公开(公告)号：US08045334B2

公开(公告)日：2011-10-25

申请号：US12090884

申请日：2006-10-13

Applicant: Maurice Alexander Hugo Donners

Inventor： Maurice Alexander Hugo Donners

IPC: H05K7/00 ,  H05K7/10 ,  H05K1/03

CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.

Abstract translation: 适于安装在基板（11）上并用作表面安装装置（15）的支撑件的支撑部件（1）包括具有适于安装在基板上的第一表面（3）的主体（2） （11），以及适于支撑所述表面安装装置（15）的第二表面（4）。 第二表面（4）相对于第一表面（3）倾斜。 支撑部件（1）还包括适于在基板（11）的第一基板导体（12）和表面安装装置（15）的第一电极（16）之间形成电接触的第一支撑部件导体（6） ）。 在将表面安装的装置（15）以倾斜的方式安装在基板（11）上的方法中，支撑部件（1）安装在基板（11）上，表面安装装置（15）位于其上。

公开(公告)号：US20110241819A1

公开(公告)日：2011-10-06

申请号：US13164315

申请日：2011-06-20

Applicant: Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

Inventor： Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

IPC: H01C1/034

CPC classification number: H01C1/14 ,  H01C1/144 ,  H01C7/003 ,  H01C17/006 ,  H01C17/28 ,  H05K3/3426 ,  H05K2201/10651 ,  H05K2201/10848 ,  Y02P70/613 ,  Y10T29/49082

Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.

Abstract translation: 具有第一和第二相对端的芯片电阻器包括具有顶表面和相对底表面的刚性绝缘基板，第一导电终端焊盘和第二导电终端焊盘，刚性绝缘基板的顶表面上的两个端接焊盘 ，在第一和第二导电终端焊盘之间的电阻材料层，以及每个由具有焊料增强涂层的导电金属制成的第一和第二柔性引线。 第一柔性引线附接并电连接到第一导电终端焊盘和第二柔性引线，并且电连接到第二导电终端焊盘。 每个柔性引线具有多个引线部分，便于围绕芯片电阻器的端部弯曲。

公开(公告)号：US07997749B2

公开(公告)日：2011-08-16

申请号：US12644880

申请日：2009-12-22

Applicant: Kyung Jun Kim ,  Chul Ho Park

Inventor： Kyung Jun Kim ,  Chul Ho Park

IPC: F21V33/00

CPC classification number: H05K1/183 ,  F21K9/00 ,  F21K9/20 ,  F21V19/045 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01087 ,  H05K1/184 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10651 ,  Y10S362/80 ,  H01L2924/00014

Abstract: Disclosed are a light emitting module and a light unit having the same. The light emitting module includes a plurality of light emitting devices, each light emitting device including a package body, a light emitting diode provided in the package body, and a plurality of lead electrodes electrically connected to the light emitting diode while protruding outwardly from the package body; and a board including at least one receiving groove, wherein the at least one of the light emitting devices is removably inserted into the at least one receiving groove.

Abstract translation: 公开了一种发光模块和具有该发光模块的光单元。 发光模块包括多个发光器件，每个发光器件包括封装体，设置在封装主体中的发光二极管，以及电连接到发光二极管的多个引出电极，同时从封装体向外突出 身体; 以及包括至少一个接收槽的板，其中所述至少一个所述发光器件可移除地插入所述至少一个接收槽中。

公开(公告)号：US20110100707A1

公开(公告)日：2011-05-05

申请号：US12920305

申请日：2009-02-18

Applicant: Charles Lee ,  Feng Sheng ,  Jenny Zhou

Inventor： Charles Lee ,  Feng Sheng ,  Jenny Zhou

IPC: H01L23/48

CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L33/486 ,  H01L2924/0002 ,  H05K1/182 ,  H05K1/183 ,  H05K3/325 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10651 ,  H01L2924/00

Abstract: A miniature housing, in whose housing body there is located an element emitting or receiving electromagnetic radiation, comprises at least two electrical terminal means projecting laterally beyond the housing body. The passage side of the miniature housing, through which the element emits or receives, is oriented substantially perpendicularly to the mounting plane of the miniature housing. The electrical terminal means of the miniature housing projecting laterally beyond the housing body are connected electrically conductively to conductors, which bring about direct contacting with the emitting or receiving element. The contacting faces of the terminal means are thus arranged substantially perpendicular to the passage side of the miniature housing. As a result of this arrangement the miniature housing may be embedded at least in part in a support, such that the miniature housing is no longer of any significance to the thickness of a lighting device.

Abstract translation: 在其壳体中位于发射或接收电磁辐射的元件的微型外壳包括至少两个横向伸出外壳主体的电气端子装置。 元件发射或接收的微型外壳的通道侧基本上垂直于微型外壳的安装平面定向。 突出于壳体外侧突出的微型壳体的电气端子装置导电地连接导体，导体与发射或接收元件直接接触。 因此，端子装置的接触面大致垂直于微型壳体的通道侧。 作为这种布置的结果，微型壳体可以至少部分地嵌入在支撑件中，使得微型外壳对照明装置的厚度不再具有任何意义。

公开(公告)号：US07868437B2

公开(公告)日：2011-01-11

申请号：US11936332

申请日：2007-11-07

Applicant: Shuichi Takeuchi

Inventor： Shuichi Takeuchi

IPC: H01L23/02 ,  H01L23/20

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3426 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A mounting structure for an IC tag where an IC chip for mounting (10) is mounted so as to be electrically connected to antenna patterns (44a), (44b). The assembly process that mounts the IC chip for mounting (10) on the antenna patterns (44a), (44b) is simplified, which makes it possible to reduce the manufacturing cost of IC tags. The IC chip for mounting 10 is formed by winding conductive wires (12a), (12b) so as to encircle an outer surface of an IC chip (20) between two opposite edges of the IC chip (20) in a state where the conductive wires (12a), (12b) mechanically contact electrodes formed on the IC chip (20) and are electrically connected to the electrodes, so that the IC chip for mounting (10) is joined to the antenna patterns (44a), (44b) via the conductive wires (12a), (12b).

Abstract translation: 一种用于安装IC芯片（10）的IC标签的安装结构，以电连接到天线图案（44a），（44b）。 将用于安装（10）的IC芯片安装在天线图案（44a），（44b）上的组装过程被简化，这使得可以降低IC标签的制造成本。 用于安装的IC芯片10通过在导电（12a），（12b）之间缠绕以在IC芯片（20）的两个相对边缘之间环绕IC芯片（20）的外表面的方式形成，其中导电 电线（12a），（12b）机械地接触形成在IC芯片（20）上的电极，并与电极电连接，使得安装用IC芯片（10）与天线图案（44a），（44b） 经由导线（12a），（12b）。

公开(公告)号：US20100238637A1

公开(公告)日：2010-09-23

申请号：US12303572

申请日：2007-06-05

Applicant: Rabin Bhattacharya ,  Pieter J. Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger

Inventor： Rabin Bhattacharya ,  Pieter J. Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger

IPC: H05K7/02

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

Abstract translation: 提供了一种用于在基板上布置电子部件的基座。 底座包括头部构件和从头部构件突出的至少一个衬底接合构件。 头部构件包括彼此隔离的导电部分中的至少两个，其中每个导电部分包括适于将电子部件连接到其上的部件接触件和布置在所述基板侧上的基板接触件，适于使所述 与包括在所述衬底中的电路接触的导电部分。 本发明的基座可以用于将诸如发光二极管的电子部件附接到纺织品基板，而不需要将电子部件直接焊接在基板上。

公开(公告)号：US20100214758A1

公开(公告)日：2010-08-26

申请号：US12684977

申请日：2010-01-11

Applicant: Chung-Wei Kuo ,  Chien-Jung Wu ,  Ming-Chuan Lee

Inventor： Chung-Wei Kuo ,  Chien-Jung Wu ,  Ming-Chuan Lee

IPC: H05K7/02

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K2201/10015 ,  H05K2201/10325 ,  H05K2201/10651 ,  Y10T29/49142 ,  Y10T29/49149

Abstract: A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor.

Abstract translation: 电容器座和两个导体用于通过将两个导体焊接在PCB的电触点上来在PCB上安装电容器座。 电容器以紧固方式安装在电容器座上，例如通过向下按压，旋转电容器或以其它可行的紧固方式与PCB上的电触点电连接。 如果可拆卸电容器件有错误或使用中损坏，或者用户想要用不同类型的电容器来替换电容器来测试或调整电路的特性，则容易更换电容器。

公开(公告)号：US20100187561A1

公开(公告)日：2010-07-29

申请号：US12691716

申请日：2010-01-21

Applicant: Wen-Chieh Tsou

Inventor： Wen-Chieh Tsou

IPC: H01L33/00 ,  H05K1/11

CPC classification number: H05K1/111 ,  H01L23/49555 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3421 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device includes a carrier, a surface mounting device, and solders. The carrier has a plurality of bonding pads, and at least one of the bonding pads has a notch, such that the bonding pad has a necking portion adjacent to the notch. The surface mounting device is disposed on the carrier. Besides, the surface mounting device has a plurality of leads, and each of the leads is connected to the necking portion of one of the bonding pads, respectively. The notch of each of the bonding pads is located under one of the leads. The solders connect the bonding pads and the leads.

Abstract translation: 电子设备包括载体，表面安装装置和焊料。 载体具有多个接合焊盘，并且至少一个接合焊盘具有凹口，使得焊盘具有与凹口相邻的颈缩部分。 表面安装装置设置在载体上。 此外，表面安装装置具有多个引线，并且每个引线分别连接到一个接合焊盘的颈缩部分。 每个接合焊盘的凹口位于一个引线下方。 焊料连接焊盘和引线。

公开(公告)号：US20090213587A1

公开(公告)日：2009-08-27

申请号：US11817978

申请日：2006-03-06

Applicant: Noritsugu Enomoto ,  Hirofumi Utsunomiya ,  Shigeki Motomura

Inventor： Noritsugu Enomoto ,  Hirofumi Utsunomiya ,  Shigeki Motomura

IPC: F21V1/00 ,  F21V21/00

CPC classification number: H05K3/326 ,  F21K9/00 ,  F21S4/10 ,  F21S43/14 ,  F21S43/195 ,  F21S43/30 ,  F21S43/33 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10962 ,  H05K2203/1189

Abstract: An LED lighting device provided with a flat circuit body where LEDs are mounted in a lamp room that is constructed from a lamp body and a lens installed on a front opening of the lamp body, and with a reflector structure body for reflecting light that is emitted from the LEDs. Opening are formed in a wall section of the reflector structure body, and the LEDs of the flat circuit body are installed in the openings. As a result, the flat circuit body supported by the reflector structure body.

Abstract translation: 一种LED照明装置，其具有平坦电路体，其中LED安装在由灯体和安装在灯体的前开口上的透镜构成的灯室中，并具有反射器结构体，用于反射发射的光 从LED。 开口形成在反射器结构体的壁部分中，并且扁平电路体的LED安装在开口中。 结果，由反射器结构体支撑的平坦电路体。

公开(公告)号：US20090161333A1

公开(公告)日：2009-06-25

申请号：US12002910

申请日：2007-12-19

Applicant: Kevin Yang

Inventor： Kevin Yang

IPC: H05K7/18

CPC classification number: H05K7/02 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10166 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10878

Abstract: Automatic clinging leads of an electric device are provided for an unassisted mounting on thru-holes of a printed circuit board. Each of the leads of the device has three continuous right-angled sections including a longitudinal proximal end section extending from the terminal region of the electric element, a latitudinal distal end section extending at right angle with respect to the proximal end section, and a bent midsection for connecting the proximal and distal end sections at the diametrically opposite right angle to the angle between the proximal and distal end sections to provide a generally laterally extending lead with three alternating bends between the three sections. The device leads can be inserted into the thru-holes of the circuit board through a 90-degree swivel motion that causes a secure flush cling of the leads and in turn a low profile mounting of the device onto the circuit board around thru-holes.

Abstract translation: 提供电气设备的自动粘贴引线用于在印刷电路板的通孔上的无辅助安装。 设备的每个引线具有三个连续的直角部分，包括从电气元件的端部区域延伸的纵向近端部分，相对于近端部分以直角延伸的纬向远端部分，以及弯曲 用于将近端部分和远端部分以与近端部分和远端部分之间的角度成直角相对的直角连接以提供在三个部分之间具有三个交替弯曲部的大致横向延伸的引线。 器件引线可以通过90度的旋转运动插入到电路板的通孔中，这导致引线的安全冲洗粘附，从而将器件的薄型安装在通孔周围的电路板上。