公开(公告)号：US20200152352A1

公开(公告)日：2020-05-14

申请号：US16747654

申请日：2020-01-21

Applicant: DEXERIALS CORPORATION

Inventor： Tomoyuki ISHIMATSU ,  Reiji TSUKAO

IPC: H01B5/16 ,  H05K3/32 ,  H01L23/00 ,  H01B1/22 ,  B32B27/08 ,  B32B7/12 ,  C09J7/10 ,  H01R13/24

Abstract: The present invention provides an anisotropic electrically conductive film with a structure, in which electrically conductive particles are disposed at lattice points of a planar lattice pattern in an electrically insulating adhesive base layer. A proportion of the lattice points, at which no electrically conductive particle is disposed, with respect to all the lattice points of the planar lattice pattern assumed as a reference region, is less than 20%. A proportion of the lattice points, at which plural electrically conductive particles are disposed in an aggregated state, with respect to all the lattice points of the planar lattice pattern, is not greater than 15%. A sum of omission of the electrically conductive particle and an aggregation of the electrically conductive particles is less than 25%.

公开(公告)号：US20190237214A1

公开(公告)日：2019-08-01

申请号：US16382684

申请日：2019-04-12

Applicant: DEXERIALS CORPORATION

Inventor： Tomoyuki ISHIMATSU ,  Reiji TSUKAO

IPC: H01B5/16 ,  B32B7/12 ,  B32B27/08 ,  H01B1/22 ,  H01L23/00 ,  H01R13/24 ,  C09J7/10

Abstract: The present invention provides an anisotropic electrically conductive film with a structure, in which electrically conductive particles are disposed at lattice points of a planar lattice pattern in an electrically insulating adhesive base layer. A proportion of the lattice points, at which no electrically conductive particle is disposed, with respect to all the lattice points of the planar lattice pattern assumed as a reference region, is less than 20%. A proportion of the lattice points, at which plural electrically conductive particles are disposed in an aggregated state, with respect to all the lattice points of the planar lattice pattern, is not greater than 15%. A sum of omission of the electrically conductive particle and an aggregation of the electrically conductive particles is less than 25%.

公开(公告)号：US20180026012A1

公开(公告)日：2018-01-25

申请号：US15543397

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU ,  Tomoyuki ISHIMATSU

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13078 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16058 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17107 ,  H01L2224/17181 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27515 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81122 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83122 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00015 ,  H01L2924/3841 ,  H01L2224/83851 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/05432

Abstract: Provided is a multilayer substrate obtained by laminating semiconductor substrates each having a trough electrode. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are each selectively present at a position where the through electrodes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through electrodes are connected by the conductive particles, and the semiconductor substrates each having the through electrode are bonded by an insulating adhesive.

公开(公告)号：US20160181140A1

公开(公告)日：2016-06-23

申请号：US14761913

申请日：2014-08-18

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA ,  Shingo DEGUCHI ,  Hidekazu YAGI ,  Tomoyuki ISHIMATSU

IPC: H01L21/683 ,  H01L21/78 ,  H01L23/31 ,  H01L21/304

CPC classification number: H01L21/6836 ,  B32B27/00 ,  C09J7/20 ,  H01L21/304 ,  H01L21/78 ,  H01L23/3142 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A protective tape and a method for manufacturing a semiconductor device using the same capable of achieving excellent connection properties. The protective tape includes an adhesive layer, a thermoplastic resin layer and a backing material film in that order; a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. This suppresses resin residue on bumps thereby achieving excellent connection properties.

Abstract translation: 保护带以及使用该保护带的半导体器件的制造方法能够实现良好的连接性能。 保护带依次包括粘合剂层，热塑性树脂层和背衬材料膜; 在施加保护带的施加温度下，粘合剂层的剪切储能模量与热塑性树脂层的剪切储能模量的模量比为0.01以下。 这样可以抑制凸点上的树脂残留，从而实现良好的连接性能。

公开(公告)号：US20140168919A1

公开(公告)日：2014-06-19

申请号：US14184733

申请日：2014-02-20

Applicant: DEXERIALS CORPORATION

Inventor： Tomoyuki ISHIMATSU

IPC: H05K1/18 ,  H05K13/04

CPC classification number: H05K1/181 ,  H01R4/04 ,  H05K3/323 ,  H05K13/046 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0224 ,  Y10T156/10 ,  Y10T428/2991

Abstract: To provide an anisotropic conductive film, which contains conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a substrate with a terminal of an electronic component, wherein the conductive particles are conductive particles, in each of which a metal plated layer and an insulating layer are sequentially provided on a surface of a resin particle, or conductive particles, in each of which an insulating layer is provided on a metal particle, or both thereof, and wherein 3.0 to 10.0 conductive particles are linked together on average.

Abstract translation: 为了提供含有导电颗粒的各向异性导电膜，其中各向异性导电膜是各向异性导电膜，其被配置成各自导电地连接基板的端子与电子部件的端子，其中导电粒子是导电粒子 其中金属镀层和绝缘层依次设置在树脂颗粒或导电颗粒的表面上，每个导电颗粒中的金属颗粒中均设置有绝缘层，或者其两者，其中3.0至10.0导电颗粒 平均连接在一起。