公开(公告)号：US20110064953A1

公开(公告)日：2011-03-17

申请号：US12921896

申请日：2009-04-06

Applicant: Shawn O'Rourke ,  Douglas Loy ,  Hanqing Jiang

Inventor： Shawn O'Rourke ,  Douglas Loy ,  Hanqing Jiang

IPC: B32B7/12 ,  C09J179/08 ,  C09J133/08 ,  C09J175/04 ,  C09J163/00 ,  C09J161/06 ,  C09J183/04 ,  B32B27/00 ,  B32B27/38 ,  B32B27/40 ,  B32B27/34 ,  B32B27/30 ,  B32B27/42 ,  B32B17/10 ,  B32B15/08

CPC classification number: H01L29/78603 ,  H05K1/0393 ,  H05K3/007 ,  H05K3/386 ,  H05K2201/0175 ,  H05K2203/016 ,  H05K2203/0191 ,  Y10T428/31515 ,  Y10T428/31551 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31721 ,  Y10T428/31786 ,  Y10T428/31942

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract translation: 描述了用于解决由于半导体处理的热挑战而发生的附接到刚性载体的柔性基板的弯曲和/或翘曲的方法。 特别地，提供了粘弹性粘合剂，其可以将柔性基底粘合到刚性载体上并介导由于大多数柔性基底（例如塑料膜）相对于刚性载体明显不同的材料性质而常存在的热失配 作为硅晶片。 还提供了根据本文所述的方法制造的组件。

公开(公告)号：US11267613B2

公开(公告)日：2022-03-08

申请号：US16967094

申请日：2019-01-31

Applicant: Hanqing Jiang ,  Zirui Zhai

Inventor： Hanqing Jiang ,  Zirui Zhai

IPC: B65D19/02 ,  B65D21/08 ,  B65D25/28 ,  B65D43/02

Abstract: A foldable, waterproof case includes a first wall and a second wall coupled to the first wall. The first and second walls at least partially define a cavity within the case. A lid is coupled to the second wall and is configured to selectively cover the cavity. A hinge is disposed between the first wall and the second wall. The first wall is rotatable relative to the second wall between a first, expanded position of the case and a second, collapsed position of the case. In the first position, the cavity includes a first volume and in the second position, the cavity includes a second volume that is less than the first volume. The hinge provides a waterproof connection between the first and second walls in the first position and in the second position.

公开(公告)号：US08729524B2

公开(公告)日：2014-05-20

申请号：US13441598

申请日：2012-04-06

Applicant: John A. Rogers ,  Matthew Meitl ,  Yugang Sun ,  Heung Cho Ko ,  Andrew Carlson ,  Won Mook Choi ,  Mark Stoykovich ,  Hanqing Jiang ,  Yonggang Huang ,  Ralph G. Nuzzo ,  Zhengtao Zhu ,  Etienne Menard ,  Dahl-Young Khang

Inventor： John A. Rogers ,  Matthew Meitl ,  Yugang Sun ,  Heung Cho Ko ,  Andrew Carlson ,  Won Mook Choi ,  Mark Stoykovich ,  Hanqing Jiang ,  Yonggang Huang ,  Ralph G. Nuzzo ,  Zhengtao Zhu ,  Etienne Menard ,  Dahl-Young Khang

IPC: H01L29/72

CPC classification number: H01L29/72 ,  H01L21/02422 ,  H01L21/02628 ,  H01L21/4846 ,  H01L21/8258 ,  H01L23/5387 ,  H01L27/12 ,  H01L29/0657 ,  H01L2924/12041 ,  H01L2924/13091 ,  H05K1/0283 ,  H05K3/20 ,  H05K3/22 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Abstract translation: 一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。 对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。 此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

公开(公告)号：US08217381B2

公开(公告)日：2012-07-10

申请号：US11851182

申请日：2007-09-06

Applicant: John A. Rogers ,  Matthew Meitl ,  Yugang Sun ,  Heung Cho Ko ,  Andrew Carlson ,  Won Mook Choi ,  Mark Stoykovich ,  Hanqing Jiang ,  Yonggang Huang ,  Ralph G. Nuzzo ,  Keon Jae Lee ,  Zhengtao Zhu ,  Etienne Menard ,  Dahl-Young Khang ,  Seong Jun Kang ,  Jong Hyun Ahn ,  Hoon-sik Kim

Inventor： John A. Rogers ,  Matthew Meitl ,  Yugang Sun ,  Heung Cho Ko ,  Andrew Carlson ,  Won Mook Choi ,  Mark Stoykovich ,  Hanqing Jiang ,  Yonggang Huang ,  Ralph G. Nuzzo ,  Keon Jae Lee ,  Zhengtao Zhu ,  Etienne Menard ,  Dahl-Young Khang ,  Seong Jun Kang ,  Jong Hyun Ahn ,  Hoon-sik Kim

IPC: H01L29/72

CPC classification number: H01L29/72 ,  H01L21/02422 ,  H01L21/02628 ,  H01L21/4846 ,  H01L21/8258 ,  H01L23/5387 ,  H01L27/12 ,  H01L29/0657 ,  H01L2924/12041 ,  H01L2924/13091 ,  H05K1/0283 ,  H05K3/20 ,  H05K3/22 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Abstract translation: 一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。 对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。 此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

公开(公告)号：US20220395203A1

公开(公告)日：2022-12-15

申请号：US17806899

申请日：2022-06-14

Applicant: Hanqing Jiang ,  Chao Liang

Inventor： Hanqing Jiang ,  Chao Liang

IPC: A61B5/15 ,  A61B5/155 ,  A61B5/157 ,  G01N27/327

Abstract: Methods, systems, and apparatus, including biological fluid monitoring systems comprising a microneedle layer; at least one electromagnet assembly; and at least two liquid chambers coupled via a microfluidic layer, wherein the microneedle layer comprises a plurality of microneedles configured to extract interstitial fluid (ISF) from a patient in to one of the at least two liquid chambers, and wherein the at least one electromagnet assembly is configured to a move a test sample of the extracted ISF through the at least two liquid chambers to conduct a test cycle.

公开(公告)号：US20210039832A1

公开(公告)日：2021-02-11

申请号：US16967094

申请日：2019-01-31

Applicant: Hanqing JIANG ,  Zirui ZHAI

Inventor： Hanqing JIANG ,  Zirui ZHAI

IPC: B65D21/08 ,  B65D43/02 ,  B65D25/28

Abstract: A foldable, waterproof case includes a first wall and a second wall coupled to the first wall. The first and second walls at least partially define a cavity within the case. A lid is coupled to the second wall and is configured to selectively cover the cavity. A hinge is disposed between the first wall and the second wall. The first wall is rotatable relative to the second wall between a first, expanded position of the case and a second, collapsed position of the case. In the first position, the cavity includes a first volume and in the second position, the cavity includes a second volume that is less than the first volume. The hinge provides a waterproof connection between the first and second walls in the first position and in the second position.

公开(公告)号：US09706646B2

公开(公告)日：2017-07-11

申请号：US14761209

申请日：2014-01-15

Applicant: Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

Inventor： Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01M2/20 ,  H01M10/04 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/42 ,  H01M6/40 ,  H01M6/42 ,  H01G11/78

CPC classification number: H05K1/028 ,  H01G11/78 ,  H01M2/204 ,  H01M6/40 ,  H01M6/42 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/425 ,  H05K1/0272 ,  H05K1/0278 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/148 ,  H05K1/181 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10113 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2203/085 ,  H05K2203/087 ,  H05K2203/09 ,  H05K2203/1184 ,  H05K2203/302

Abstract: An origami enabled manufacturing system. The system uses origami design principles to create functional materials, structures, devices and/or systems having an adjustable size and/or shape. An operational device can be coupled to a planar substrate shaped and sized to correspond to a desired origami shape of an origami pattern. A plurality of planar substrates can be coupled together by a plurality of connection members that corresponds to one or more crease of the origami pattern. An array of planar substrates can be formed that convert into a three dimensional structure with origami shape. The resulting three-dimensional structure provides smaller projection area, higher portability and deformability.

公开(公告)号：US20150302772A1

公开(公告)日：2015-10-22

申请号：US14443857

申请日：2013-11-20

Applicant: Hongyu Yu ,  Rogier Windhorst ,  Debra Baluch ,  Hanqing Jiang ,  Lenore Dai

Inventor： Hongyu Yu ,  Rogier Windhorst ,  Debra Baluch ,  Hanqing Jiang ,  Lenore Dai

IPC: G09B21/00 ,  G06F3/02 ,  G06F3/0488 ,  G06F3/01 ,  G06F3/14

CPC classification number: G09B21/004 ,  G06F3/016 ,  G06F3/0202 ,  G06F3/0488 ,  G06F3/04886 ,  G06F3/14 ,  G06F2203/04809

Abstract: A dynamic and refreshable three-dimensional tactile display uses stimulus sensitive hydrogel blocks as pixels to create a touch surface with elevations from a two-dimensional optical image or from stored data. The movable three-dimensional tactiles are powerful in teaching Science, Technology, Engineering, and Mathematics (STEM) materials to visually impaired and blind students.

Abstract translation: 动态和可刷新的三维触觉显示器使用刺激敏感水凝胶块作为像素来创建具有来自二维光学图像或存储数据的高度的触摸表面。 可视化三维触觉在视觉障碍和盲人学生教授科学，技术，工程和数学（STEM）材料方面具有很强的实力。