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    Composite motion probing
    161.
    发明申请
    Composite motion probing 失效
    复合运动探测

    公开(公告)号：US20040130312A1

    公开(公告)日：2004-07-08

    申请号：US10328113

    申请日：2002-12-20

    Applicant: FormFactor, Inc.

    Inventor： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    IPC: G01R007/00

    CPC classification number: G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

    Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

    Abstract translation: 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    Microelectronic contact structure
    163.
    发明申请
    Microelectronic contact structure 有权
    微电子接触结构

    公开(公告)号：US20040121627A1

    公开(公告)日：2004-06-24

    申请号：US10328083

    申请日：2002-12-23

    Applicant: FormFactor, Inc.

    Inventor： Gary W. Grube ,  Gaetan L. Mathieu ,  Alec Madsen

    IPC: H05K001/00 ,  H01R012/00

    CPC classification number: G01R1/06733 ,  G01R1/06716 ,  G01R1/0675 ,  G01R1/07314 ,  G01R3/00

    Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.

    Abstract translation: 沿着中心纵向轴线设置的细长柱状微机械结构; 该结构由层压结构层组成，每层由结构材料构成。 这些层在结构的近端处限定基本上刚性的基部，从基部延伸的弹性中间部分沿着中心轴线，以及在结构的远端处从弹性部分延伸的接触尖端。 接触结构的弹性部分由限定在层中的弹性臂组成。 弹性臂的相对端部可以相对于中心轴线彼此成角度地偏移。 因此，当接触结构沿轴向压缩时，接触尖端将围绕中心轴线旋转，同时基座保持固定，为接触尖端提供有益的擦拭作用。

    Predictive, adaptive power supply for an integrated circuit under test
    165.
    发明申请
    Predictive, adaptive power supply for an integrated circuit under test 失效
    用于被测集成电路的预测，自适应电源

    公开(公告)号：US20040075459A1

    公开(公告)日：2004-04-22

    申请号：US10725824

    申请日：2003-12-01

    Applicant: FORMFACTOR, INC.

    Inventor： Benjamin N. Eldridge ,  Charles A. Miller

    IPC: G01R031/26

    CPC classification number: G06F1/26 ,  G01R31/2851 ,  G01R31/31721 ,  G01R31/31905 ,  G01R31/31924

    Abstract: A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT during a test as transistors within the IC switch in response to the clock signal edges. To limit variation (noise) in voltage at the power input terminal, an auxiliary power supply supplies an additional current pulse to the power input terminal to meet the increased demand during each cycle of the clock signal. The magnitude of the current pulse is a function of a predicted increase in current demand during that clock cycle, and of the magnitude of an adaption signal controlled by a feedback circuit provided to limit variation in voltage developed at the DUT's power input terminal.

    Abstract translation: 主电源将电流通过路径阻抗提供给被测集成电路器件（DUT）的电源端子。 在测试期间，DUT对电源输入端的电流需求暂时增加了在测试期间施加到DUT的时钟信号的随后边缘，作为IC开关中的晶体管响应于时钟信号的边缘。 为了限制电源输入端子的电压变化（噪声），辅助电源为电源输入端子提供额外的电流脉冲，以满足在时钟信号的每个周期期间增加的需求。 电流脉冲的大小是在该时钟周期期间电流需求的预测增加以及由反馈电路控制的适配信号的大小的函数，以限制在DUT的功率输入端产生的电压变化。

    Closed-grid bus architecture for wafer interconnect structure
    166.
    发明申请
    Closed-grid bus architecture for wafer interconnect structure 有权

    公开(公告)号：US20030169061A1

    公开(公告)日：2003-09-11

    申请号：US10406669

    申请日：2003-04-02

    Applicant: FORMFACTOR, INC.

    Inventor： Charles A. Miller ,  John Matthew Long

    IPC: G01R031/02

    CPC classification number: G01R31/31926 ,  G01R1/07378 ,  G01R31/318511 ,  G11C29/56 ,  G11C2029/2602 ,  H05K1/0216 ,  H05K1/023 ,  H05K1/0289 ,  H05K2201/09254 ,  Y10T29/49117

    Abstract: An interconnect structure employs a closed-grid bus to link an integrated circuit tester channel to an array of input/output (I/O) pads on a semiconductor wafer so that the tester channel can concurrently communicate with all of the I/O pads. The interconnect structure includes a circuit board implementing an array of bus nodes, each corresponding to a separate one of the I/O pads. The circuit board includes at least two layers. Traces mounted on a first layer form a set of first daisy-chain buses, each linking all bus nodes of a separate row of the bus node array. Traces mounted on a second circuit board layer form a set of second daisy-chain buses, each linking all bus nodes of a separate column of the bus node array. Vias and other circuit board interconnect ends of the first and second daisy-chain buses so that they form the closed-grid bus. Each bus node is connected though a separate isolation resistor to a separate contact pad mounted on a surface of the circuit board. A set of spring contacts or probes link each contact pad to a separate one of the I/O pads on the wafer.

    Microelectronic contact structures, and methods of making same
    169.
    发明申请
    Microelectronic contact structures, and methods of making same 有权
    微电子接触结构及其制造方法

    公开(公告)号：US20030049951A1

    公开(公告)日：2003-03-13

    申请号：US10202768

    申请日：2002-07-25

    Applicant: FormFactor, Inc.

    Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

    IPC: H05K001/00 ,  H01R012/00

    CPC classification number: G01R1/07314 ,  H01H1/0036 ,  H01L2224/02335 ,  H01L2924/00013 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49316 ,  H01L2224/13099

    Abstract: Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a nullpostnull component, a nullbeamnull component, and a nulltipnull component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.

    Abstract translation: 微电子接触结构通过分别形成，然后连接在一起而制成其各种部件。 每个接触结构具有三个部件：“后”部件，“梁”部件和“尖端”部件。 安装到电子部件上的所得接触结构对于与另一个电子部件进行电连接是有用的。 后部组件可以制造在牺牲基板上，连接到电子部件并且去除其牺牲基板。 或者，可以在电子部件上形成柱部件。 梁和尖端部件可以分别制造在牺牲衬底上。 梁组件连接到柱部件，并且其牺牲基板被移除，并且尖端部件接合到梁部件并且其牺牲基板被移除。

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