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公开(公告)号：US20100159257A1
公开(公告)日：2010-06-24
申请号：US12376370
申请日：2007-08-03
CPC分类号： H05K3/321 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3618 , B23K35/362 , H01B1/22 , H05K3/3484 , Y10T403/479 , Y10T428/31678
摘要： Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.
摘要翻译： 公开了一种焊接材料，其能够在安装电子部件时实现较低的安装温度。 还公开了焊膏和导电粘合剂。 具体公开了具有由Sn，Bi和In构成的基本组成的焊料。 该焊料材料还可含有选自Cu，Ge和Ni中的至少一种金属。 可以通过将助焊剂成分混合到焊料材料中来获得能够实现低温安装的焊膏。 可以通过将树脂成分混合到焊料材料中来获得能够实现低温安装的导电粘合剂。
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公开(公告)号：US20100127818A1
公开(公告)日：2010-05-27
申请号：US12532020
申请日：2008-03-04
IPC分类号： H01C1/08
摘要： A hoisting machine is provided that is capable of efficiently dissipating heat generated from an inverter incorporated in the hoisting machine main body into the surrounding air with a simple structure and hence capable of performing high-frequency operation.A hoisting machine having a load hoisting motor and a speed reduction mechanism and driving the load hoisting motor with an inverter 12 incorporated in the hoisting machine main body is provided with a heat dissipation means that dissipates heat generated from the inverter 12 to a speed reduction mechanism casing 15 that houses the speed reduction mechanism. The heat dissipation means is a means for attaching the inverter 12 directly to the speed reduction mechanism casing 15 in close contact therewith through surface contact at least a part of the inverter 12.
摘要翻译： 提供一种曳引机，其能够以简单的结构有效地将由曳引机主体内的逆变器产生的热量有效地散发到周围空气中，能够进行高频运转。 具有负载提升电动机和减速机构的曳引机具有并入曳引机主体的逆变器12驱动负载曳引电动机的散热装置具备将逆变器12产生的热量散发到减速机构 外壳15装有减速机构。 散热装置是通过与逆变器12的至少一部分的表面接触将逆变器12直接附接到与减速机构壳体15紧密接触的装置。
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公开(公告)号：US20090133900A1
公开(公告)日：2009-05-28
申请号：US11909886
申请日：2006-04-14
CPC分类号： H01L24/29 , C09J9/02 , H01L21/6835 , H01L24/83 , H01L24/95 , H01L2221/68354 , H01L2224/2919 , H01L2224/29499 , H01L2224/83101 , H01L2224/83136 , H01L2224/83192 , H01L2224/83859 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K3/284 , H05K3/323 , H05K2201/0108 , H05K2201/0281 , H05K2201/0373 , H05K2201/10636 , H05K2201/10674 , H05K2203/1476 , Y02P70/611 , Y10T29/49147 , Y10T428/24372 , Y10T428/254 , H01L2924/00
摘要： Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.
摘要翻译： 具有导线和连接端子的电路板; 设置在电路板的一个表面上的各向异性导电树脂层; 并且包括分别在面向连接端子的位置设置有电极端子的多个电子部件。 各向异性导电性树脂层包括选自线圈状导电性粒子，纤维绒毛状导电性粒子和设置有多个导电性突起的导电性粒子和树脂粘合剂中的至少一种导电性粒子， 将多个电子部件的电极端子与导电颗粒彼此连接到连接端子; 将电子元件和电路板彼此机械固定; 并保护导线。
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公开(公告)号：US20070277909A1
公开(公告)日：2007-12-06
申请号：US11660552
申请日：2005-09-06
IPC分类号： B23K35/34
CPC分类号： B23K35/362 , B23K35/0244 , B23K35/262 , B23K35/3613 , H05K3/3484 , H05K3/3489 , H05K2201/0224 , H05K2203/111
摘要： This invention provides such solder paste that prevents, when a minute-size passive component or a semiconductor integrated circuit element having a small terminal pitch is soldered by the solder paste, the solder particles from being oxidized to provide highly-reliable solder joint even when the solder paste is used in a very small amount. Specifically, solder paste obtained by mixing solder alloy powders with flux is structured so that the flux has, at a pre-heating temperature in a heating/melting step, a high temperature retention property by which the flux covers the surface of the solder alloy powders.
摘要翻译： 本发明提供了这样一种焊锡膏，当通过焊膏焊接具有小端子间距的微小的无源部件或半导体集成电路元件时，即使当焊料粒子被 焊膏的使用量很少。 特别地，通过将焊剂合金粉末与焊剂混合而获得的焊膏被构造成使得焊剂在加热/熔融步骤中的预热温度下具有保持焊剂覆盖焊料合金粉末表面的高温保持性能 。
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公开(公告)号：US20070114058A1
公开(公告)日：2007-05-24
申请号：US11653891
申请日：2007-01-17
IPC分类号： H05K1/16
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L2224/16 , H01L2224/24226 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/095 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K3/4664 , H05K2201/0187 , H05K2203/0568 , Y10T29/49124 , Y10T29/49126 , Y10T29/53874 , H01L2924/00
摘要： A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive circuit, and a second conductive circuit manufactured by hardening conductive paste material in a predetermined shape on the first insulating layer, wherein an electronic part built-in by the first insulating layer and second insulating layer is connected to the second conductive circuit, and the first conductive circuit is connected to the second conductive circuit through a via hole.
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公开(公告)号：US07180749B2
公开(公告)日：2007-02-20
申请号：US10727650
申请日：2003-12-05
IPC分类号： H05K1/18
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L2224/16 , H01L2224/24226 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/095 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K3/4664 , H05K2201/0187 , H05K2203/0568 , Y10T29/49124 , Y10T29/49126 , Y10T29/53874 , H01L2924/00
摘要： A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive circuit, and a second conductive circuit manufactured by hardening conductive paste material in a predetermined shape on the first insulating layer, wherein an electronic part built-in by the first insulating layer and second insulating layer is connected to the second conductive circuit, and the first conductive circuit is connected to the second conductive circuit through a via hole.
摘要翻译： 电路板包括作为基底层的基膜，通过在基膜上硬化形成为预定形状的导电糊料材料制成的第一导电电路，通过硬化形成在基膜上的绝缘膏材料而形成的第一绝缘层和 第一导电电路和通过在第一绝缘层上硬化具有预定形状的导电糊料材料制成的第二导电电路，其中由第一绝缘层和第二绝缘层内置的电子部件连接到第二导电电路，以及 第一导电电路通过通孔连接到第二导电电路。
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137.发明授权公开(公告)号：US07090502B2
公开(公告)日：2006-08-15
申请号：US11118403
申请日：2005-05-02
申请人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
发明人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
CPC分类号： H05K1/144 , H01L2224/16225 , H01L2924/19105 , H01R12/52 , H05K3/3426 , H05K2201/042 , H05K2201/10189 , H05K2201/10424 , H05K2201/2018
摘要： The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.
摘要翻译： 本发明包括由具有弹性弹性的导电材料制成的多个引线端子; 绝缘壳体，其埋设引线端子区域的一部分，并且在预先设置的布置中固定地保持多个引线端子。 引线端子由掩埋在壳体中的引线端子的一部分构成; 从埋藏部分的一端延伸的底端接头通过壳体的底端表面暴露，并在底端表面的宽度方向上提取; 以及通过与底端表面正交的一个壁面暴露于埋藏部分的另一端的柔性变化部分，并且沿着该壁表面延伸到面向底端表面的顶端表面，与壁表面和顶端表面间隔开 。
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138.发明授权Transparent conductive film for transparent touch panel, transparent touch panel using transparent conductive film, and method of manufacturing transparent conductive film 失效用于透明触摸屏的透明导电膜，使用透明导电膜的透明触摸面板，以及制造透明导电膜的方法公开(公告)号：US07060320B1
公开(公告)日：2006-06-13
申请号：US09486890
申请日：1999-07-06
CPC分类号： G06F3/045 , C01G19/006 , G06F3/0414 , H01B1/08 , Y10T428/1055 , Y10T428/24355
摘要： In a transparent conductive film for use in a transparent touch panel in which a lower electrode and an upper electrode are stacked so as to be spaced from each other by spacers, the transparent conductive film being provided on an electrode substrate of at least one of the electrodes and thereby forming the electrode, the transparent conductive film has, in its surface shape, an arithmetic mean roughness (Ra) within a range of 0.4 nm≦Ra≦4.0 nm and a root-mean-square roughness (Rms) within a range of 0.6 nm≦Rms≦3.0 nm.
摘要翻译： 在用于透明触摸面板的透明导电膜中，其中下电极和上电极通过间隔物彼此间隔堆叠，所述透明导电膜设置在电极基板上的至少一个 电极，从而形成电极，透明导电膜的表面形状为在0.4nm <= Ra <= 4.0nm的范围内的算术平均粗糙度（Ra）和内平均粗糙度（Rms） 0.6nm <= Rms <= 3.0nm的范围。
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公开(公告)号：US20050045379A1
公开(公告)日：2005-03-03
申请号：US10918274
申请日：2004-08-13
IPC分类号： H01L21/48 , H01L21/60 , H01L23/12 , H01L23/482 , H01L23/538 , H05K1/00 , H05K1/03 , H05K1/09 , H05K1/18 , H05K3/00 , H05K3/10 , H05K3/12
CPC分类号： H05K1/185 , H01L21/4846 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/16 , H01L2224/76155 , H01L2224/82102 , H01L2224/97 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1815 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H05K1/095 , H05K3/107 , H05K3/1258 , H05K2201/0129 , H05K2201/09036 , H05K2201/10674 , H05K2203/1189 , Y10T29/4913 , H01L2224/82 , H01L2924/00
摘要： Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.
摘要翻译： 对热塑性树脂膜进行热处理，最终成为绝缘树脂层，并将膜压在膜上形成凹槽的模具上。 接下来，从薄膜的背面将电子部件压配合到树脂薄膜中，从而从凹槽的底部露出部件的电极。 然后将薄膜冷却固化。 将薄膜剥离模具，然后用导电膏填充凹槽，并固化糊料以形成电路图案。 上述过程允许将电极与包含电子部件的电路板的电路图案正向地导通，并且在电路图案的布线之间实现更窄的间距。
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公开(公告)号：US06722264B2
公开(公告)日：2004-04-20
申请号：US10128496
申请日：2002-04-24
IPC分类号： A47J3100
CPC分类号： A47J39/003 , A47J31/4432
摘要： The present invention is composed of a drink extraction portion, a drink container for storing drink extracted by the drink extraction portion, a heat retention chamber surrounding the drink container, a fan for supplying air to the heat retention chamber for air circulation, and a heater for heating air supplied to the heat retention chamber by the fan to make warm air, the warm air heating the drink container to keep drink therein warm.
摘要翻译： 本发明包括饮料提取部分，用于储存由饮料提取部分提取的饮料的饮料容器，围绕饮料容器的保温室，用于将空气供给到用于空气循环的保温室的风扇，以及加热器 为了加热由风扇供给到保温室的空气以产生温暖的空气，暖气加热饮料容器以保持其中的饮料温暖。
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