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55 条记录 (耗时 0.019 秒)

    Semiconductor package substrate
    16.
    发明授权
    Semiconductor package substrate 有权
    半导体封装基板

    公开(公告)号：US07732913B2

    公开(公告)日：2010-06-08

    申请号：US11701767

    申请日：2007-02-02

    申请人： Tsung-Tien Hsieh ,  Wen-Jung Chiang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao ,  Sen-Yen Yang

    发明人： Tsung-Tien Hsieh ,  Wen-Jung Chiang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao ,  Sen-Yen Yang

    IPC分类号： H01L23/04

    CPC分类号： H01L23/49827 ,  H01L23/64 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/114 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09636 ,  H05K2201/09718 ,  H01L2924/00

    摘要： A semiconductor package substrate is provided, which includes a substrate body having a plurality of conductive through holes formed therein, wherein at least two adjacent conductive through holes are formed as a differential pair, each of which has a ball pad formed at an end thereof; and at least one electrically integrated layer formed in the substrate body, and having an opening corresponding to the two adjacent conductive through holes formed as the differential pair and the ball pads thereof. Thus, the spacing between the conductive through holes and the electrically integrated layer and the spacing between the ball pads can be enlarged by the opening, so as to balance the impedance match.

    摘要翻译： 提供了一种半导体封装基板，其包括其中形成有多个导电通孔的基板主体，其中至少两个相邻的导电通孔形成为差分对，每个导体通孔在其一端形成有球垫; 以及形成在所述基板主体中的至少一个电气集成层，并且具有与形成为所述差动对的两个相邻的导电通孔对应的开口及其球垫。 因此，可以通过开口来扩大导电通孔和电气集成层之间的间隔以及球垫之间的间隔，从而平衡阻抗匹配。

    Heat dissipation unit and a semiconductor package that has the heat dissipation unit
    18.
    发明申请
    Heat dissipation unit and a semiconductor package that has the heat dissipation unit 审中-公开
    散热单元和具有散热单元的半导体封装

    公开(公告)号：US20080246142A1

    公开(公告)日：2008-10-09

    申请号：US12080798

    申请日：2008-04-04

    申请人： Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

    发明人： Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/367

    CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A heat dissipation unit and a semiconductor package having the same are disclosed. The semiconductor package includes a carrier; an electronic component mounted on and electrically connected to the carrier; a heat dissipation unit, which includes a flat section attached to the electronic component, extension sections connected to the flat section, and a heat dissipation section connected to the extension sections; and an encapsulant encapsulating the electronic component and the heat dissipation unit, wherein stress releasing sections are at least disposed at intersectional corners between the extension sections and the flat section so as to prevent projections from being formed by concentrated stresses in a punching process of the heat dissipation unit, thereby maintaining flatness of the flat section and further preventing circuits of the electronic component from being damaged due to a contact point produced between the electronic component and the flat section in a molding process.

    摘要翻译： 公开了一种散热单元和具有该散热单元的半导体封装。 半导体封装包括载体; 电子部件，其安装在所述载体上并与其电连接; 散热单元，其包括附接到所述电子部件的平坦部分，连接到所述平坦部分的延伸部分和连接到所述延伸部分的散热部分; 以及封装电子部件和散热部的密封剂，其中应力释放部至少设置在延伸部和平坦部之间的交叉角处，以防止在热冲压加工中由于集中应力而形成突起 从而保持平坦部分的平坦度，并且进一步防止电子部件的电路在模制过程中由于在电子部件和平坦部分之间产生的接触点而损坏。

    High electrical performance semiconductor package
    20.
    发明授权
    High electrical performance semiconductor package 有权
    高电性能半导体封装

    公开(公告)号：US07361846B2

    公开(公告)日：2008-04-22

    申请号：US10974376

    申请日：2004-10-26

    申请人： Wen-Jung Chiang ,  Chien-Te Chen ,  Yu-Po Wang

    发明人： Wen-Jung Chiang ,  Chien-Te Chen ,  Yu-Po Wang

    IPC分类号： H05K1/16

    CPC分类号： H01L23/49838 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

    摘要： A high electrical performance semiconductor package is proposed. A carrier is provided having a first surface, an opposite second surface, and conductive vias for electrically connecting the first surface to the second surface. A chip is attached to the first surface of the carrier. A plurality of via lands are disposed peripherally on the first surface of the carrier and electrically connected to the vias. A plurality of conductive regions are disposed on the second surface of the carrier and electrically connected to the vias. A plurality of fingers are disposed around the chip and electrically connected to the via lands by conductive traces formed on the first surface of the carrier. A plurality of bonding wires electrically connect the chip to the fingers. Lengths of the wires for transmitting differential pair signals are substantially equal, and lengths of the traces for transmitting the differential pair signals are substantially equal.

    摘要翻译： 提出了一种高性能半导体封装。 提供具有第一表面，相对的第二表面和用于将第一表面电连接到第二表面的导电通孔的载体。 芯片附接到载体的第一表面。 多个通孔焊盘周边设置在载体的第一表面上并电连接到通孔。 多个导电区域设置在载体的第二表面上并电连接到通孔。 多个指状物设置在芯片周围，并通过形成在载体的第一表面上的导电迹线电连接到通孔焊盘。 多个接合线将芯片电连接到手指。 用于传输差分对信号的导线的长度基本相等，用于发送差分对信号的迹线的长度基本相等。