公开(公告)号：US20080035603A1

公开(公告)日：2008-02-14

申请号：US11614362

申请日：2006-12-21

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H01B13/00 ,  B44C1/22 ,  C23F1/00

CPC classification number: C23F1/08 ,  H05K3/068 ,  H05K2203/075

Abstract: The present invention relates to an apparatus for spraying an etchant and a method for manufacturing a printed circuit board. In one exemplary embodiment the apparatus includes a manifold, a plurality of feed pipes in fluid communication with the manifold, each of the feed pipes having a plurality of spray nozzles mounted thereon, the feed pipes cooperatively constitute a spray region, and a pressure-boosting device configured for increasing a spray pressure of the spray nozzles which are located at a central area of the spray region. The apparatus can overcome “the puddle effect” on an upper surface of the printed circuit board.

Abstract translation: 本发明涉及喷涂蚀刻剂的设备和印刷电路板的制造方法。 在一个示例性实施例中，设备包括歧管，与歧管流体连通的多个进料管，每个进料管具有安装在其上的多个喷嘴，进料管协同地构成喷射区域，并且加压 该装置被配置为增加位于喷射区域的中心区域处的喷嘴的喷雾压力。 该设备可以克服印刷电路板上表面上的“水坑效应”。

公开(公告)号：US20120009669A1

公开(公告)日：2012-01-12

申请号：US13087664

申请日：2011-04-15

Applicant: SHOW-WEN LIU ,  CHENG-HSIEN LIN ,  YU CHANG ,  CHENG-FANG HSU ,  TSYH-LANG LIN

Inventor： SHOW-WEN LIU ,  CHENG-HSIEN LIN ,  YU CHANG ,  CHENG-FANG HSU ,  TSYH-LANG LIN

IPC: C07H15/04 ,  C12N5/071 ,  C07K14/00

CPC classification number: C07H15/04

Abstract: A bifunctional compound with a monosaccharide and a N2S2 ligand, and more particularly, a bifunctional compound with a N2S2 ligand and aminohexylacetyl galactosamine (ah-GalNAc4) is provided. A method for preparing the bifunctional compound with a monosaccharide and a N2S2 ligand is also provided, including activating a carboxyl group in an organic ligand, reacting the activated carboxyl group with a galactopyranoside through amidation, and then hydrolyzing. The bifunctional compound of the present invention is widely useful in nuclear medicine for preparation of liver imaging agents for assisting in correct diagnosis of diseases.

Abstract translation: 提供了具有单糖和N2S2配体的双官能化合物，更具体地，提供了具有N 2 S 2配体和氨基己基乙酰基半乳糖胺（ah-GalNAc 4）的双官能化合物。 还提供了用单糖和N 2 S 2配体制备双功能化合物的方法，包括活化有机配体中的羧基，通过酰胺化使活化的羧基与吡喃半乳糖苷反应，然后水解。 本发明的双功能化合物在制备用于辅助正确诊断疾病的肝成像剂的核医学中广泛有用。

公开(公告)号：US20110313183A1

公开(公告)日：2011-12-22

申请号：US13087862

申请日：2011-04-15

Applicant: SHOW-WEN LIU ,  CHENG-HSIEN LIN ,  TSYH-LANG LIN ,  CHENG-FANG HSU ,  YU CHANG

Inventor： SHOW-WEN LIU ,  CHENG-HSIEN LIN ,  TSYH-LANG LIN ,  CHENG-FANG HSU ,  YU CHANG

IPC: C07F7/22 ,  C07C213/10

CPC classification number: C07F7/2208

Abstract: A method for preparation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine is provided, which includes formation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine, useful as a precursor of a norepinephrine transporter (NET) contrast label [123Iodine](R)—N-methyl-3-(2-iodophenoxy)-3-phenylpropanamine ([123I]MIPP) with a leaving group Bu3Sn.

Abstract translation: 提供了制备N-甲基-3-（2-三丁基甲锡烷基苯氧基）-3-苯基丙胺的方法，包括形成N-甲基-3-（2-三丁基甲锡烷基苯氧基）-3-苯基丙胺，可用作去甲肾上腺素的前体 转运蛋白（NET）对比标记物[123碘]（R）-N-甲基-3-（2-碘苯氧基）-3-苯基丙胺（[123 I] MIPP）与离去基团Bu 3 Sn。

公开(公告)号：US20090013526A1

公开(公告)日：2009-01-15

申请号：US11959212

申请日：2007-12-18

Applicant: CHIH-KANG YANG ,  CHENG-HSIEN LIN

Inventor： CHIH-KANG YANG ,  CHENG-HSIEN LIN

IPC: H05K3/36 ,  H05K3/42

CPC classification number: H05K3/0097 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/242 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/1028 ,  H05K2203/1536 ,  H05K2203/1545 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T428/15

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards.

Abstract translation: 提供了用于制造多层印刷电路板的示例性内基板。 内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。 每个基板单元被构造成用于形成一体的印刷电路板。 每个折叠部分在相邻的基板单元之间互连。 每个折叠部分限定垂直于内部基板的纵向方向的至少一条线弱点，以便于相邻的基板单元相互折叠和展开。 还提供了使用内部基板制造多层印刷电路板的示例性方法。 该方法可以提高制造多层印刷电路板的效率。

公开(公告)号：US20100059910A1

公开(公告)日：2010-03-11

申请号：US12535909

申请日：2009-08-05

Applicant: WEN-TSUN CHEN ,  SHIN-CHIH LIAW ,  TAO-MING LIAO ,  CHIA-HUNG SHEN ,  CHENG-HSIEN LIN

Inventor： WEN-TSUN CHEN ,  SHIN-CHIH LIAW ,  TAO-MING LIAO ,  CHIA-HUNG SHEN ,  CHENG-HSIEN LIN

IPC: C22B3/02

CPC classification number: C22B7/006 ,  C02F2101/20 ,  C02F2103/346 ,  C22B3/02 ,  C22B3/46 ,  C22B15/0091 ,  Y02P10/234 ,  Y02P10/236

Abstract: An apparatus for recycling metals from metal ions containing waste solution includes a conveying device, a reducing agent supplier and a solution supplier. The conveying device includes a first ferromagnetic conveyor belt, a first roller, and a second roller. The first and second rollers are substantially horizontally arranged, and the second roller is arranged at a lower position relative to the first roller and spaced from the first roller. The ferromagnetic conveyor belt is wrapped around the first and second rollers. The reducing agent supplier is used for supplying a reducing agent onto the first conveyor belt, the ferromagnetic conveyor belt is capable of conveying the reducing agent from the second roller to the first roller. The solution supplier is configured for supplying the waste solution onto the first conveyor belt.

Abstract translation: 用于从含金属离子的废液中回收金属的设备包括输送装置，还原剂供应商和溶液供应商。 输送装置包括第一铁磁输送带，第一辊和第二辊。 第一和第二辊基本上是水平布置的，并且第二辊布置在相对于第一辊子的下部位置并与第一辊子间隔开。 铁磁输送带缠绕在第一和第二辊子周围。 还原剂供应器用于将还原剂供应到第一传送带上，铁磁传送带能够将还原剂从第二辊输送到第一辊。 解决方案供应商被配置为将废溶液供应到第一传送带上。

公开(公告)号：US20090286006A1

公开(公告)日：2009-11-19

申请号：US12327621

申请日：2008-12-03

Applicant: CHENG-HSIEN LIN ,  QIU-YUE ZHANG ,  YAO-WEN BAI

Inventor： CHENG-HSIEN LIN ,  QIU-YUE ZHANG ,  YAO-WEN BAI

IPC: C09D11/00 ,  B05D3/06

CPC classification number: H05K3/182 ,  C09D11/38 ,  C09D11/52 ,  C23C18/14 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1651 ,  C23C18/405 ,  C23C18/44 ,  H05K3/105 ,  H05K2203/013 ,  H05K2203/1157

Abstract: An exemplary ink for forming electrical traces includes an aqueous carrier medium, a palladium salt and a reducing agent. The palladium salt is capable of being dissolved in the aqueous carrier medium. The reducing agent is configured for reducing the palladium ions into palladium particles under an irradiation ray.

Abstract translation: 用于形成电迹线的示例性油墨包括水性载体介质，钯盐和还原剂。 钯盐能够溶解在载体介质中。 还原剂被配置为在照射光线下将钯离子还原成钯颗粒。

公开(公告)号：US20090050677A1

公开(公告)日：2009-02-26

申请号：US12102613

申请日：2008-04-14

Applicant: JIAN-YI HAO ,  I-HSIEN CHIANG ,  CHENG-HSIEN LIN

Inventor： JIAN-YI HAO ,  I-HSIEN CHIANG ,  CHENG-HSIEN LIN

IPC: B23K31/02

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K2101/40 ,  B23K2101/42 ,  H05K2203/0165 ,  H05K2203/1581

Abstract: An exemplary method of welding electronic components on PCBs is disclosed. Firstly, a metal tray including a number of supporting areas is provided. At least one through hole is formed in each of the supporting areas. Secondly, solder pastes are applied onto welding pads of PCBs. Thirdly, electronic components are mounted on the welding pads. Fourthly, PCBs are placed on the metal tray in a manner that each printed circuit board is placed in a corresponding supporting area and the welding pads being above the through hole. Finally, the solder pastes are heated to weld the electronic components on the printed circuit board. By doing so, the heat can pass through the through holes in each supporting area directly and fully melt the solder paste. As a result, welding defects can be reduced.

Abstract translation: 公开了一种在PCB上焊接电子部件的示例性方法。 首先，提供包括多个支撑区域的金属托盘。 在每个支撑区域中形成至少一个通孔。 其次，将焊膏施加到PCB的焊盘上。 第三，将电子部件安装在焊盘上。 第四，将印刷电路板放置在金属托盘上，使每个印刷电路板放置在相应的支撑区域中，焊盘位于通孔上方。 最后，焊膏被加热以焊接印刷电路板上的电子部件。 通过这样做，热能够直接通过每个支撑区域中的通孔并使焊膏完全熔化。 结果，可以减少焊接缺陷。

公开(公告)号：US20080148562A1

公开(公告)日：2008-06-26

申请号：US11877585

申请日：2007-10-23

Applicant: CHIH-YI TU ,  CHENG-HSIEN LIN ,  MING WANG

Inventor： CHIH-YI TU ,  CHENG-HSIEN LIN ,  MING WANG

IPC: H05K3/10

CPC classification number: H05K3/4697 ,  H05K1/0393 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract translation: 制造多层FPCB的方法包括以下步骤：提供第一覆铜层压板，第二覆铜层压板和粘合剂层; 在粘合剂层上限定开口; 在所述第一覆铜层压板上限定第一狭缝; 层压第一覆铜层压板，粘合剂层和第二覆铜层压板; 限定用于在所述第一覆铜层压板和所述第二覆铜层压板之间建立电连接的通孔; 切割第一覆铜层压板，粘合剂层和第二覆铜层压板，从而形成在不同区域中具有不同层数的多层柔性印刷电路板。

公开(公告)号：US20110274866A1

公开(公告)日：2011-11-10

申请号：US13186486

申请日：2011-07-20

Applicant: CHIH-KANG YANG ,  CHENG-HSIEN LIN

Inventor： CHIH-KANG YANG ,  CHENG-HSIEN LIN

IPC: B65D65/28

CPC classification number: H05K3/0097 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/242 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/1028 ,  H05K2203/1536 ,  H05K2203/1545 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T428/15

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. Each of the folding portions defines at least one groove in at least one side thereof along the at least one line of weakness.

Abstract translation: 提供了用于制造多层印刷电路板的示例性内基板。 内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。 每个基板单元被构造成用于形成一体的印刷电路板。 每个折叠部分在相邻的基板单元之间互连。 每个折叠部分限定垂直于内部基板的纵向方向的至少一条弱线，以便于相邻的基板单元相互折叠和展开。 每个折叠部分沿着至少一条弱点在其至少一侧限定至少一个凹槽。

公开(公告)号：US20100051331A1

公开(公告)日：2010-03-04

申请号：US12468841

申请日：2009-05-19

Applicant: CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  CHENG-HSIEN LIN

IPC: H05K1/03

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/4985 ,  H01L2224/48091 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00014

Abstract: A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in the polymer matrix. The composite layer has a first surface in contact with the metal substrate and an opposite second surface. Each of the carbon nanotubes extends from the first surface to the second surface inclined at an angle of from 80° to 100° relative to the first surface.

Abstract translation: 用于安装电子部件的电路基板包括金属基底层，具有导电迹线的导电层和设置在金属基底层和导电层之间的复合层。 复合层包括聚合物基质和嵌入聚合物基质中的多个碳纳米管。 复合层具有与金属基底接触的第一表面和相对的第二表面。 每个碳纳米管从第一表面延伸到第二表面，相对于第一表面以80°至100°的角度倾斜。