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    Tray for ball grid array devices
    12.
    发明授权
    Tray for ball grid array devices 有权
    球栅阵列装置托盘

    公开(公告)号：US6116427A

    公开(公告)日：2000-09-12

    申请号：US494891

    申请日：2000-01-31

    Applicant: Chung-Ju Wu ,  Wei-Feng Lin ,  Chen-Wen Tsai

    Inventor： Chung-Ju Wu ,  Wei-Feng Lin ,  Chen-Wen Tsai

    IPC: H01L21/673 ,  H05K13/00 ,  B65D73/02

    CPC classification number: H01L21/67333 ,  H05K13/0084

    Abstract: A tray is adapted to receive a plurality of ball grid array devices therein, and includes a base plate having a device-receiving portion and a peripheral portion around the device-receiving portion. The device-receiving portion has a top side formed with a device-receiving recess. The top side of the device-receiving portion is further formed with a partition unit in the device-receiving recess for dividing the device-receiving recess into a plurality of cavities adapted for receiving the ball grid array devices respectively therein. The device-receiving portion further has a bottom side formed with a plurality of openings. Each of the openings is aligned with a corresponding one of the cavities and is adapted to receive an array of ball contacts formed on a bottom side of the ball grid array device that is disposed in the corresponding one of the cavities therein. The openings are grouped into a set of first openings remote from the peripheral portion and a set of second openings surrounding the first openings and adjacent to the peripheral portion. Guard strips are formed on the bottom side of the device-receiving portion and are disposed solely and respectively in the second openings.

    Abstract translation: 托盘适于在其中容纳多个球栅阵列器件，并且包括具有器件接收部分和围绕器件接收部分的周边部分的基板。 装置接收部分具有形成有装置容纳凹部的顶侧。 装置接收部分的顶侧还在装置容纳凹槽中形成有分隔单元，用于将装置容纳凹槽分成适于分别容纳球栅阵列装置的多个空腔。 装置接收部还具有形成有多个开口的底侧。 每个开口与相应的一个空腔对准，并且适于接收形成在球栅阵列器件的底侧上的球形触点阵列，其布置在其中的相应的一个空腔中。 开口被分组成远离周边部分的一组第一开口和围绕第一开口并且邻近周边部分的一组第二开口。 保护条形成在装置接收部分的底侧上，并且分别单独设置在第二开口中。

    Heat dissipation mechanism for electronic apparatus
    13.
    发明申请
    Heat dissipation mechanism for electronic apparatus 有权
    电子设备散热机构

    公开(公告)号：US20050111195A1

    公开(公告)日：2005-05-26

    申请号：US11056533

    申请日：2005-02-11

    Applicant: Chung-Ju Wu

    Inventor： Chung-Ju Wu

    IPC: H01L23/433 ,  H05K5/00 ,  H05K7/20

    CPC classification number: H05K7/20445 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. Besides, the presented mechanism is also suitable to mini-size, portable electronic apparatus to solve the thermal dissipation technique thereof.

    Abstract translation: 本公开提供了一种散热机构，其通过紧固在热装置和电子装置之间的金属片将热装置的发热传导到电子装置的壳体，然后通过在装置上打开的多个孔将热量散发到空气中 贝壳。 此外，所提出的机构也适用于微型尺寸的便携式电子设备来解决其散热技术。

    Integrated circuit bonding device and manufacturing method thereof
    15.
    发明授权
    Integrated circuit bonding device and manufacturing method thereof 有权
    集成电路接合装置及其制造方法

    公开(公告)号：US06765301B2

    公开(公告)日：2004-07-20

    申请号：US10212106

    申请日：2002-08-06

    Applicant: Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    Inventor： Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    IPC: H01L2348

    CPC classification number: H01L23/49838 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05599

    Abstract: An integrated circuit device. The substrate includes a signal connection point and two shielding connection points set at the two sides of the signal connection point. The chip is set on the substrate. There are a signal pad and two shielding pads set at the two sides of the signal pad on the edge of the chip. The signal wire bonding is coupled to the signal connection point and the signal pad. Two shielding wire bondings are coupled to the shielding connection points and the shielding pads and extend along both sides of the signal wire bonding. The signal trace line is set on the substrate and coupled to the signal connection point. The power ring circuit is set on the substrate and coupled to the shielding connection points. The power circuit includes two shielding lines extending along both sides of the signal trace line.

    Abstract translation: 集成电路器件。 基板包括设置在信号连接点两侧的信号连接点和两个屏蔽连接点。 芯片设置在基板上。 信号焊盘和两个屏蔽焊盘设置在芯片边缘的信号焊盘两侧。 信号线接合耦合到信号连接点和信号焊盘。 两个屏蔽线接合耦合到屏蔽连接点和屏蔽焊盘，并沿着信号线接合的两侧延伸。 信号跟踪线设置在基板上并耦合到信号连接点。 电源环电路设置在基板上并耦合到屏蔽连接点。 电源电路包括沿着信号迹线的两侧延伸的两条屏蔽线。

    HANDHELD ELECTRONIC APPARATUS
    17.
    发明申请
    HANDHELD ELECTRONIC APPARATUS 有权
    手持电子设备

    公开(公告)号：US20130095885A1

    公开(公告)日：2013-04-18

    申请号：US13585840

    申请日：2012-08-15

    Applicant: Cheng-Hsi Liu ,  Pi-Lin Lo ,  Jih-Jonq Shiue ,  Chung-Ju Wu

    Inventor： Cheng-Hsi Liu ,  Pi-Lin Lo ,  Jih-Jonq Shiue ,  Chung-Ju Wu

    IPC: H04W88/02

    CPC classification number: H04M1/72519 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/169 ,  G06F3/04886 ,  G06F2203/0339 ,  H04M1/22 ,  H04M2250/22

    Abstract: A handheld electronic apparatus including a casing, a cover, a motherboard, an in-cell touch display module, a light guide member, and a touch module is provided. The cover covers a casing opening, and constitutes an accommodation space with the casing. The cover has a first area and a second area having a light transmissive icon. The motherboard is electrically connected with the in-cell touch display module and the touch module. The in-cell touch display module has a display area disposed beneath the first area. The light guide member is disposed within the accommodation space, and capable of guiding a light generated from a light emitting element to the light transmissive icon. The light guide member has a sheet-shaped portion disposed beneath the second area by corresponding to the light transmissive icon. The touch module is disposed within the accommodation space and beneath the second area.

    Abstract translation: 提供了一种手持电子设备，包括壳体，盖子，主板，单元内触摸显示模块，导光构件和触摸模块。 盖罩盖壳体开口，并与壳体构成容纳空间。 盖具有第一区域和具有透光图标的第二区域。 主板与单元内触摸显示模块和触摸模块电连接。 单元内触摸显示模块具有设置在第一区域下方的显示区域。 导光构件设置在容纳空间内，并且能够将从发光元件产生的光引导到透光图标。 导光构件具有通过对应于透光图标而设置在第二区域下方的片状部分。 触摸模块设置在容纳空间内并在第二区域下方。

    SUBSTRATE AND LAYOUT METHOD
    18.
    发明申请
    SUBSTRATE AND LAYOUT METHOD 审中-公开
    基板和布局方法

    公开(公告)号：US20070277997A1

    公开(公告)日：2007-12-06

    申请号：US11421481

    申请日：2006-06-01

    Applicant: Wei-An Liang ,  Chung-Ju Wu ,  Yin-Chieh Hsueh

    Inventor： Wei-An Liang ,  Chung-Ju Wu ,  Yin-Chieh Hsueh

    IPC: H05K1/03

    CPC classification number: H05K1/0216 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K3/242 ,  H05K3/429 ,  H05K2201/0792 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/0969 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: Layout methods for a substrate are disclosed. In one embodiment, the method includes: defining a first plating line on a non-conducting layer coupled to a first pad; and defining a second plating line on the first conducting layer coupled to a second pad. Along a direction away from the first pad and the second pad, a distance between the first plating line and the second plating line becomes longer. In another embodiment, the method includes: defining a plating line on a non-conducting layer, the plating line being coupled to a pad; and replacing a portion of at least a conducting layer with a non-conducting material, wherein the portion is directly under the plating line.

    Abstract translation: 公开了一种用于衬底的布局方法。 在一个实施例中，该方法包括：在耦合到第一焊盘的非导电层上限定第一电镀线; 以及在耦合到第二焊盘的所述第一导电层上限定第二电镀线。 沿着远离第一焊盘和第二焊盘的方向，第一电镀线和第二镀覆线之间的距离变长。 在另一个实施例中，该方法包括：在非导电层上限定电镀线，电镀线耦合到焊盘; 以及用非导电材料代替至少导电层的一部分，其中该部分直接在电镀线下方。

    Ball grid array package with heat sink device
    19.
    发明授权
    Ball grid array package with heat sink device 有权
    具有散热装置的球栅阵列封装

    公开(公告)号：US07209354B2

    公开(公告)日：2007-04-24

    申请号：US10724891

    申请日：2003-12-02

    Applicant: Chung-Ju Wu ,  Wei-Feng Lin

    Inventor： Chung-Ju Wu ,  Wei-Feng Lin

    IPC: H05K7/20 ,  H01L23/36 ,  H05K1/18

    CPC classification number: H01L23/4093 ,  H01L2924/15311 ,  H01L2924/16152

    Abstract: The present invention provides a heat sink device for the package device to improve the heat dissipating efficiency. The heat sink device includes a first heat sink assembly and a second heat sink assembly. The first heat sink assembly has a first heat dissipating structure, a second heat dissipating structure positioned above first the heat dissipating structure, at least two thermal supports on the backside of the first heat sink assembly and a thermal block on the backside of the first heat sink assembly. The second heat sink assembly has a protruding structure and at least the openings. The first heat sink assembly is fixed with the second heat sink assembly to form a heat sink device by the combination of the thermal supports and the openings. The first heat sink assembly and the second heat sink assembly are attached to the integrated circuit device separately by the thermal block and the protruding structure. This heat sink device provides several heat dissipating pathes by the second heat dissipating structure, the thermal supports, the thermal block, and protruding structure. Therefore, the heat dissipation efficiency of the heat sink device is improved.

    Abstract translation: 本发明提供了一种用于封装装置的散热装置，以提高散热效率。 散热器装置包括第一散热器组件和第二散热器组件。 第一散热器组件具有第一散热结构，位于第一散热结构之上的第二散热结构，在第一散热器组件的背面上的至少两个热支撑件和位于第一散热构件的背面的热块 水槽组件。 第二散热器组件具有突出结构并且至少具有开口。 第一散热器组件与第二散热器组件固定以通过热支撑件和开口的组合形成散热装置。 第一散热器组件和第二散热器组件通过热块和突出结构分别附接到集成电路设备。 该散热装置通过第二散热结构，热支撑件，热块和突出结构提供多个散热孔。 因此，散热器件的散热效率提高。

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