公开(公告)号：US20070194456A1

公开(公告)日：2007-08-23

申请号：US11360200

申请日：2006-02-23

Applicant: Charles Cohn

Inventor： Charles Cohn

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H05K1/111 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/064 ,  H05K3/202 ,  H05K3/243 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09881 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0376 ,  Y02P70/611

Abstract: A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical trace. The dielectric layer substantially covers the one or more sidewalls of the mounting pad and has an uppermost surface that is substantially coplanar with the second surface of the mounting pad.

Abstract translation: 用于附接到集成电路芯片的电路基板包括电迹线，安装焊盘和介电层。 安装垫具有第一表面，一个或多个侧壁和第二表面。 第一个表面附着在电气痕迹上。 电介质层基本上覆盖安装焊盘的一个或多个侧壁，并且具有与安装焊盘的第二表面基本共面的最上表面。

公开(公告)号：US20060200249A1

公开(公告)日：2006-09-07

申请号：US11071540

申请日：2005-03-03

Applicant: Laurent Beguin ,  Denis Bouttens ,  Charles Cohn ,  Geert Declercq ,  Yann Brunnarius ,  Jean Grimberg ,  Dominique Huguet ,  Eric Lesprit ,  Pierre Massart ,  Bruno Rio ,  Jacques Teissier ,  Bruno Toussaint ,  Bruno Zipoli

Inventor： Laurent Beguin ,  Denis Bouttens ,  Charles Cohn ,  Geert Declercq ,  Yann Brunnarius ,  Jean Grimberg ,  Dominique Huguet ,  Eric Lesprit ,  Pierre Massart ,  Bruno Rio ,  Jacques Teissier ,  Bruno Toussaint ,  Bruno Zipoli

IPC: A61F2/40

CPC classification number: A61F2/4014 ,  A61F2/4059 ,  A61F2002/30332 ,  A61F2002/30405 ,  A61F2002/305 ,  A61F2002/30537 ,  A61F2002/3054 ,  A61F2002/30594 ,  A61F2002/30607 ,  A61F2002/3082 ,  A61F2002/4037 ,  A61F2002/4044 ,  A61F2220/0025 ,  A61F2220/0033 ,  A61F2250/0004 ,  A61F2250/0062 ,  A61F2310/00017 ,  A61F2310/00029

Abstract: This adaptable humeral implant comprises an anchoring stem (1, 8) and a male insert (6) or a female insert (30, 31) which are able to cooperate with the glenoid cavity or a glenoid implant. It additionally comprises a removable support (5) intended to fit directly or indirectly to the upper end (3) of the anchoring stem (1, 8) and to cooperate with an intermediate neck (7), which is itself provided with means for cooperation with the male or female implant.

Abstract translation: 这种适应性肱骨植入物包括能够与关节盂腔或关节盂植入物配合的锚固杆（1,8）和阳插入件（6）或阴插入件（30,31）。 它还包括一个可拆卸的支撑件（5），用于直接地或间接地配合到锚固杆（1,8）的上端（3）并与中间颈部（7）配合，该中间颈部本身设有用于配合的装置 与雄性或雌性植入物。

公开(公告)号：US5102829A

公开(公告)日：1992-04-07

申请号：US733542

申请日：1991-07-22

Applicant: Charles Cohn

Inventor： Charles Cohn

IPC: H01L23/12 ,  H01L23/24 ,  H01L23/36 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L23/49827 ,  H01L23/24 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0201 ,  H05K1/182 ,  H05K3/4641 ,  Y10T29/49139

Abstract: This invention is a simple and effective process of producing a plastic pin grid array package having an encapsulated device and a heat sink forming a unitary component of a main planar body of the package. The process includes fabrication of a laminated planar main body having outer plastic sheets provided with metallizations, a metal sheet of high thermal conductivity, and plastic sheets positioned intermediate the outer plastic sheets and the metal sheet, the metal sheet having clearance holes filled with plugs of the material of the intermediate plastic sheets, a plurality of plated-through holes (PTHs) formed in the main body and terminal pins secured in the PTHs. Some of the PTHs contacting the metal sheet and some passing through the plugs in the clearance holes out of contact with the metal sheet. The device, such as an integrated circuit chip, mounted in a recessed cavity in the main body, is in contact with the metal heat-sink. In this manner heat is conducted away from the device by the heat sink and dissipated through the back of the package and those of the terminal pins which are in PTHs contacting the heat sink.

公开(公告)号：US07157361B2

公开(公告)日：2007-01-02

申请号：US10878157

申请日：2004-06-28

Applicant: Musawir M. Chowdhury ,  Charles Cohn

Inventor： Musawir M. Chowdhury ,  Charles Cohn

IPC: H01L21/44

CPC classification number: H01L23/49805 ,  H01L21/4846 ,  H01L23/36 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/242 ,  H05K3/429 ,  H05K2201/0949 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit package is processed by electroplating the integrated circuit package. The electroplating is performed without forming plating traces on a conductive surface of a pad side of the integrated circuit package. Pad areas of the integrated circuit package are thus plated with one or more materials. An integrated circuit may be electrically coupled to pad areas on the integrated circuit package. The integrated circuit package can be electroplated by using the one or more current sources coupled to a back plane of the integrated circuit package. The back plane is patterned, wherein the patterning of the back plane occurs after the step of electroplating.

Abstract translation: 通过电镀集成电路封装来处理集成电路封装。 执行电镀而不在集成电路封装的焊盘侧的导电表面上形成电镀迹线。 因此，集成电路封装的焊盘区域被镀上一种或多种材料。 集成电路可以电耦合到集成电路封装上的焊盘区域。 集成电路封装可以通过使用耦合到集成电路封装的背板的一个或多个电流源进行电镀。 背面被图案化，其中背面的图案发生在电镀步骤之后。

公开(公告)号：US06509642B1

公开(公告)日：2003-01-21

申请号：US09628067

申请日：2000-07-28

Applicant: Charles Cohn

Inventor： Charles Cohn

IPC: H01L2334

CPC classification number: H01L24/49 ,  H01L23/36 ,  H01L23/50 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit package where the integrated circuit chip is mounted on a conductive slug and electrically coupled to the slug. Besides acting as a heat spreader, the conductive slug may also function as a ground plane. This reduces the need for additional conductive layers and plated through hole connections for forming connections to, for example, ground. As a result, the conductive paths in the internal ground planes are not necessarily cut off by the plated through holes used for interconnecting ground connections thus avoiding some of the electrical performance degradation suffered by prior techniques. In addition, the invention allows more signals to be added and/or the size of the integrated circuit chip to be reduced to enhance electrical performance. It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention.

Abstract translation: 集成电路封装，其中集成电路芯片安装在导电块上并电连接到芯块。 除了作为散热器之外，导电块还可以用作接地平面。 这减少了对附加导电层和电镀通孔连接的需要，以形成例如接地的连接。 结果，内部接地平面中的导电路径不一定被用于互连接地连接的电镀通孔所切断，从而避免了现有技术所遭受的一些电气性能下降。 此外，本发明允许增加更多的信号和/或减小集成电路芯片的尺寸以增强电性能。 应当理解，上述一般描述和以下详细描述都是本发明的示例性的，但不是限制性的。

公开(公告)号：US5926696A

公开(公告)日：1999-07-20

申请号：US655509

申请日：1996-05-30

Applicant: George Addis Baxter ,  Charles Cohn ,  Theodore Joseph Sattler ,  Lakshmendra S. Saxena

Inventor： George Addis Baxter ,  Charles Cohn ,  Theodore Joseph Sattler ,  Lakshmendra S. Saxena

IPC: H05K1/18 ,  H01L21/56 ,  H01L23/12 ,  H01L23/24 ,  H01L23/31 ,  H05K3/46 ,  H01L21/44 ,  H01L23/053 ,  H01L23/28 ,  H01L23/48

CPC classification number: H01L23/3128 ,  H01L23/24 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181

Abstract: A pad grid array plastic package includes a laminated plastic body with a centrally located cavity, an IC unit secured within the cavity, and an encapsulating organic polymer, such as epoxy, enclosing the cavity. The laminated body includes a substrate and a structural member on top of the substrate and having a centrally located aperture forming the cavity. The substrate is provided with metal patterns on both planar surfaces thereof, through-plated vias electrically connecting the metal patterns, and a grid array of contact pads on the bottom surface of the substrate, electrically connected to the metal pattern. The structural member provides strength and rigidity to the laminate and is sufficiently thick to enable protection of the IC unit when the cavity is enclosed with the encapsulating polymer. Also disclosed is a method of making the package and a laminate with the cavity, metal patterns and grid pad array for use in assembling the package.

Abstract translation: 焊盘格栅阵列塑料封装包括具有中心定位腔体的层压塑料体，固定在空腔内的IC单元以及包封空腔的封装有机聚合物，例如环氧树脂。 层压体包括基底和结构构件，在基底的顶部上并具有形成空腔的居中定位孔。 衬底在其两个平面表面上设置有金属图案，电连接金属图案的通孔和在衬底的底表面上的电连接到金属图案的接触焊盘的栅格阵列。 结构构件为层压体提供了强度和刚性，并且足够厚以便当空腔与封装聚合物封闭时能够保护IC单元。 还公开了一种制造该封装的方法，以及用于组装封装的空腔，金属图案和网格焊盘阵列的层压体。

公开(公告)号：US5299090A

公开(公告)日：1994-03-29

申请号：US85232

申请日：1993-06-29

Applicant: Kevin J. Brady ,  Charles Cohn

Inventor： Kevin J. Brady ,  Charles Cohn

IPC: H01L23/36 ,  H01L23/367 ,  H05K7/20

CPC classification number: H01L23/3677 ,  H01L2924/0002 ,  Y10T29/49393 ,  Y10T29/49789

Abstract: A housed integrated circuit unit package is provided with a heat sink for removal and dissipation of heat from electronic circuits housed in packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared out at the other end into a starburst or bouquet configuration, the pins being in the form of rods selected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a securing substance, such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration. The retained ends of the rods are dipped into a solder or heat-conducting adhesive and planarized to provide a planar surface for mounting the heat sink on the surface of the package.

Abstract translation: 封装的集成电路单元封装设置有用于从放置在封装中的电子电路移除和散发热量的散热器。 安装在包装的外表面上的散热器包括多个销，其一端固定在保持架上，另一端在另一端展开成星爆或花束构型，该销为选自实心的杆状 气瓶和管子。 保持器端部的底部涂覆有固定物质，例如焊料或导热粘合剂，其被平坦化以便于将散热器定位在包装上。 散热器通过焊料或导热粘合剂固定在封装上。 散热器通过用与散热器的高度相对应的间隔放置的保持器固定多个细长杆来产生，切断与保持器的一侧相邻的所述杆，并且在切割的另一个自由端处将杆扩张 将棒放入星爆状配置。 棒的保留端被浸入焊料或导热粘合剂中并且被平坦化以提供用于将散热器安装在包装表面上的平坦表面。

公开(公告)号：US4916522A

公开(公告)日：1990-04-10

申请号：US184214

申请日：1988-04-21

Applicant: Charles Cohn

Inventor： Charles Cohn

IPC: H01L23/28 ,  H01L23/057 ,  H01L23/24

CPC classification number: H01L23/24 ,  H01L23/057 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181

Abstract: An integrated circuit package uses an encapsulant frame which prevents the encapsulant used to seal the integrated circuit chip from the ambient atmosphere from flowing to unwanted areas and to permit the encapsulant to be deposited with a controllable depth.