公开(公告)号：US20130069108A1

公开(公告)日：2013-03-21

申请号：US13313713

申请日：2011-12-07

Applicant: Young Ki LEE ,  Dong Soo SEO ,  Kwang Soo KIM ,  Young Hoon KWAK

Inventor： Young Ki LEE ,  Dong Soo SEO ,  Kwang Soo KIM ,  Young Hoon KWAK

IPC: H01L29/739

CPC classification number: H01L23/4824 ,  H01L29/7393 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.

Abstract translation: 本文公开了一种功率半导体模块，包括：电路板，其上形成有栅极，发射极和集电极图案; 安装在所述电路板上的第一半导体芯片，在其一个表面上形成有栅极和发射极端子，并且在其另一个表面上形成集电极端子; 安装在所述第一半导体芯片上的第二半导体芯片，具有在其一个表面上形成的阴极端子，并且在其另一个表面上形成阳极端子; 第一导电连接构件，其一端设置在第一半导体芯片的集电极端子和第二半导体芯片的阴极端子之间，另一端接触电路板的集电体图案; 以及第二导电连接构件，其一端接触第二半导体芯片的阳极端子，另一端接触电路板的发射极图案。

公开(公告)号：US20130020687A1

公开(公告)日：2013-01-24

申请号：US13301616

申请日：2011-11-21

Applicant: Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Jin Suk Son

Inventor： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Jin Suk Son

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L21/50 ,  H01L21/565 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

Abstract translation: 这里公开了功率模块封装及其制造方法。 功率模块封装包括彼此相对设置的第一和第二引线框架; 形成在所述第一引线框架和所述第二引线框架中的两个或第二引线框架的第一表面的一部分上的陶瓷涂层; 以及安装在第一和第二引线框架的第二表面上的半导体器件。

公开(公告)号：US20130009290A1

公开(公告)日：2013-01-10

申请号：US13247603

申请日：2011-09-28

Applicant: Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

Inventor： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

IPC: H01L25/065 ,  H01L21/98

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/291 ,  H01L2224/29187 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.

Abstract translation: 本文公开了一种功率模块封装，包括：第一基板; 第二基板，其具有用于连接到其一个表面的一侧或两侧上的第一基板的焊盘，并且具有用于连接到形成在其另一个表面上的外部的外部连接端子; 以及引线框架，其一端接合到第一基板，另一端接合到第二基板的焊盘，从而使第一和第二基板彼此垂直连接。

公开(公告)号：US20120273116A1

公开(公告)日：2012-11-01

申请号：US13536815

申请日：2012-06-28

Applicant: Young Ho SOHN ,  Seog Moon CHOI ,  Sung Keun PARK ,  Young Ki LEE ,  Bum Sik JANG ,  Ji Hyun PARK

Inventor： Young Ho SOHN ,  Seog Moon CHOI ,  Sung Keun PARK ,  Young Ki LEE ,  Bum Sik JANG ,  Ji Hyun PARK

IPC: B32B38/04 ,  B32B38/08

CPC classification number: H05K3/4623 ,  H05K1/056 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096

Abstract: Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same.

Abstract translation: 本发明公开了一种散热基板，其结构是将两个分别包含发热功能的金属芯片的两层芯基板彼此并联并相互并联，从而实现更好的辐射性能， 制造相同。

公开(公告)号：US20110316035A1

公开(公告)日：2011-12-29

申请号：US12897936

申请日：2010-10-05

Applicant: Sang Hyun Shin ,  Tae Hoon Kim ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park ,  Ki Ho Seo

Inventor： Sang Hyun Shin ,  Tae Hoon Kim ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park ,  Ki Ho Seo

IPC: H01L33/48 ,  H01L33/64

CPC classification number: H05K3/0061 ,  H01L23/4006 ,  H01L33/641 ,  H01L33/642 ,  H01L2023/4062 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/05 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2203/0315 ,  H01L2924/00

Abstract: Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided.

Abstract translation: 本发明公开了一种散热基板，其特征在于，具备包括金属层的基底基板，在所述金属层的一个面上形成的绝缘层，以及在所述绝缘层上形成的电路层，形成在所述绝缘层的另一面的散热层 所述金属层，用于将所述基底基板和所述散热层彼此连接的连接器，形成在所述基底基板的厚度方向上并且所述连接器被插入的开口的开口以及形成在所述基底基板中的任一个或两者上的阳极氧化层 金属层的另一表面和侧表面，并且其中金属层和散热层通过阳极氧化层彼此绝缘，从而防止静电或电压冲击向金属层传递。 还提供了制造散热基板的方法。

公开(公告)号：US20110310751A1

公开(公告)日：2011-12-22

申请号：US13036521

申请日：2011-02-28

Applicant: June-Hwa Song ,  Yun-Seok Rhee ,  Young-Ki Lee ,  Chul-Hong Min ,  Young-Hyun Ju ,  Tai-Woo Park ,  Jin-Won Lee ,  Seung-Woo Kang

Inventor： June-Hwa Song ,  Yun-Seok Rhee ,  Young-Ki Lee ,  Chul-Hong Min ,  Young-Hyun Ju ,  Tai-Woo Park ,  Jin-Won Lee ,  Seung-Woo Kang

IPC: H04L12/26

CPC classification number: H04W84/18 ,  G06F9/50

Abstract: A mobile apparatus includes a processing planner and a plan processor. The processing planner generates a plurality of resource use plans in response to a context monitoring query (CMQ) of an application, and selects a final plan satisfying a request of the CMQ among the resource use plans. The plan processor executes the final plan. Accordingly, the mobile apparatus may support resource-efficient context monitoring.

Abstract translation: 移动装置包括处理计划器和计划处理器。 处理计划器响应于应用的上下文监视查询（CMQ）生成多个资源使用计划，并且在资源使用计划中选择满足CMQ的请求的最终计划。 计划处理器执行最终计划。 因此，移动装置可以支持资源有效的上下文监控。

公开(公告)号：US07829219B2

公开(公告)日：2010-11-09

申请号：US11314210

申请日：2005-12-21

Applicant: Hui Chan Yun ,  Jong Seob Kim ,  Ho Seok Yang ,  Young Ki Lee ,  Dong Hak Kwak

Inventor： Hui Chan Yun ,  Jong Seob Kim ,  Ho Seok Yang ,  Young Ki Lee ,  Dong Hak Kwak

IPC: H01M4/60 ,  H01M4/62

CPC classification number: H01M4/131 ,  H01M4/623 ,  H01M4/628 ,  H01M10/052 ,  H01M2004/028

Abstract: A cathode for lithium secondary batteries coated with a slurry including an active material, a binder and a solvent, and further including a polymerization inhibitor, is disclosed. Gelation of the slurry is prevented during production of the cathode so that adhesion of the slurry is enhanced, thus achieving improved coating properties of the cathode and facilitating the coating of the slurry.

Abstract translation: 公开了一种涂覆有包含活性材料，粘合剂和溶剂的浆料的锂二次电池的阴极，并且还包括阻聚剂。 在阴极生产过程中防止浆料的凝胶化，从而提高了浆料的粘附性，从而实现了阴极的改善的涂层性能并且有利于浆料的涂覆。

公开(公告)号：US20100032705A1

公开(公告)日：2010-02-11

申请号：US12238663

申请日：2008-09-26

Applicant: Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

Inventor： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.

Abstract translation: 本发明提供一种LED封装体，其具有形成有一个以上的通孔的金属基板; 绝缘层，其形成在包括所述通孔的内表面的所述金属基板的表面上; 多个金属图案，形成在绝缘层上并且彼此电隔离; 以及安装在多个金属图案中的金属图案上的LED芯片。

公开(公告)号：US20090270207A1

公开(公告)日：2009-10-29

申请号：US12244557

申请日：2008-10-02

Applicant: Young Ki Lee

Inventor： Young Ki Lee

IPC: F42B6/08

CPC classification number: F42B6/08

Abstract: The present invention relates to an arrow for hunting that includes: an arrow shaft member of a predetermined length having a recess part formed on one end thereof so as to insert a bowstring of a bow thereinto and a spiral insertion protruding part formed at the inside on the other end thereof; a plurality of wing members mounted near the recess part of the arrow shaft member in such a manner as to be spaced apart by a predetermined distance from each other along the outer periphery of the arrow shaft member; and an arrowhead having a pointed shape at the end thereof in such a manner as to be adapted to be inserted into the body of the hunting target and a spiral protruding part formed along the outer periphery of the end portion protruded from the other end thereof.

Abstract translation: 本发明涉及一种用于捕猎的箭头，包括：具有预定长度的箭头轴构件，其具有在其一端形成的凹部，以便将弓形弓弦插入其中，并且在其上形成螺旋形插入突出部分 其另一端; 沿着箭头轴构件的外周彼此间隔开预定距离的方式安装在箭头轴构件的凹部附近的多个翼构件; 以及在其端部具有尖端形状的箭头，以便适于插入到所述猎物的主体中，并且沿着从其另一端突出的端部的外周形成螺旋形突出部。

公开(公告)号：US20090227050A1

公开(公告)日：2009-09-10

申请号：US12467513

申请日：2009-05-18

Applicant: Sang Hyun SHIN ,  Seog Moon CHOI ,  Young Ki LEE

Inventor： Sang Hyun SHIN ,  Seog Moon CHOI ,  Young Ki LEE

IPC: H01L21/00

CPC classification number: H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

Abstract translation: 使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。 根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。