电池电路和结构，按钮式电池电路和结构，薄型电池电路和结构的形成方法以及形成钮扣型电池电路和结构的方法

    公开(公告)号：US6080509A

    公开(公告)日：2000-06-27

    申请号：US255057

    申请日：1999-02-22

    Applicant: Mark E. Tuttle

    Inventor： Mark E. Tuttle

    IPC: H01M2/10 ,  H01M2/20 ,  H01M6/42 ,  H02J7/00 ,  H04B1/38 ,  H05K3/32 ,  H01M2/24 ,  H01M6/12

    CPC classification number: H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H02J7/0024 ,  H05K3/321 ,  H01M6/42 ,  H04B1/3883 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

    Abstract: Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections. An electrical insulator is disposed about a portion of only one of the batteries.

    Abstract translation: 描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。 在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。 至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。 电绝缘体围绕仅一个电池的一部分设置。

    Method of manufacturing hybrid integrated circuit
    120.
    发明授权
    Method of manufacturing hybrid integrated circuit 失效
    制造混合集成电路的方法

    公开(公告)号：US5113579A

    公开(公告)日：1992-05-19

    申请号：US575144

    申请日：1990-08-29

    Applicant: Raymond DiBugnara

    Inventor： Raymond DiBugnara

    IPC: H05K1/18 ,  H05K3/34 ,  H05K3/40

    CPC classification number: H05K1/184 ,  H05K3/3478 ,  H05K2201/10643 ,  H05K2203/0415 ,  H05K3/3442 ,  H05K3/4046 ,  Y10T29/49144 ,  Y10T29/49155

    Abstract: A hybrid integrated circuit apparatus includes an electrical circuit component, having first and second leads connected thereto, disposed within an aperture extending from a first surface to a second surface of a circuit board, the circuit board having on each surface a circuit element bonded adjacent the aperture. A disk of fusible material, sized and positioned to fully extend over the aperture and partially over the circuit element, is melted and reformed in place, under vacuum conditions, so as to mechanically couple the electrical component within the board aperture, provide an electrical contact between the component lead and the circuit element, and hermetically seal the component within the circuit board.

    Abstract translation: 一种混合集成电路装置，包括电路部件，其具有连接到其上的第一和第二引线，设置在从电路板的第一表面延伸到第二表面的孔内，所述电路板在每个表面上具有邻近所述电路元件的电路元件 光圈。 尺寸和定位为完全延伸在孔上并部分地在电路元件上方的可熔材料的盘在真空条件下熔化并重新定位，以便在电路板孔内机械耦合电气部件，提供电接触 在组件引线和电路元件之间，并且将电路板内的部件气密地密封。

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