公开(公告)号：US07365991B2

公开(公告)日：2008-04-29

申请号：US11403840

申请日：2006-04-14

Applicant: Matthew H. Aldrich ,  Jack C. Rains, Jr.

Inventor： Matthew H. Aldrich ,  Jack C. Rains, Jr.

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10651 ,  Y02P70/611

Abstract: Circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts of an LED of a first structural type, e.g. from a first product line or manufacturer. The other pad set is configured to mate with contacts of an LED of a second type, e.g. from a different product line or manufacturer. The layout may enable an easy system re-design, e.g. to shift from one type of LED to another. Alternatively, the layout may enable one system to use LEDs of the two different types in a single LED set or array. Exemplary systems disclosed herein include an element for mixing light produced by LEDs mounted to the landing zones, such as an optical integrating cavity.

Abstract translation: 照明系统的电路板具有印刷在板上的相同的LED着陆区。 每个区域包括至少两组LED接触焊盘。 一个焊盘组被配置为与第一结构类型的LED的触点（例如， 从第一个产品线或制造商。 另一个焊盘组被配置为与第二类型的LED的触点配合，例如， 来自不同的产品线或制造商。 该布局可以实现简单的系统重新设计，例如。 从一种类型的LED转移到另一种类型的LED。 或者，布局可以使得一个系统能够在单个LED组或阵列中使用两种不同类型的LED。 本文公开的示例性系统包括用于混合由安装到着陆区域的LED产生的光的元件，例如光学积分腔。

公开(公告)号：US20080061417A1

公开(公告)日：2008-03-13

申请号：US11936332

申请日：2007-11-07

Applicant: Shuichi TAKEUCHI

Inventor： Shuichi TAKEUCHI

IPC: H01L23/02

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3426 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: With a mounting structure for an IC tag where an IC chip for mounting (10) is mounted so as to be electrically connected to antenna patterns (44a), (44b), the assembly process that mounts the IC chip for mounting (10) on the antenna patterns (44a), (44b) is simplified, which makes it possible to reduce the manufacturing cost of IC tags. The IC chip for mounting 10 is formed by winding conductive wires (12a), (12b) so as to encircle an outer surface of an IC chip (20) between two opposite edges of the IC chip (20) in a state where the conductive wires (12a), (12b) mechanically contact electrodes formed on the IC chip (20) and are electrically connected to the electrodes, so that the IC chip for mounting (10) is joined to the antenna patterns (44a), (44b) via the conductive wires (12a), (12b).

Abstract translation: 通过安装用于安装（10）的IC芯片以便电连接到天线图案（44a），（44b）的IC标签的安装结构，安装用于安装的IC芯片的组装工艺（10 ）（44a），（44b）被简化，这使得可以降低IC标签的制造成本。 用于安装的IC芯片10通过以下方式形成：在（c）的（b）上缠绕导线（12a），以便在IC芯片（20）的两个相对边缘之间环绕IC芯片（20）的外表面， 所述导线（12a），（12b）机械地接触形成在所述IC芯片（20）上的电极，并与所述电极电连接，使得所述安装用IC芯片（10）与所述天线图案 ），（44b）经由导线（12a），（12b）。

公开(公告)号：US20070272433A1

公开(公告)日：2007-11-29

申请号：US11749480

申请日：2007-05-16

Applicant: Brian Gorrell ,  Austin A. Saylor

Inventor： Brian Gorrell ,  Austin A. Saylor

IPC: H05K1/11 ,  H05K3/30

CPC classification number: H05K1/183 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09036 ,  H05K2201/10174 ,  H05K2201/1053 ,  H05K2201/10651 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: An electrical assembly including a substantially planar substrate having at least one recess therein and a plurality of electrical components. The electrical components are positioned in the at least one recess and include a first electrical component and a second electrical component. Each of the electrical components has a body and an electrical connection. The electrical connection of the first electrical component and the electrical connection of the second electrical component are aligned with each other when the body of the first electrical component is in a recess and the body of the second electrical component is in a recess.

Abstract translation: 一种电气组件，包括其中具有至少一个凹部的基本平坦的基板和多个电气部件。 电气部件定位在至少一个凹部中并且包括第一电气部件和第二电气部件。 每个电气部件都具有主体和电气连接。 当第一电气部件的主体处于凹部中并且第二电气部件的主体处于凹部中时，第一电气部件的电连接和第二电气部件的电连接彼此对准。

公开(公告)号：US20070259576A1

公开(公告)日：2007-11-08

申请号：US11416700

申请日：2006-05-03

Applicant: Bruce Brandt ,  Cary Branstetter ,  Timothy Brooks ,  Shane Bode

Inventor： Bruce Brandt ,  Cary Branstetter ,  Timothy Brooks ,  Shane Bode

IPC: H01R13/02

CPC classification number: H05K3/202 ,  B60Q2900/10 ,  F21K9/00 ,  F21S43/13 ,  F21S43/14 ,  F21S43/195 ,  F21V19/001 ,  F21Y2115/10 ,  H05K1/184 ,  H05K3/326 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/10651

Abstract: Novel arrangements are disclosed that provide for replacement of printed circuit boards useful in regulating current for LEDs. In one embodiment, a conductive track is disclosed that forms a pattern for placement of electrical components. The track can be made out of any suitably conductive material and may be stamped, cut, or formed depending on the material type. The conductive track can conduct both electricity and heat. Portions of the conductive track can be removed creating a gap. Electrical components can be placed along the conductive track spanning the gap to create a circuit path. Other embodiments include wiring harnesses that contain embedded electrical components. The harnesses may occupy less space than some embodiments of the conductive track. An electrical connector may be provided to allow easy replacement of the LED.

Abstract translation: 公开了提供用于更换用于调节LED的电流的印刷电路板的新颖布置。 在一个实施例中，公开了形成用于放置电气部件的图案的导电轨道。 轨道可以由任何适当导电的材料制成，并且可以根据材料类型进行冲压，切割或成形。 导电轨道可以传导电和热。 可以去除导电轨道的部分，产生间隙。 电气部件可以沿着跨越间隙的导电轨道放置以产生电路路径。 其他实施例包括包含嵌入式电气部件的线束。 与导电轨道的一些实施例相比，线束可占据更少的空间。 可以提供电连接器以允许容易地更换LED。

公开(公告)号：US20070029572A1

公开(公告)日：2007-02-08

申请号：US11497233

申请日：2006-08-02

Applicant: Kyung Han ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

Inventor： Kyung Han ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

IPC: H01L33/00 ,  H01L21/00

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H05K3/3426 ,  H05K3/3494 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/1084 ,  H05K2203/0195 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The invention relates to an LED with an improved soldering structure, a method of assembling the LED to a PCB, and an LED assembly manufactured by the method. The LED includes an LED chip and a pair of leads with an end electrically connected the LED chip and the other end to be connected to an external power source, having a hole or a cutout part formed therein. The LED also includes a package body housing a part of the lead in the side of the LED chip, and a transparent lens placed on a surface of the package body in the side of the LED chip, for emitting light laterally. This improves soldering conditions for soldering with the other end of the lead placed on the solder, saving the amount of a solder paste while enhancing bonding strength after soldering.

Abstract translation: 本发明涉及具有改进的焊接结构的LED，将LED组装到PCB的方法以及通过该方法制造的LED组件。 LED包括LED芯片和一对引线，端部电连接LED芯片，另一端连接到外部电源，其中形成有孔或切口部分。 LED还包括容纳LED芯片侧的引线的一部分的封装体，以及位于LED芯片侧的封装体的表面上的透明透镜，用于横向发光。 这样可以提高钎焊焊接条件，同时提高焊接后的焊接强度。

公开(公告)号：US20060262510A1

公开(公告)日：2006-11-23

申请号：US11160393

申请日：2005-06-22

Applicant: Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

Inventor： Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

IPC: H05K7/06

CPC classification number: H05K1/18 ,  H05K1/0271 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic element module and an electronic device using the same are provided. The electronic element module includes a circuit board and a plurality of electronic elements. In one embodiment, the circuit board has a plurality of leg-holes. Each of the electronic elements includes a body and a plurality of legs that connected to the body. Wherein, the bodies of the electronic elements are glued each other, and the legs of the electronic elements are partially plugged in the leg-holes. In another one embodiment, the circuit board has a plurality of contacts. The electronic element is disposed on the circuit board with a gap therebetween. The electronic element has a plurality of terminals that electrically connect to the contacts of the circuit board correspondingly. Otherwise, the gap is filled with glue.

Abstract translation: 提供一种电子元件模块和使用其的电子装置。 电子元件模块包括电路板和多个电子元件。 在一个实施例中，电路板具有多个腿孔。 每个电子元件包括主体和连接到主体的多个腿。 其中，电子元件的主体彼此粘合，并且电子元件的腿部分地插入到腿孔中。 在另一个实施例中，电路板具有多个触点。 电子元件设置在电路板上，其间具有间隙。 电子元件具有多个端子，其相应地电连接到电路板的触头。 否则，缝隙填充胶水。

公开(公告)号：US20060181878A1

公开(公告)日：2006-08-17

申请号：US11354674

申请日：2006-02-15

Applicant: Greg Burkholder

Inventor： Greg Burkholder

IPC: F21V29/00

CPC classification number: H05K1/0206 ,  F21K9/00 ,  F21K9/20 ,  F21S43/14 ,  F21S43/19 ,  F21S45/47 ,  F21S45/49 ,  F21S48/328 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/42 ,  H05K2201/10106 ,  H05K2201/10651 ,  Y10S362/80

Abstract: An LED light module assembly for use with high power, high light output LED's includes a thin flexible circuit board with surface mounted LED's and other electronic components which is attached to a metal heat sink using a layer of a thermally conductive adhesive, such as a thermally conductive epoxy adhesive. A conduction path is provided from the LED carrier through the flexible circuit board by the incorporation of one or more thermally conductive vias in the region of the attachment pad used to bond the LED to the flexible circuit board. These vias provide a conduction path from the back side of the LED carrier through the circuit board to the thermally conductive adhesive and heat sink. The LED light module assembly has the capacity to dissipate between about 10-14 W of power without exceeding a maximum LED junction temperature of about 125° C.

Abstract translation: 一种用于大功率，高光输出LED的LED灯组件包括一个薄表面安装的LED和其他电子元件的柔性电路板，该电子元件使用一层导热粘合剂 导电环氧胶粘剂。 通过在用于将LED结合到柔性电路板的附接垫的区域中结合一个或多个导热通孔，通过柔性电路板从LED载体提供导电路径。 这些通孔提供从LED载体的背面通过电路板到导热粘合剂和散热器的导电路径。 LED灯模块组件具有在大约10-14W的功率之间消散的能力，而不超过约125℃的最大LED结温。

公开(公告)号：US07079399B2

公开(公告)日：2006-07-18

申请号：US11027215

申请日：2004-12-29

Applicant: Ping Wang ,  Yan-Fang Li

Inventor： Ping Wang ,  Yan-Fang Li

IPC: H05K7/06

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/10651 ,  H05K2203/1446

Abstract: A printed circuit board having improved solder pads for preventing from short circuit of the printed circuit board caused by axial leads (30, 31) of components engaging the circuit surrounding the soldering pad comprises a pair of through holes (10, 11), a pair of first pads (20, 21) surrounding corresponding through holes and a pair of second pads (40, 41) adjacent corresponding first pads. When components are inserted into the through holes of the printed circuit board using placement machines, bent portions of the axial leads that are extended out of the first pads will fall into the second pads.

Abstract translation: 一种具有改进的焊盘的印刷电路板，用于防止由围绕焊盘的电路的轴向引线（30,31）引起的印刷电路板的短路，包括一对通孔（10,11），一对 围绕对应的通孔的第一焊盘（20,21）和与相应的第一焊盘相邻的一对第二焊盘（40,41）。 当使用贴片机将部件插入印刷电路板的通孔时，从第一焊盘延伸出来的轴向引线的弯曲部分将落入第二焊盘。

公开(公告)号：US07029313B1

公开(公告)日：2006-04-18

申请号：US11132882

申请日：2005-05-19

Applicant: Jui-Ching Huang

Inventor： Jui-Ching Huang

IPC: H01R13/64

CPC classification number: H05K3/301 ,  H05K3/306 ,  H05K2201/10424 ,  H05K2201/10454 ,  H05K2201/10606 ,  H05K2201/10651

Abstract: An auxiliary device is used for assisting electrical connection between pins of an electronic component and corresponding contact portions of a printed circuit board. The auxiliary device includes a main body and a plurality of connection parts. The main body has a plurality of perforations for the pins to penetrate therethrough. The connection parts are coupled to the main body and penetrate through corresponding retaining holes of the printed circuit board such that the main body is fixed on the printed circuit board. The pins of the electronic component penetrate through corresponding perforations of the main body and are in contact with corresponding contact portions of the printed circuit board.

Abstract translation: 辅助装置用于辅助电子部件的销和印刷电路板的对应的接触部分之间的电连接。 辅助装置包括主体和多个连接部。 主体具有多个用于销穿透的穿孔。 连接部分联接到主体并穿过印刷电路板的相应的保持孔，使得主体固定在印刷电路板上。 电子部件的销穿透主体的相应穿孔并与印刷电路板的对应的接触部分接触。

公开(公告)号：US07005311B2

公开(公告)日：2006-02-28

申请号：US10723928

申请日：2003-11-26

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L21/00

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.