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36 条记录 (耗时 0.024 秒)

    Thermal dissipating element of a chip
    2.
    发明申请
    Thermal dissipating element of a chip 审中-公开
    芯片的散热元件

    公开(公告)号：US20050093136A1

    公开(公告)日：2005-05-05

    申请号：US10698476

    申请日：2003-11-03

    申请人： Wei-Chi Liu ,  Wei-Feng Lin ,  Chung-Ju Wu

    发明人： Wei-Chi Liu ,  Wei-Feng Lin ,  Chung-Ju Wu

    IPC分类号： H01L23/10 ,  H01L23/433

    CPC分类号： H01L23/4334 ,  H01L2224/49175 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00012

    摘要： The present invention relates to a thermal dissipating element of a chip to dissipate heat producing by operating the chip. The thermal dissipating element includes a cover and a lump. The cover includes a top plate and a side plate, wherein the top plate curves and extendedly connects to the side plate. The lump is fastened between the chip and the top plate of the cover.

    摘要翻译： 本发明涉及一种芯片的散热元件，用于散发通过操作芯片产生的热量。 散热元件包括盖和块。 该盖包括顶板和侧板，其中顶板弯曲并且延伸地连接到侧板。 该块被固定在芯片和盖板的顶板之间。

    Integrated circuit bonding device and manufacturing method thereof
    4.
    发明授权
    Integrated circuit bonding device and manufacturing method thereof 有权
    集成电路接合装置及其制造方法

    公开(公告)号：US06765301B2

    公开(公告)日：2004-07-20

    申请号：US10212106

    申请日：2002-08-06

    申请人： Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    发明人： Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    IPC分类号： H01L2348

    CPC分类号： H01L23/49838 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05599

    摘要： An integrated circuit device. The substrate includes a signal connection point and two shielding connection points set at the two sides of the signal connection point. The chip is set on the substrate. There are a signal pad and two shielding pads set at the two sides of the signal pad on the edge of the chip. The signal wire bonding is coupled to the signal connection point and the signal pad. Two shielding wire bondings are coupled to the shielding connection points and the shielding pads and extend along both sides of the signal wire bonding. The signal trace line is set on the substrate and coupled to the signal connection point. The power ring circuit is set on the substrate and coupled to the shielding connection points. The power circuit includes two shielding lines extending along both sides of the signal trace line.

    摘要翻译： 集成电路器件。 基板包括设置在信号连接点两侧的信号连接点和两个屏蔽连接点。 芯片设置在基板上。 信号焊盘和两个屏蔽焊盘设置在芯片边缘的信号焊盘两侧。 信号线接合耦合到信号连接点和信号焊盘。 两个屏蔽线接合耦合到屏蔽连接点和屏蔽焊盘，并沿着信号线接合的两侧延伸。 信号跟踪线设置在基板上并耦合到信号连接点。 电源环电路设置在基板上并耦合到屏蔽连接点。 电源电路包括沿着信号迹线的两侧延伸的两条屏蔽线。

    Integrated circuit package capable of improving signal quality
    6.
    发明授权
    Integrated circuit package capable of improving signal quality 有权
    集成电路封装，能够提高信号质量

    公开(公告)号：US06744128B2

    公开(公告)日：2004-06-01

    申请号：US10262958

    申请日：2002-10-03

    申请人： Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    发明人： Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    IPC分类号： H01L2302

    CPC分类号： H01L23/49833 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

    摘要： An integrated circuit package capable of improving signal quality is disclosed. The integrated circuit package comprises a first substrate, an integrated circuit chip attached on the first surface of the first substrate. This integrated circuit package further comprises a plurality of external terminals mounted on the first substrate and a plurality of first bonding pads mounted on the edge portion of the first surface of the first substrate and respectively connected to the corresponding external terminals. Also, the integrated circuit package further comprises a second substrate and a plurality of second bonding pads mounted on the second surface of the second substrate and connected to the first bonding pads formed on the first substrate. Furthermore, this integrated circuit package further comprises a plurality of passive components disposed on the second substrate.

    摘要翻译： 公开了能够提高信号质量的集成电路封装。 集成电路封装包括第一衬底，附接在第一衬底的第一表面上的集成电路芯片。 该集成电路封装还包括安装在第一基板上的多个外部端子和安装在第一基板的第一表面的边缘部分上并分别连接到相应的外部端子的多个第一接合焊盘。 此外，集成电路封装还包括第二衬底和安装在第二衬底的第二表面上并连接到形成在第一衬底上的第一焊盘的多个第二焊盘。 此外，该集成电路封装还包括设置在第二基板上的多个无源部件。

    Ball grid array package with heat sink device
    8.
    发明申请
    Ball grid array package with heat sink device 有权
    具有散热装置的球栅阵列封装

    公开(公告)号：US20050117296A1

    公开(公告)日：2005-06-02

    申请号：US10724891

    申请日：2003-12-02

    申请人： Chung-Ju Wu ,  Wei-Feng Lin

    发明人： Chung-Ju Wu ,  Wei-Feng Lin

    IPC分类号： H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/15311 ,  H01L2924/16152

    摘要： The present invention provides the heat sink device for the ball grid array package to improve the heat dissipation. The heat sink device includes a first part of heat sink assembly that comprises a heat dissipating element above the heat sink body and is used to increase the heat dissipating area; and at least two conductive pillars on the backsides of the heat sink body, which is used to fix the heat sink assembly with PC board and also conducting the heat flux from thermal source to heat dissipation element; a conductive protruding block on the backside of the heat sink body, wherein the conductive protruding block used to associate with the cavity of the ball grid array package to increase the heat conductivity. In addition, the second part of the heat sink assembly comprises a bottom plate that used to contact with the backside of the PC board, so as to increase the heat dissipation to remove the heat that is generated from the PC board, and to join the at least two conductive pillars of the heat sink body to fix the heat sink assembly on the PC board.

    摘要翻译： 本发明提供了一种用于球栅阵列封装的散热装置，以改善散热。 散热装置包括散热器组件的第一部分，其包括散热体上方的散热元件，并用于增加散热面积; 以及用于将散热器组件与PC板固定并且还将热源从热源传导到散热元件的散热体本体的背面上的至少两个导电柱; 在散热体本体背面的导电突出块，其中用于与球栅阵列封装的空腔相关联的导电突出块以增加热导率。 此外，散热器组件的第二部分包括用于与PC板的背面接触的底板，以便增加散热以去除由PC板产生的热量，并且加入 至少两个散热体主体的导电柱，以将散热器组件固定在PC板上。