公开(公告)号：US20240243001A1

公开(公告)日：2024-07-18

申请号：US18156217

申请日：2023-01-18

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chia-Yun CHENG ,  Kenichi SANO ,  Yu-Wei LU ,  Yi-Chen LO

IPC: H01L21/687 ,  B25J15/10 ,  H01J37/20 ,  H01J37/317 ,  H01L21/311 ,  H01L21/3115 ,  H01L21/683

CPC classification number: H01L21/68785 ,  B25J15/10 ,  H01J37/20 ,  H01J37/3171 ,  H01L21/31111 ,  H01L21/31155 ,  H01L21/6831 ,  H01J2237/0203 ,  H01J2237/2007

Abstract: An apparatus includes a supporting frame, a platform supported by the supporting frame and having a first side and a second side opposite to the first side, and at least three robot fingers which are mounted to the supporting frame, and which are angularly displaced from each other. Each of the robot fingers has a fingertip configured to retain a substrate on the first side of the platform such that the substrate is spaced apart from the platform. A method for manufacturing a semiconductor structure using the apparatus is also disclosed.

公开(公告)号：US20240222093A1

公开(公告)日：2024-07-04

申请号：US18093138

申请日：2023-01-04

Applicant: Applied Materials, Inc.

Inventor： Yaoying ZHONG ,  Siew Kit HOI ,  Bridger Earl HOERNER

IPC: H01J37/32 ,  C23C14/14 ,  C23C14/34 ,  C23C14/50 ,  C23C14/54

CPC classification number: H01J37/32724 ,  C23C14/14 ,  C23C14/34 ,  C23C14/50 ,  C23C14/54 ,  H01J2237/002 ,  H01J2237/2007 ,  H01J2237/24585 ,  H01J2237/332

Abstract: Methods, systems, and apparatus for controlling substrate temperature include: monitoring a temperature in each zone of a plurality of zones of a substrate support, the substrate support having a support surface for supporting a substrate, wherein the support surface is opposed to a sputtering target for depositing material onto the substrate; depositing material from the sputtering target on the substrate; and independently controlling fluid flowing in a plurality of separate fluid channels in the substrate support, each fluid channel corresponding to one zone of the plurality of zones, wherein fluid flow is controlled based on a target life and the temperature in each zone.

公开(公告)号：US20240222089A1

公开(公告)日：2024-07-04

申请号：US18090400

申请日：2022-12-28

Applicant: Intel Corporation

Inventor： Ala OMER ,  Peumie ABEYRATNE KURAGAMA ,  Jieying KONG ,  Wendy LIN ,  Ao WANG

IPC: H01J37/32 ,  H01L21/3105

CPC classification number: H01J37/32715 ,  H01L21/31058 ,  H01J2237/2007 ,  H01J2237/20235 ,  H01J2237/334 ,  H01J2237/3355 ,  H01J2237/336 ,  H01L21/02063

Abstract: This disclosure describes designs and methods for via cleaning, peeling protective film, and providing mild surface roughening and cleaning of a computer chip. A system may include a first electrode configured to generate plasma associated with cleaning vias by etching a residual material associated with smearing; an electrostatic stage configured to generate an electrostatic force associated with peeling the dielectric protective film from the semiconductor; and a stage on which the semiconductor is positioned while the electrostatic stage peels the dielectric protective film from the semiconductor, wherein the plasma is further associated with roughening a surface of the semiconductor after peeling the dielectric protective film from the semiconductor.

公开(公告)号：US20240212999A1

公开(公告)日：2024-06-27

申请号：US18394805

申请日：2023-12-22

Applicant: Semes Co., Ltd

Inventor： Sung Hyuk JUNG ,  Yong Seok JANG

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J2237/184 ,  H01J2237/2007 ,  H01J2237/24585 ,  H01L21/6833

Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for acquiring a temperature value in real time to apply to a process at a time point a process is completed, if measuring a temperature with respect to an electrostatic chuck (ESC) within a process chamber using a temperature analysis unit. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber including a housing at which a treating space is formed for process treating a substrate and a support unit positioned at the treating space and configured to support the substrate; and a temperature analysis unit configured to detect a temperature information of the support unit while mounted on the support unit and transmitting a detected temperature information to the process chamber, and wherein the process chamber controls a temperature of the support unit based on the temperature information.

公开(公告)号：US12020911B2

公开(公告)日：2024-06-25

申请号：US17975452

申请日：2022-10-27

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Kumar ,  Ganesh Balasubramanian ,  Vivek Bharat Shah ,  Jiheng Zhao

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/50 ,  C23C16/52

CPC classification number: H01J37/32715 ,  C23C16/4583 ,  C23C16/50 ,  C23C16/52 ,  H01J37/321 ,  H01J2237/2007 ,  H01J2237/24564 ,  H01J2237/3321

Abstract: The present disclosure relates to methods and systems for chucking in substrate processing chambers. In one implementation, a method of chucking one or more substrates in a substrate processing chamber includes applying a chucking voltage to a pedestal. A substrate is disposed on a support surface of the pedestal. The method also includes ramping the chucking voltage from the applied voltage, detecting an impedance shift while ramping the chucking voltage, determining a corresponding chucking voltage at which the impedance shift occurs, and determining a refined chucking voltage based on the impedance shift and the corresponding chucking voltage.

公开(公告)号：US20240203705A1

公开(公告)日：2024-06-20

申请号：US18081388

申请日：2022-12-14

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh CHADHA ,  Christopher BEAUDRY

IPC: H01J37/32 ,  G03F7/20

CPC classification number: H01J37/32715 ,  G03F7/202 ,  H01J2237/2007 ,  H01J2237/332

Abstract: A substrate support for use in a processing chamber to hold a substrate thereon includes a substrate support body, and a plurality of mesas on recessed surfaces of the substrate support body, wherein heights of the plurality of mesas from the recessed surfaces vary over the substrate support body between at least two different heights.

公开(公告)号：US12009245B2

公开(公告)日：2024-06-11

申请号：US17457092

申请日：2021-12-01

Applicant: NGK INSULATORS, LTD.

Inventor： Masaki Ishikawa ,  Yuji Akatsuka ,  Kenji Yonemoto

IPC: H01L21/683 ,  B23Q3/15 ,  C09J5/06 ,  H01J37/32 ,  H01L21/67 ,  H02N13/00

CPC classification number: H01L21/6833 ,  B23Q3/15 ,  C09J5/06 ,  H01J37/32697 ,  H01J37/32715 ,  H01L21/67109 ,  H02N13/00 ,  C09J2203/326 ,  H01J2237/2007 ,  H01L21/67103

Abstract: A member for semiconductor manufacturing apparatus, includes: a ceramic plate having a wafer placement surface; a plug receiving hole formed in a surface of the ceramic plate opposite to the wafer placement surface; a gas outlet port extending through a bottom wall of the plug receiving hole; a plug received in the plug receiving hole; and a gas flow path disposed inside the plug to be continuous with the gas outlet port, wherein a stepped portion is disposed on a side surface of the plug or an inner surface of the plug receiving hole, the plug receiving hole and the plug are in contact with each other in an area deeper than the stepped portion, a gap is formed between the plug receiving hole and the plug in an area shallower than the stepped portion, and a plug support member made of an adhesive material is formed in the gap.

公开(公告)号：US12009235B2

公开(公告)日：2024-06-11

申请号：US17109019

申请日：2020-12-01

Applicant: Applied Materials, Inc.

Inventor： Chuang-Chia Lin ,  Wenwei Qiao

IPC: H01L21/67 ,  C23C16/52 ,  G01F15/06 ,  G01F15/063 ,  G01F15/14 ,  G01L15/00 ,  G01L19/08 ,  G01L19/14 ,  G01N25/18 ,  H01J37/32

CPC classification number: H01L21/67253 ,  C23C16/52 ,  G01F15/063 ,  G01F15/14 ,  G01L15/00 ,  G01L19/086 ,  G01L19/14 ,  G01N25/18 ,  H01J37/32715 ,  H01J37/32935 ,  H01J37/32082 ,  H01J2237/2007 ,  H01J2237/3343 ,  H01L21/67069

Abstract: A sensor assembly that includes a substrate and a set of sensors. The set of sensor includes pressure sensor and/or flow sensors located across a surface of the substrate. Each respective sensor of the plurality of sensor is adapted to measure a respective pressure or a respective flow of an environment proximate the respective sensor. Each respective sensor of the plurality of sensor may further be adapted to output a respective signal associated with the measured respective pressure or the measured respective flow. The respective signals associated with the measured respective pressure or the measured respective flows measured by the plurality of sensor together provide a pressure distribution across the surface of the substrate and/or a flow distribution across the surface of the substrate.

公开(公告)号：US20240183029A1

公开(公告)日：2024-06-06

申请号：US18376202

申请日：2023-10-03

Applicant: Samsung Display Co., LTD.

Inventor： HYUNEOK SHIN ,  JOONYONG PARK

IPC: C23C14/56 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34

CPC classification number: C23C14/568 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32715 ,  H01J37/3429 ,  H01J37/3435 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/332 ,  H01L27/1259

Abstract: A deposition apparatus includes a chamber in which an inner space is defined, a movement device which moves a substrate to which a deposition material is provided, and a deposition source which is accommodated in the inner space and provides the deposition material. The deposition source includes a first deposition source which performs a first deposition process while the substrate is moved in a first direction by the movement device and a second deposition source which performs a second deposition process on the substrate after the first deposition process.

公开(公告)号：US20240179833A1

公开(公告)日：2024-05-30

申请号：US18429427

申请日：2024-02-01

Applicant: WIT CORPORATION ,  FINE SEMITECH CORP.

Inventor： Jae Hwan KIM ,  Jae Won OH

IPC: H05K1/02 ,  H01J37/32 ,  H05K3/28

CPC classification number: H05K1/0271 ,  H01J37/32733 ,  H05K1/0218 ,  H05K3/284 ,  H01J2237/2007 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10151

Abstract: A large area monitoring device for diagnosing easily performance of an equipment in a semiconductor process or a display process is disclosed. The monitoring device comprises a protection layer, a board disposed in an internal space of the protection layer, and at least one electrical element disposed on the board. Here, the electrical element includes one or more sensors, the monitoring device monitors an object to be monitored by measuring at least one of a temperature, a slope, a light, a vibration, a voltage, current, a power or a pressure of the object located outside the monitoring device and a distance between the object and another element, an intaglio structure or an embossing structure is formed to the board, material with different characteristics from the board is filled in the intaglio structure or the embossing structure is formed of material with different characteristics from the board.