公开(公告)号：US20180044558A1

公开(公告)日：2018-02-15

申请号：US15729162

申请日：2017-10-10

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: C09J9/02 ,  H01R4/04 ,  C09J7/00 ,  H05K3/32 ,  H01R43/00 ,  H05K3/30 ,  C09J11/04 ,  C08K3/04 ,  C08K3/08 ,  H01R12/62

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/10 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01R4/04 ,  H01R12/62 ,  H01R43/007 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/0139 ,  H05K2203/0278

Abstract: A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.

公开(公告)号：US20170358549A1

公开(公告)日：2017-12-14

申请号：US15543113

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA ,  Yasushi AKUTSU ,  Tomoyuki ISHIMATSU

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/27 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/13686 ,  H01L2224/1369 ,  H01L2224/1403 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/17107 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27515 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81101 ,  H01L2224/81122 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83122 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/00015 ,  H01L2924/3841 ,  H01L2224/83851 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/05432

Abstract: Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.

公开(公告)号：US20170226387A1

公开(公告)日：2017-08-10

申请号：US15515309

申请日：2015-10-26

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: C09J9/02 ,  H01B1/12 ,  H01B1/20 ,  C09J7/00

CPC classification number: C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2499/00 ,  H01B1/12 ,  H01B1/20 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/13144 ,  H01L2224/27003 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/14

Abstract: An anisotropic conductive film with a structure wherein an electrically insulting adhesive base layer and cover layer are stacked, and electrically conductive particles are disposed at lattice points with a planar lattice pattern in the vicinity of the interface of the layers. In the anisotropic conductive film, a proportion of lattice points at which no electrically conductive particles are disposed with respect to all lattice points with the planar lattice pattern assumed in any reference region is 25% or less, and some of the electrically conductive particles disposed at lattice points with planar lattice pattern are disposed to be shifted in longitudinal direction of anisotropic conductive film with respect to corresponding lattice points, and a shift amount defined as a distance between a plane projection center of the electrically conductive particles disposed to be shifted and the corresponding lattice point is less than 50% the electrically conductive particles' average diameter.

公开(公告)号：US20160270225A1

公开(公告)日：2016-09-15

申请号：US15030509

申请日：2014-11-18

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/18

Abstract: Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35°. These anisotropic conductive films have stable connection reliability in COG connection.

Abstract translation: 各向异性导电膜各自包括绝缘粘合剂层和格子状的导电颗粒绝缘粘合剂层。 在任意导电粒子与导电粒子相邻的导电粒子之间的中心距离中，与导电粒子的最短距离为第一中心距离; 下一个最短距离是第二个中心距离。 这些中心距离是导电颗粒直径的1.5至5倍。 任意导电颗粒，导电颗粒与导电颗粒间隔第一中心距离，与导电颗粒间隔开第一中心距离或第二中心距离的导电颗粒形成锐角三角形。 对于该锐角三角形，在与通过导电粒子的第一阵列方向正交的直线与通过导电粒子的第二阵列方向之间形成的锐角为18〜35°。 这些各向异性导电膜在COG连接中具有稳定的连接可靠性。

公开(公告)号：US20220262760A1

公开(公告)日：2022-08-18

申请号：US17738655

申请日：2022-05-06

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: H01L23/00 ,  H05K3/32 ,  C08G59/68 ,  B32B3/26 ,  B32B37/00 ,  B32B37/06 ,  B32B37/10 ,  B32B37/24 ,  B32B38/00

Abstract: An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

公开(公告)号：US20220020724A1

公开(公告)日：2022-01-20

申请号：US17472883

申请日：2021-09-13

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: H01L23/00 ,  C09J9/02 ,  C09J7/20

Abstract: Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35°. These anisotropic conductive films have stable connection reliability in COG connection.

公开(公告)号：US20200091105A1

公开(公告)日：2020-03-19

申请号：US16694212

申请日：2019-11-25

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: H01L23/00 ,  H05K3/32 ,  C08G59/68 ,  B32B37/00 ,  B32B37/06 ,  B32B37/10 ,  B32B37/24 ,  B32B38/00

Abstract: An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

公开(公告)号：US20200020664A1

公开(公告)日：2020-01-16

申请号：US16578763

申请日：2019-09-23

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: H01L23/00 ,  C09J7/20 ,  C09J9/02

Abstract: Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35°. These anisotropic conductive films have stable connection reliability in COG connection,

公开(公告)号：US20190090354A1

公开(公告)日：2019-03-21

申请号：US15769042

申请日：2016-10-31

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: H05K3/32 ,  H01B5/16 ,  C09J9/02 ,  C09J7/30 ,  H01R4/04

Abstract: An anisotropic conductive film includes an electrically conductive particle dispersion layer, which includes electrically conductive particles dispersed, in a predetermined dispersion state, in an electrically insulating adhesive. The anisotropic conductive film includes a defective portion indication means configured to provide information about a location of a defective portion regarding the dispersion state of the electrically conductive particles. A bonding method for bonding the anisotropic conductive film to an electronic component is performed such that, in accordance with the information about the location of the defective portion, obtained from the defective portion indication means, a defect-free portion of the anisotropic conductive film is bonded to a region where terminals or terminal arrays are present in the electronic component to be anisotropically conductively connected.

公开(公告)号：US20160240468A1

公开(公告)日：2016-08-18

申请号：US15027607

申请日：2014-09-18

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: H01L23/498

Abstract: An anisotropic conductive film that is capable of suppressing the occurrence of short circuit during anisotropic conductive connection of electrical components having decreased pitch, and suppressing a decrease in conduction reliability during storage under a high temperature and high humidity environment has a structure in which a conductive particle-containing layer containing conductive particles that are arranged in a single layer in a layered binder resin composition is layered on at least a first insulating resin composition layer. The lowest melt viscosity of the binder resin composition is equal to or higher than that of a first insulating resin composition. A second insulating resin composition layer is further layered on a surface of the conductive particle-containing layer on a side opposite to the first insulating resin composition layer. The lowest melt viscosity of the binder resin composition is higher than those of the first and second insulating resin compositions.

Abstract translation: 能够抑制在具有降低的间距的电气元件的各向异性导电连接期间短路的发生并抑制在高温高湿环境下的保存期间的导电可靠性降低的各向异性导电膜具有导电粒子 至少在第一绝缘树脂组合物层上层叠含有层叠粘合剂树脂组合物中的单层配置的导电性粒子的层。 粘合剂树脂组合物的最低熔融粘度等于或高于第一绝缘树脂组合物的熔融粘度。 第二绝缘树脂组合物层进一步层叠在与第一绝缘树脂组合物层相反的一侧的导电粒子层的表面上。 粘合剂树脂组合物的最低熔融粘度比第一和第二绝缘树脂组合物的熔体粘度最低。