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11.发明授权公开(公告)号：US09577304B2
公开(公告)日：2017-02-21
申请号：US14637898
申请日：2015-03-04
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Chih-Heng Chuo , Gwun-Jin Lin , Kuo-Fu Su
CPC classification number: H01P1/227 , H03H7/38 , H05K1/0225 , H05K1/0251 , H05K1/116 , H05K1/189 , H05K3/3447 , H05K2201/0715 , H05K2201/093 , H05K2201/09381 , H05K2201/0939 , H05K2201/09718 , H05K2201/10931
Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.
Abstract translation: 公开了一种具有插入部件的电路板的高频连接焊盘的衰减减小结构。 电路板包括形成在其上的至少一对差模信号线。 衬底具有分别设置有至少一对上连接焊盘和下连接焊盘的上表面和下表面。 第一金属层形成在基板的下表面上。 第一金属层包括衰减减小接地图案结构。 衰减降低接地图案结构包括中空区域和至少一个突出部分。 突出部分沿着朝向下连接焊盘的方向从第一金属层延伸。
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12.发明授权公开(公告)号：US09313890B2
公开(公告)日：2016-04-12
申请号：US14478322
申请日：2014-09-05
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Chih-Heng Chuo , Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/118 , H05K1/024 , H05K1/025 , H05K1/117 , H05K2201/0191
Abstract: An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.
Abstract translation: 电路板的衰减减小结构包括在高频信号接触焊盘和电路板的接地层之间形成的膨胀厚度。 膨胀的厚度大于接地层和高频信号线之间的参考厚度。 电路板由聚对苯二甲酸乙二醇酯（PET）或聚酰亚胺（PI）制成。 或者，使用包括树脂和纤维材料的刚性板或刚挠板。 电路板可以是通过组合至少两个单层电路板而形成的单层电路板或多层板。 在高频信号接触焊盘和接地层之间安装厚度扩大的焊盘，或者增加电路板的接合层的一部分的厚度以提供膨胀的厚度。
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13.发明授权公开(公告)号：US09040835B2
公开(公告)日：2015-05-26
申请号：US14108790
申请日：2013-12-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H05K1/0245 , H05K1/0225 , H05K1/118 , H05K3/4069 , H05K2201/09845
Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.
Abstract translation: 柔性电路板的差分信号传输线的衰减降低接地结构包括柔性基板，在该柔性基板上至少有一对差模信号线，至少一个接地线，覆盖绝缘层和薄金属箔 形成层。 至少一个通孔延伸穿过薄金属箔层和覆盖绝缘层，并且对应于接地线的导电接触区。 通孔填充有导电膏层，以将薄金属箔层电连接到接地线的导电接触区域，以提供良好的接地布置。 薄金属箔层包括形成在对应于差模信号线的顶角的位置处的多个开口。
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公开(公告)号：US08753143B2
公开(公告)日：2014-06-17
申请号：US13649184
申请日：2012-10-11
Applicant: Advanced Flexible Circuits Co., Ltd.
Inventor： Kuo-Fu Su , Gwun-Jin Lin , Chih-Heng Chuo
IPC: H01R12/00
CPC classification number: H01R4/024 , H01R12/594 , H01R12/65 , H01R12/79
Abstract: A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.
Abstract translation: 用于柔性电路电缆的连接结构包括柔性电路电缆，该柔性电路电缆具有柔性电路基板，该电路基板的第一端与连接器外壳的焊台相连接，该第一端分别对应于电缆的柔性电路电缆的导线的第一指垫导电触点 连接器的金属导电端子的焊接部分。 在每个导电线的第一指垫导电接触件的金属涂层和相应的金属导电端子的电缆焊接部分之间形成焊接层，以将柔性电路电缆的导线设置成与金属电连接 连接器的导电端子。
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公开(公告)号：US10980113B2
公开(公告)日：2021-04-13
申请号：US16412613
申请日：2019-05-15
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
Abstract: A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.
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Patent Agency Ranking
公开(公告)号：US10159143B1
公开(公告)日：2018-12-18
申请号：US16044962
申请日：2018-07-25
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. A resin-based conductive adhesive layer is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The resin-based conductive adhesive layer is pressed to bond between the conductive paste coating zone and a top insulation layer such that the conductive paste coating zone and the resin-based conductive adhesive layer achieve electrical connection therebetween.
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公开(公告)号：US09913369B2
公开(公告)日：2018-03-06
申请号：US15450204
申请日：2017-03-06
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Chih-Heng Chuo , Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/0245 , H05K1/0216 , H05K1/0219 , H05K1/0224 , H05K1/024 , H05K1/0253 , H05K1/032 , H05K2201/09336
Abstract: A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.
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18.发明授权公开(公告)号：US09252510B2
公开(公告)日：2016-02-02
申请号：US14068041
申请日：2013-10-31
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H01R12/592 , H01R43/0256
Abstract: Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.
Abstract translation: 公开了一种用于将至少一个连接器安装在柔性电路板上的焊接结构。 连接器包括SMD引脚和焊锡引脚。 柔性电路板具有连接器安装部分，其具有形成有SMD焊接区域和焊料浸渍针孔的部件表面。 加强板联接到柔性电路板的加强结合表面。 加强板具有与柔性电路板的焊料浸渍针孔相对应的通孔。 连接器的SMD引脚分别焊接到柔性电路板的SMD焊接区域，连接器的焊料浸渍引脚分别插入柔性电路板的焊料浸渍针孔和 加强板加固板的焊接表面，以焊接材料焊接。
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公开(公告)号：US10219379B1
公开(公告)日：2019-02-26
申请号：US15670232
申请日：2017-08-07
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Chih-Heng Chuo , Kuo-Fu Su
Abstract: A stacked flexible printed circuit board assembly with a side connection section is provided, including a first flexible printed circuit board, a second flexible printed circuit board, and a curved connection section. The curved connection section is integrally connected to and between side edges of the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board is folded in a direction toward and thus stacked on the second flexible printed circuit board such that a plurality of first contact pads of the first flexible printed circuit board correspond respectively to a plurality of second contact pads of the second flexible printed circuit board. A height adjustment layer or an adhesive layer is provided between the first flexible printed circuit board and the second flexible printed circuit board to suit the need of thickness in plugging or soldering.
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公开(公告)号：US09775249B2
公开(公告)日：2017-09-26
申请号：US15240155
申请日：2016-08-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K3/007 , H05K1/0281 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/025 , H05K3/064 , H05K3/188 , H05K3/429 , H05K2201/0338 , H05K2201/0352 , H05K2201/09563 , H05K2203/0152
Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.
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