公开(公告)号：US07671374B2

公开(公告)日：2010-03-02

申请号：US11861757

申请日：2007-09-26

申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC分类号： H01L29/205 ,  H01L23/495

CPC分类号： H01L25/0753 ,  H01L24/97 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2224/85 ,  H01L2924/00014

摘要： An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.

摘要翻译： 具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。 绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。 每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并且与不同的导电针电连接。 此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

公开(公告)号：US07655997B2

公开(公告)日：2010-02-02

申请号：US11041952

申请日：2005-01-26

申请人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

发明人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC分类号： H01L27/14

CPC分类号： H01L23/60 ,  H01L23/544 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer, this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

摘要翻译： 一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接，这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上进行。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶圆级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US20080099778A1

公开(公告)日：2008-05-01

申请号：US11588399

申请日：2006-10-27

申请人： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

发明人： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

IPC分类号： H01L33/00 ,  G09F9/33

CPC分类号： H01L33/56 ,  H01L25/167 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An LED package structure for increasing light-emitting efficiency includes: a substrate unit, and a plurality of fluorescence colloid units, LED units, conductive units and opaque units. The substrate unit has a main body and a plurality of through holes passing through the main body. Each fluorescence colloid unit is received in the corresponding through hole and having an installed surface. Each LED unit has a light-emitting surface disposed on the corresponding fluorescence colloid unit and facing the installed surface of the corresponding fluorescence colloid units. Each conductive unit is electrically connected between each two electrode areas that have the same pole and are respectively arranged on each LED unit and the main body. Each opaque unit is disposed on two corresponding lateral faces of the main body for covering the installed surface of the corresponding fluorescence colloid unit, the corresponding LED unit, and the corresponding conductive units.

摘要翻译： 用于提高发光效率的LED封装结构包括：基板单元和多个荧光胶体单元，LED单元，导电单元和不透明单元。 基板单元具有主体和穿过主体的多个通孔。 每个荧光胶体单元被接收在相应的通孔中并具有安装表面。 每个LED单元具有设置在相应的荧光胶体单元上并面对相应的荧光胶体单元的安装表面的发光表面。 每个导电单元电连接在具有相同极点并且分别布置在每个LED单元和主体上的每个两个电极区域之间。 每个不透明单元设置在主体的两个对应的侧面上，用于覆盖相应的荧光胶体单元的安装表面，相应的LED单元和相应的导电单元。

公开(公告)号：US07303984B2

公开(公告)日：2007-12-04

申请号：US11081527

申请日：2005-03-17

申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC分类号： H01L21/4763

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/0052 ,  H05K2201/09881 ,  H05K2203/0228 ,  H05K2203/0278 ,  H05K2203/1536

摘要： A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: providing a substrate forming a trench thereon, supplying a polymer composite material into the trench, polishing a surface of the substrate and forming a covering material on the surface of the substrate. Therefore, the method is provided for combining the polymer composite material into the substrate, thereby to raise cutting precision and strength of the semiconductor substrate structure.

摘要翻译： 半导体衬底结构包括其上形成有沟槽的衬底，提供到沟槽中的聚合物复合材料和形成在衬底上的电镀导电层。 此外，半导体衬底处理方法包括以下步骤：提供在其上形成沟槽的衬底，将聚合物复合材料供应到沟槽中，抛光衬底的表面并在衬底的表面上形成覆盖材料。 因此，提供了将聚合物复合材料组合到基板中的方法，从而提高半导体基板结构的切割精度和强度。

公开(公告)号：US20070152562A1

公开(公告)日：2007-07-05

申请号：US11711840

申请日：2007-02-28

申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Yu

发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Yu

IPC分类号： H01J1/62 ,  H01J63/04

CPC分类号： C09K11/7731 ,  C09K11/7734 ,  H01J1/62 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48091 ,  Y02B20/181 ,  H01L2924/00014

摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.

摘要翻译： 白光源具有放置在其上的蓝色发光二极管的基板和包围蓝色发光二极管的盖层。 盖层包括硅和磷掺合物的混合物，其比例为1:0.2-0.5。 荧光体掺合物包括红色荧光体，绿色荧光体和黄色荧光体。

公开(公告)号：US07211882B2

公开(公告)日：2007-05-01

申请号：US11085100

申请日：2005-03-22

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

IPC分类号： H01L23/02

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

摘要翻译： 描述了LED封装结构及其制造方法。 LED封装结构具有至少一个LED管芯，至少一个与LED管芯相关的金属框架，以及封装LED管芯和金属框架的绝缘体。 金属框架具有对应于LED管芯的第一接触件和相对于第一接触件的第二接触件。 绝缘体内的第一和第二触点彼此电隔离。 第一接触件具有围绕LED管芯的至少一个凹部，并且第二接触件具有形成在其上的至少一个凹槽。

公开(公告)号：US20070072506A1

公开(公告)日：2007-03-29

申请号：US11605425

申请日：2006-11-29

申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chao-Yuan Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chao-Yuan Huang

IPC分类号： H01J9/00 ,  H01J9/24

CPC分类号： G09F9/302 ,  G09F9/33 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/181 ,  H05K2201/0108 ,  H05K2201/10106 ,  Y02P70/611

摘要： A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.

摘要翻译： 对层叠型发光二极管显示装置及其制造方法进行说明。 层叠发光二极管显示装置具有绝缘体，放置在绝缘体上并具有彼此互连的多个电路的电路装置，以及电连接到电路的电路的多个SMT型发光二极管 单元。

公开(公告)号：US07049639B2

公开(公告)日：2006-05-23

申请号：US10855417

申请日：2004-05-28

申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

摘要： An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the holes to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

摘要翻译： LED封装结构具有形成有两个孔的基板。 两个导电元件中的一个延伸穿过两个孔，以电连接到衬底的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过孔连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。

公开(公告)号：US20060086945A1

公开(公告)日：2006-04-27

申请号：US10973408

申请日：2004-10-27

申请人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu ,  Ching-Hung Ko ,  Chun-Cheng Weng

发明人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu ,  Ching-Hung Ko ,  Chun-Cheng Weng

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014

摘要： A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.

摘要翻译： 描述了一种用于光电半导体的封装结构。 封装结构具有用于传热的导热结构，并且整体形成为一体以提高其结构强度，而导热结构防止LED器件的过热延长寿命。 封装结构降低了生产中的故障率，并提高了质量。 当本发明应用于发光二极管封装中时，可以达到特殊要求并具有比现有技术更好的性能。

公开(公告)号：US20050274957A1

公开(公告)日：2005-12-15

申请号：US10855417

申请日：2004-05-28

申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

IPC分类号： H01L27/15 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

摘要： An LED packaging structure has a substrate having two drills formed thereon. One of two conductive elements extends through the two drills to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the drills to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

摘要翻译： LED封装结构具有形成有两个钻头的基板。 两个导电元件中的一个延伸穿过两个钻头，以电连接到基板的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过钻头以连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。