Abstract:
An overvoltage protection device made by: employing a machining technique to make a through hole through opposing top and bottom walls of a substrate, and then filling an overvoltage protection material in the through hole of the substrate, and then curing the overvoltage protection material, and then coating a flat electrode on each of the top and bottom walls of the substrate over and in connection with top and bottom sides of the overvoltage protection material.
Abstract:
A vehicle interior assembly includes an electronic sub-assembly and a conductive interior trim component at least partially disposed about the electronic sub-assembly. The conductive interior trim component is electrically coupled to a conductive structure at a reference potential.
Abstract:
An overvoltage protection device made by: employing a machining technique to make a through hole through opposing top and bottom walls of a substrate, and then filling an overvoltage protection material in the through hole of the substrate, and then curing the overvoltage protection material, and then coating a flat electrode on each of the top and bottom walls of the substrate over and in connection with top and bottom sides of the overvoltage protection material.
Abstract:
A switch and a circuit board of the switch assembly are detachably coupled to each other, thus resulting in enhanced maintenance and workability. The switch assembly includes a switch to sense an electrical signal of a human body, a conductive connector to provide the switch with an elastic force, and a circuit board adapted to receive the electrical signal through the connector so as to perform a control operation. The circuit board is detachably coupled with the switch.
Abstract:
A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
Abstract:
Disclosed is a portable terminal, including a first circuit board coupled to a main body and having a first connection terminal mounted on a surface thereof; a second circuit board coupled to the main body so as to cover at least a portion of the first circuit board, having a first area where an intermediate connection terminal contacting the first connection terminal is mounted on a surface thereof, and a second area where a second connection terminal electrically connected to the intermediate connection terminal is mounted on a surface thereof; and an electronic component having at least a portion thereof contacted by the second connection terminal, and for being electrically connected to the first circuit board.
Abstract:
The inventive shock damping system for vibration sensitive surface mounted devices consists of an elastomeric material having conductive fiber material disposed between a printed circuit board (PCB) and a surface mounted device. Once disposed between PCB and surface mounted device, the elastomeric material, the PCB and the surface mounted device are compressed together with a component restraining system, to provide a secure electrical connection between one or more interconnect pads conductively attached to surface mounted device and the PCB. The elastomeric material allows signals and current to flow between surface mounted device and PCB without the use of any attached wires or leads while at the same time providing a system for damping any shocks or vibrations that may be transferred to surface mounted device through the PCB or through the protective component restraining system that encloses the device and the elastomeric material.
Abstract:
A conductor circuit and method of manufacturing a conductor circuit. The method includes forming a continuous conductor pattern on an insulating substrate, and connecting a short-circuit wire at a first position on the continuous conductor pattern such that two or more points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the first position. An electrolytic plating film is formed on the continuous conductor pattern while the short-circuit wire is connected to the continuous conductor pattern at the first position, and the short-circuit wire is removed from the first position on the continuous conductor pattern to uncover a first exposed portion of the continuous conductor pattern.
Abstract:
A spacer-connector and connection arrangements between daughter boards and motherboards are disclosed. Assemblies may include a daughter board one or more spacer-connectors spacing the daughter board above a motherboard and conductive elastomers providing electrical connections between the daughter board and spacer-connector and between the spacer-connector and the motherboard. The spacer-connector may include ground, power, digital and/or controlled impedance RF pathways to conduct signals between the daughter board to the mother board.