公开(公告)号：US3499218A

公开(公告)日：1970-03-10

申请号：US3499218D

申请日：1966-10-31

Applicant: ELECTRO MECHANISMS INC

Inventor： DAHLGREN VICTOR F ,  TALLY SIDNEY K ,  STEARNS THOMAS H

IPC: H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/30

CPC classification number: H05K3/3426 ,  H05K3/28 ,  H05K3/281 ,  H05K3/328 ,  H05K3/3463 ,  H05K3/4015 ,  H05K2201/10628 ,  H05K2201/10946 ,  H05K2203/0264 ,  H05K2203/0582 ,  Y02P70/613 ,  Y10T29/49101 ,  Y10T29/49155 ,  Y10T156/1052

公开(公告)号：US3096466A

公开(公告)日：1963-07-02

申请号：US65522357

申请日：1957-04-26

Applicant: STANDARD COIL PROD CO INC

Inventor： FISHER GOSSARD THOMAS

IPC: H04N5/44 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

CPC classification number: H04N5/4446 ,  H05K1/0306 ,  H05K1/119 ,  H05K1/184 ,  H05K3/326 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K2201/10946

公开(公告)号：US20240090130A1

公开(公告)日：2024-03-14

申请号：US17931651

申请日：2022-09-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chad CHEN ,  Jiahui LIU ,  Wuxing XIA ,  Jingyan LIU

IPC: H05K1/18 ,  H01L23/495 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01L23/49555 ,  H05K3/3485 ,  H05K3/3494 ,  H05K2201/10757 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/10946

Abstract: A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.

公开(公告)号：US09842699B2

公开(公告)日：2017-12-12

申请号：US14818207

申请日：2015-08-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Sang Soo Park

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H05K3/34 ,  H01G2/06 ,  H01G4/012 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic capacitor may include: ceramic body including a plurality of dielectric layers and a plurality of internal electrodes, external electrodes including a connecting portion and band portion, terminal electrodes including upper and lower horizontal portion and vertical portion connecting end portion of the upper and lower horizontal portion and the conductive adhesive layers disposed to the upper surface of the band portion and upper horizontal portion.

公开(公告)号：US09818541B2

公开(公告)日：2017-11-14

申请号：US14630448

申请日：2015-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Kyoung Jin Jun ,  Dae Hyung Yun ,  Soon Ju Lee

IPC: H05K1/18 ,  H01G4/30 ,  H01G2/06 ,  H01G4/232 ,  H05K3/34 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic electronic component and a board having the same are provided. The multilayer ceramic electronic component includes a multilayer ceramic capacitor including external electrodes including front portions and band portions extended from the front portions, terminal electrodes respectively surrounding the front portions and portions of lower surfaces of the band portions of the external electrodes and respectively having a ‘’ shaped groove portion formed in lower portions thereof, and conductive adhesive layers connecting the external electrodes and the terminal electrodes to each other.

公开(公告)号：US09659710B2

公开(公告)日：2017-05-23

申请号：US14860309

申请日：2015-09-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Sang Soo Park

IPC: H01G4/01 ,  H05K1/18 ,  H01G4/30 ,  H05K3/34 ,  H01G2/06 ,  H01G4/232

CPC classification number: H01G4/01 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes, and first and second external electrodes, first and second insulation frames respectively including first and second horizontal insulation portions and first and second vertical insulation portions, first and second external conductive electrodes including first and second horizontal conductive portions and first and second vertical conductive portions, first and second internal conductive electrodes disposed on internal surfaces of the first and second vertical insulation portions and connected to the first and second external electrodes, and electrical connection portions.

公开(公告)号：US09640321B2

公开(公告)日：2017-05-02

申请号：US14536032

申请日：2014-11-07

Applicant: TDK Corporation

Inventor： Sunao Masuda ,  Katsumi Kobayashi ,  Akitoshi Yoshii

IPC: H01G2/10 ,  H01G4/30 ,  H01G4/38 ,  H01G2/06 ,  H01G4/232 ,  H01G4/12 ,  H05K3/34

CPC classification number: H01G2/106 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K3/3426 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10946 ,  Y02P70/611

Abstract: A ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with the terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.

公开(公告)号：US20170104410A1

公开(公告)日：2017-04-13

申请号：US15286542

申请日：2016-10-05

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong ZENG ,  Shou-Yu HONG ,  Xiao-Ni XIN ,  Pei-Qing HU

IPC: H02M3/156 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H01F27/24 ,  H05K3/30 ,  H05K3/40 ,  H05K1/11 ,  H01F27/28

CPC classification number: H02M3/156 ,  H01F27/24 ,  H01F27/28 ,  H01F27/292 ,  H01F41/02 ,  H05K1/028 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/18 ,  H05K1/181 ,  H05K3/22 ,  H05K3/305 ,  H05K3/4038 ,  H05K2201/1003 ,  H05K2201/10946 ,  H05K2203/02 ,  H05K2203/0228

Abstract: A power converter includes a carrier, a first electronic component, a second electronic component, and a connection part. The first electronic component is disposed on the bottom surface of the carrier. The second electronic component is disposed on the top surface of the carrier. A first terminal of the connection part is coupled to the top surface or the bottom surface of the carrier. A second terminal of the connection part is a bonding pad and attached to the first electronic component's surface apart from the carrier. The carrier is disposed at ⅓ to ⅔ of a height of the power-converter. The connection part is fabricated by mechanical support of the first electronic component.

公开(公告)号：US20170103852A1

公开(公告)日：2017-04-13

申请号：US15286122

申请日：2016-10-05

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Masahiro MORI ,  Sunao MASUDA ,  Kayou KUSANO

IPC: H01G4/002 ,  H01G4/242 ,  H01G4/12 ,  H01G4/30

CPC classification number: H01G4/002 ,  H01C7/02 ,  H01C7/13 ,  H01G2/06 ,  H01G2/14 ,  H01G4/1227 ,  H01G4/1236 ,  H01G4/232 ,  H01G4/242 ,  H01G4/30 ,  H01G4/40 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10181 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2201/2045

Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

公开(公告)号：US09607769B2

公开(公告)日：2017-03-28

申请号：US14663426

申请日：2015-03-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Sang Soo Park

IPC: H01G4/30 ,  H01G4/008 ,  H01G2/06 ,  H01G4/12 ,  H05K3/34

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/0085 ,  H01G4/1227 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/613

Abstract: A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes a ceramic body including internal electrodes and having lead-out portions exposed to end surfaces thereof, and external electrodes disposed on portions of the end surfaces of the ceramic body to be connected to the lead-out portions of the internal electrodes, terminal electrodes coupled to both end portions of the ceramic body and including horizontal portions disposed below the ceramic body and vertical portions spaced apart from the end surfaces of the ceramic body and connected to the external electrodes.