公开(公告)号：US09256825B2

公开(公告)日：2016-02-09

申请号：US13433959

申请日：2012-03-29

Applicant: Cheng Huang ,  Dong Huang ,  Yuan Jin ,  Fang Rui Shu ,  Kai Ye

Inventor： Cheng Huang ,  Dong Huang ,  Yuan Jin ,  Fang Rui Shu ,  Kai Ye

IPC: G06N5/02 ,  G06N5/00

CPC classification number: G06N5/02 ,  G06N5/00 ,  G06N5/003

Abstract: An emotion script generating method includes receiving a user's emotion data, and generating emotion script using the emotion data based on a predefined template.

Abstract translation: 情感脚本生成方法包括：接收用户的情绪数据，以及使用基于预定义模板的情绪数据生成情感脚本。

公开(公告)号：US09237105B2

公开(公告)日：2016-01-12

申请号：US12632834

申请日：2009-12-08

Applicant: Cheng Huang ,  Manish Jain ,  Jin Li ,  Amit Kumar Mondal ,  Aleksandar Kuzmanovic

Inventor： Cheng Huang ,  Manish Jain ,  Jin Li ,  Amit Kumar Mondal ,  Aleksandar Kuzmanovic

IPC: H04L12/801 ,  H04L1/00 ,  H04L1/08 ,  H04L12/853 ,  H04L12/825 ,  H04L12/811

CPC classification number: H04L47/14 ,  H04L1/0009 ,  H04L1/0018 ,  H04L1/0057 ,  H04L1/08 ,  H04L47/2416 ,  H04L47/26 ,  H04L47/38 ,  H04L2001/0097

Abstract: Described is a technology by which a relay is coupled (e.g., by a wire) to a network and (e.g., by a wireless link) to an endpoint. Incoming data packets directed towards the endpoint are processed by the relay according to an error correction scheme, such as one that replicates packets. The reprocessed packets, which in general are more robust against packet loss, are then sent to the endpoint. For outgoing data packets received from the endpoint, the relay reprocesses the outgoing packets based upon the error correction scheme, such as to remove redundant packets before transmitting them to the network over the wire. Also described are various error correction schemes, and various types of computing devices that may be used as relays. The relay may be built into the network infrastructure, and/or a directory service may be employed to automatically find a suitable relay node for an endpoint device.

Abstract translation: 描述了一种技术，通过该技术将中继器（例如，通过有线）耦合到网络，并且（例如，通过无线链路）耦合到端点。 根据诸如复制分组的错误校正方案，继电器处理针对端点的进入数据分组。 然后将再处理的数据包（通常对数据包丢失更加鲁棒）发送到端点。 对于从端点接收到的输出数据分组，中继器基于纠错方案重新处理输出分组，例如在通过线路将其发送到网络之前去除冗余分组。 还描述了各种错误校正方案以及可以用作中继的各种类型的计算设备。 可以将中继器内置到网络基础设施中，和/或可以采用目录服务来自动地为端点设备找到合适的中继节点。

公开(公告)号：US09147678B2

公开(公告)日：2015-09-29

申请号：US13342995

申请日：2012-01-04

Applicant: Chih-Kai Kang ,  Sheng-Yuan Hsueh ,  Shu-Hsuan Chih ,  Po-Kuang Hsieh ,  Chia-Chen Sun ,  Po-Cheng Huang ,  Shih-Chieh Hsu ,  Chi-Horn Pai ,  Yao-Chang Wang ,  Jie-Ning Yang ,  Chi-Sheng Tseng ,  Po-Jui Liao ,  Kuang-Hung Huang ,  Shih-Chang Chang

Inventor： Chih-Kai Kang ,  Sheng-Yuan Hsueh ,  Shu-Hsuan Chih ,  Po-Kuang Hsieh ,  Chia-Chen Sun ,  Po-Cheng Huang ,  Shih-Chieh Hsu ,  Chi-Horn Pai ,  Yao-Chang Wang ,  Jie-Ning Yang ,  Chi-Sheng Tseng ,  Po-Jui Liao ,  Kuang-Hung Huang ,  Shih-Chang Chang

IPC: H01L29/00 ,  H01L27/06 ,  H01L49/02

CPC classification number: H01L27/0629 ,  H01L28/24

Abstract: The present invention provides a structure of a resistor comprising: a substrate having an interfacial layer thereon; a resistor trench formed in the interfacial layer; at least a work function metal layer covering the surface of the resistor trench; at least two metal bulks located at two ends of the resistor trench and adjacent to the work function metal layer; and a filler formed between the two metal bulks inside the resistor trench, wherein the metal bulks are direct in contact with the filler.

Abstract translation: 本发明提供一种电阻器的结构，包括：其上具有界面层的衬底; 形成在界面层中的电阻沟; 至少覆盖电阻沟槽表面的功函数金属层; 至少两个金属块，位于电阻沟槽的两端并邻近功函数金属层; 以及形成在电阻器沟槽内部的两个金属块之间的填料，其中金属块直接与填料接触。

公开(公告)号：US09136246B2

公开(公告)日：2015-09-15

申请号：US10755042

申请日：2004-01-09

Applicant: Mou-Shiung Lin ,  Jin-Yuan Lee ,  Ching-Cheng Huang

Inventor： Mou-Shiung Lin ,  Jin-Yuan Lee ,  Ching-Cheng Huang

IPC: H01L23/12 ,  H01L23/00 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H01L23/64

CPC classification number: H01L24/97 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/642 ,  H01L23/645 ,  H01L24/19 ,  H01L2221/68363 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

Abstract: An integrated chip package structure and method of manufacturing the same is by adhering dies on a silicon substrate and forming a thin-film circuit layer on top of the dies and the silicon substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

公开(公告)号：US20150053132A1

公开(公告)日：2015-02-26

申请号：US14533137

申请日：2014-11-05

Applicant: Yu-Cheng Huang

Inventor： Yu-Cheng Huang

IPC: B05C11/00 ,  B05C21/00 ,  C09J5/00 ,  B05C1/02

CPC classification number: B05C1/025 ,  A43D11/03 ,  A43D25/181 ,  B05C1/02 ,  B05C1/0813 ,  B05C1/0817 ,  B05C1/083 ,  B05C11/00 ,  B05C21/00 ,  B05D5/10 ,  B27G11/00 ,  C09J5/00

Abstract: An adhesive coating device is provided with an adhesive reservoir; two opposite adjustment rollers at bottom of the reservoir; a pattern roller between the adjustment rollers and having a pattern formed thereon; a resilient roller under the pattern roller; a roller member under the resilient roller; two pivotal, co-rotated links on a side of the reservoir and operatively connected to the adjustment rollers respectively; and a spring biased adjustment screw pivotably secured to an end of one link. Clockwise rotation of the adjustment screw rotates the links at different directions, thereby decreasing a gap between the pattern roller and each adjustment roller.

Abstract translation: 粘合剂涂布装置设置有粘合剂储存器; 储存器底部有两个相对的调节辊; 调节辊之间的图案辊，其上形成有图案; 在图案辊下方的弹性辊; 在弹性辊下方的辊构件; 两个枢转的，共同旋转的连接在容器的一侧并分别可操作地连接到调节辊; 以及可枢转地固定到一个连杆的端部的弹簧偏压调节螺钉。 调节螺钉的顺时针旋转使链节沿不同方向旋转，从而减小图案辊和每个调节辊之间的间隙。

公开(公告)号：US20150049263A1

公开(公告)日：2015-02-19

申请号：US14460333

申请日：2014-08-14

Applicant: Kuan-Yu Chu ,  Chen-Fu Huang ,  Chin-Pei Hwang ,  Ming-Wu Chen ,  Chun-Cheng Huang ,  Yu-Ching Wang

Inventor： Kuan-Yu Chu ,  Chen-Fu Huang ,  Chin-Pei Hwang ,  Ming-Wu Chen ,  Chun-Cheng Huang ,  Yu-Ching Wang

IPC: G06F3/041

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  G06F2203/04107

Abstract: A touch display device including a touch panel, a protection layer, a conductive optical adhesive layer and a display panel is provided. The touch panel includes a substrate, pads, at least one grounding pad, a touch-sensing device, and at least one ESD protection line. The touch panel includes a pad area and an active area. The pads and the grounding pad are disposed on the substrate and located in the pad area. The touch-sensing device is disposed on the substrate and located in the active area. The ESD protection line is disposed on the substrate and located at a side of the active area. The protection layer including a first opening covers the touch panel and a portion of the pad area is exposed by the first opening. The conductive optical adhesive layer is disposed on the protection layer and electrically connected to the ESD protection circuit.

Abstract translation: 提供了包括触摸面板，保护层，导电光学粘合剂层和显示面板的触摸显示装置。 触摸面板包括基板，焊盘，至少一个接地焊盘，触摸感测装置以及至少一个ESD保护线。 触摸面板包括焊盘区域和有源区域。 焊盘和接地焊盘设置在基板上并且位于焊盘区域中。 触摸感测装置设置在基板上并且位于有源区域中。 ESD保护线设置在基板上并且位于有源区域的一侧。 包括第一开口的保护层覆盖触摸面板，并且焊盘区域的一部分被第一开口暴露。 导电光学粘合剂层设置在保护层上并电连接到ESD保护电路。

公开(公告)号：US08898292B2

公开(公告)日：2014-11-25

申请号：US13219581

申请日：2011-08-26

Applicant: Cheng Huang ,  David A. Maltz ,  Jin Li ,  Ming Zhang ,  Chao Zhang ,  Keith W. Ross

Inventor： Cheng Huang ,  David A. Maltz ,  Jin Li ,  Ming Zhang ,  Chao Zhang ,  Keith W. Ross

IPC: G06F15/173 ,  H04L29/06 ,  H04L29/12

CPC classification number: H04L61/1511 ,  H04L63/12 ,  H04L63/1408 ,  H04L2463/146

Abstract: A plurality of network addresses from a distributed client is obtained, at least a first portion of the obtained network addresses including resolved network address responses to distributed client requests for resolved network addresses corresponding to one or more network location indicators associated with a first web service. Test content is obtained, based on one or more of the network addresses included in the first portion. It is determined whether the obtained test content includes unauthorized content.

Abstract translation: 获得来自分布式客户端的多个网络地址，所获得的网络地址的至少第一部分包括对分配的客户端请求的分辨的网络地址响应，所述解析的网络地址对应于与第一web服务相关联的一个或多个网络位置指示符。 基于包括在第一部分中的一个或多个网络地址获得测试内容。 确定所获得的测试内容是否包括未授权的内容。

公开(公告)号：US08884797B2

公开(公告)日：2014-11-11

申请号：US13035444

申请日：2011-02-25

Applicant: Yung-Chow Peng ,  Jui-Cheng Huang ,  Ching-Ho Chang ,  Nang Ping Tu

Inventor： Yung-Chow Peng ,  Jui-Cheng Huang ,  Ching-Ho Chang ,  Nang Ping Tu

IPC: H03M1/66 ,  H03M1/68 ,  G09G3/36 ,  H03M1/80

CPC classification number: H03M1/68 ,  G09G3/3688 ,  G09G2300/023 ,  G09G2310/027 ,  G09G2330/023 ,  H03M1/804

Abstract: A method for converting a multi-bit digital value to an analog value. The method includes, in a first conversion cycle, converting a first set of digital bits to a first analog voltage using passive charge-sharing. The method also includes, in a second conversion cycle, converting a second set of digital bits to a second analog voltage added to the first analog voltage using active charge-sharing. The first set of digital bits and the second set of digital bits are different bits of the multi-bit digital value.

Abstract translation: 一种用于将多位数字值转换为模拟值的方法。 该方法包括在第一转换周期中，使用无源电荷共享将第一组数字位转换为第一模拟电压。 该方法还包括在第二转换周期中，使用有源电荷共享将第二组数字位转换为添加到第一模拟电压的第二模拟电压。 第一组数字位和第二组数字位是多位数字值的不同位。

公开(公告)号：US08866161B2

公开(公告)日：2014-10-21

申请号：US13314186

申请日：2011-12-08

Applicant: Shih-Cheng Huang ,  Po-Min Tu ,  Ying-Chao Yeh ,  Wen-Yu Lin ,  Peng-Yi Wu ,  Shih-Hsiung Chan

Inventor： Shih-Cheng Huang ,  Po-Min Tu ,  Ying-Chao Yeh ,  Wen-Yu Lin ,  Peng-Yi Wu ,  Shih-Hsiung Chan

IPC: H01L29/06 ,  H01L27/15 ,  H01L21/02 ,  H01L33/00 ,  H01S5/323

CPC classification number: H01L21/0254 ,  H01L21/02458 ,  H01L21/02505 ,  H01L21/02656 ,  H01L33/007 ,  H01S5/32341 ,  H01S2301/173 ,  H01S2304/12

Abstract: A structure of semiconductor device includes a first semiconductor layer; an intermediate layer on a surface of said first semiconductor layer; a second semiconductor layer on said intermediate layer, wherein said intermediate layer and said second semiconductor layer are integrated to a set of sub-structures; and a semiconductor light emitting device on said second semiconductor layer.

Abstract translation: 半导体器件的结构包括第一半导体层; 在所述第一半导体层的表面上的中间层; 在所述中间层上的第二半导体层，其中所述中间层和所述第二半导体层被集成到一组子结构中; 以及在所述第二半导体层上的半导体发光器件。

公开(公告)号：US08834084B2

公开(公告)日：2014-09-16

申请号：US13557537

申请日：2012-07-25

Applicant: Yu-Cheng Chou ,  Lian-Cheng Huang

Inventor： Yu-Cheng Chou ,  Lian-Cheng Huang

IPC: F16B13/12 ,  F16B13/06

CPC classification number: F16B13/124 ,  F16B5/0258 ,  F16B13/063 ,  F16B29/00

Abstract: A fastening assembly includes a fastening member, a locking member engaged with the fastening member, and an elastic member sleeved on the fastening member. The fastening member forms an arc resisting sidewall. The elastic member includes a main body and a plurality of elastic strips extending from a same side of the main body and spaced from each other. Each elastic strip gradually closes to an center axis of the main body along the direction of away from the main body. Each elastic strip forms an arc protrusion towards the center axis of the main body on an inner wall. The arc protrusion matches with the resisting sidewall.

Abstract translation: 紧固组件包括紧固构件，与紧固构件接合的锁定构件和套在紧固构件上的弹性构件。 紧固构件形成抗电弧侧壁。 弹性构件包括主体和从主体的同一侧延伸并且彼此间隔开的多个弹性条。 每个弹性带沿着远离主体的方向逐渐靠近主体的中心轴线。 每个弹性带在内壁上朝着主体的中心轴线形成弧形突起。 电弧凸出部与电阻侧壁相匹配。