公开(公告)号：US11724362B2

公开(公告)日：2023-08-15

申请号：US17114633

申请日：2020-12-08

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Aniruddh Jagdish Khanna ,  Jason G. Fung ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Veera Raghava Reddy Kakireddy ,  Gregory E. Menk ,  Nag B. Patibandla

IPC: B24D11/00 ,  B24D11/04 ,  B24D3/28 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y80/00

CPC classification number: B24D11/001 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/28 ,  B24D11/04 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US10953515B2

公开(公告)日：2021-03-23

申请号：US15352647

申请日：2016-11-16

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  B24D3/28 ,  B24D11/00 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00 ,  B29C35/08 ,  C09D4/00 ,  C09G1/16 ,  B33Y70/00 ,  B29K33/04

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US11986922B2

公开(公告)日：2024-05-21

申请号：US16731492

申请日：2019-12-31

Applicant: Applied Materials, Inc.

Inventor： Jason G. Fung ,  Rajeev Bajaj ,  Daniel Redfield ,  Aniruddh Jagdish Khanna ,  Mario Cornejo ,  Gregory E. Menk ,  John Watkins

IPC: B29C64/00 ,  B24B37/26 ,  B24B49/00 ,  B24B49/10 ,  B24B49/14 ,  B24B49/16 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/306 ,  H01L21/66 ,  H01L21/67 ,  B29L31/00

CPC classification number: B24B37/26 ,  B24B49/003 ,  B24B49/10 ,  B24B49/14 ,  B24B49/16 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67253 ,  H01L21/67294 ,  H01L22/20 ,  B29K2995/0003 ,  B29K2995/0005 ,  B29L2031/736 ,  H01L22/12 ,  H01L22/26

Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

公开(公告)号：US11813712B2

公开(公告)日：2023-11-14

申请号：US17036623

申请日：2020-09-29

Applicant: Applied Materials, Inc.

Inventor： Aniruddh Jagdish Khanna ,  Jason G. Fung ,  Puneet Narendra Jawali ,  Rajeev Bajaj ,  Adam Wade Manzonie ,  Nandan Baradanahalli Kenchappa ,  Veera Raghava Reddy Kakireddy ,  Joonho An ,  Jaeseok Kim ,  Mayu Yamamura

IPC: B24B37/02 ,  B24B37/04 ,  B24B37/20

CPC classification number: B24B37/20 ,  B24B37/042

Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.

公开(公告)号：US11241839B2

公开(公告)日：2022-02-08

申请号：US16289213

申请日：2019-02-28

Applicant: Applied Materials, Inc.

Inventor： William H. McClintock ,  Rajeev Bajaj ,  Jason G. Fung ,  Daniel Redfield

IPC: B29C64/00 ,  B29C64/393 ,  G01B9/02 ,  G06F9/30 ,  B33Y50/02

Abstract: Embodiments disclosed herein provide methods of forming bond pad redistribution layers (RDLs) in a fan-out wafer level packaging (FOWLP) scheme using an additive manufacturing process. In one embodiment, a method of forming a redistribution layer includes positioning a carrier substrate on a manufacturing support of an additive manufacturing system, the carrier substrate including a plurality of singulated devices, detecting one or more fiducial features corresponding to each of the plurality of singulated devices, determining actual positions of each of the plurality of singulated devices relative to one or more components of the additive manufacturing system, generating printing instructions for forming a patterned dielectric layer based on the actual positions of each of the plurality of singulated devices, and forming the patterned dielectric layer using the printing instructions.

公开(公告)号：US10593574B2

公开(公告)日：2020-03-17

申请号：US14935134

申请日：2015-11-06

Applicant: Applied Materials, Inc.

Inventor： Jason G. Fung ,  Rajeev Bajaj ,  Daniel Redfield ,  Aniruddh Khanna ,  Mario Cornejo ,  Gregory E. Menk ,  John Watkins

IPC: B24B37/013 ,  H01L21/67 ,  B29C64/106 ,  B33Y10/00 ,  B33Y80/00 ,  B24B37/26 ,  B24B49/00 ,  B24B49/10 ,  B24B49/14 ,  B24B49/16 ,  H01L21/306 ,  H01L21/66 ,  B29L31/00

Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

公开(公告)号：US10391605B2

公开(公告)日：2019-08-27

申请号：US15287665

申请日：2016-10-06

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US10384330B2

公开(公告)日：2019-08-20

申请号：US14885950

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Aniruddh Khanna ,  Jason G. Fung ,  Mario Cornejo ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Veera Raghava Reddy Kakireddy ,  Ashavani Kumar ,  Venkat Hariharan ,  Gregory E. Menk ,  Fred C. Redeker ,  Nag B. Patibandla ,  Hou T. Ng ,  Robert E. Davenport ,  Amritanshu Sinha

IPC: B24D18/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US09776361B2

公开(公告)日：2017-10-03

申请号：US14863409

申请日：2015-09-23

Applicant: Applied Materials, Inc.

Inventor： Kasiraman Krishnan ,  Daniel Redfield ,  Russell Edward Perry ,  Gregory E. Menk ,  Rajeev Bajaj ,  Fred C. Redeker ,  Nag B. Patibandla ,  Mahendra C. Orilall ,  Jason G. Fung

IPC: B29C67/00 ,  B24B37/22 ,  B24B37/26 ,  B29K105/16 ,  B29L31/00

CPC classification number: B29C64/112 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/001 ,  B29K2105/16 ,  B29K2995/007 ,  B29L2031/736

Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.