公开(公告)号：US10184052B2

公开(公告)日：2019-01-22

申请号：US15192284

申请日：2016-06-24

Applicant: FUJIFILM Corporation

Inventor： Seiichi Hitomi ,  Takashi Kawashima ,  Kouitsu Sasaki

IPC: C01G3/00 ,  C01B25/00 ,  C09D5/32 ,  C01B21/082 ,  C08L63/00 ,  G02B5/22 ,  H01L27/14 ,  G02B5/20 ,  C08K5/00 ,  C09D163/04 ,  H01L27/146 ,  H04N5/225 ,  C09D7/63

Abstract: An object of the present invention is to provide a near infrared radiation-absorbing composition having favorable shielding properties in a near infrared range when used to produce cured films, a near infrared radiation cut-off filter and a production method therefor, and a camera module and a production method therefor. The near infrared radiation-absorbing composition including a copper complex formed by reacting a compound (A) having two or more coordinating atoms that form bonds using unshared electron pairs with a copper component.

公开(公告)号：US10175573B2

公开(公告)日：2019-01-08

申请号：US14799690

申请日：2015-07-15

Applicant: FUJIFILM Corporation

Inventor： Suguru Samejima ,  Takashi Kawashima ,  Yousuke Murakami

IPC: G03F7/00 ,  C08K5/3417 ,  C08K5/00 ,  C08L63/00 ,  G02B5/20 ,  C09B47/067 ,  C09B67/22 ,  C09B69/10 ,  G03F7/038 ,  G03F7/105 ,  G03F7/40 ,  G02B5/22

Abstract: Provided is a colored curable composition having a good chemical resistance, and capable of forming a good colored layer pattern, the colored curable composition including an epoxy group-containing compound, and a phthalocyanine dye having a functional group capable of forming a covalent bond by a reaction with the epoxy group under heating.

公开(公告)号：US09068082B2

公开(公告)日：2015-06-30

申请号：US14588698

申请日：2015-01-02

Applicant: FUJIFILM Corporation

Inventor： Suguru Samejima ,  Takashi Kawashima ,  Yoshinori Taguchi ,  Yousuke Murakami

IPC: G03F7/004 ,  G02B5/20 ,  H01L27/14 ,  C09B47/18 ,  C08F12/32 ,  C08F2/44 ,  C08L101/00 ,  G02B5/22 ,  H01L27/146 ,  G03F7/00 ,  G03F7/105 ,  C08K5/00 ,  C09B11/24 ,  C09B23/06 ,  C09B23/08 ,  C09B29/08 ,  C09B29/50 ,  C09B47/10 ,  H01L27/32 ,  G02F1/1335

CPC classification number: C09B47/18 ,  C08F2/44 ,  C08F12/32 ,  C08K5/0041 ,  C08K5/0091 ,  C08L101/00 ,  C09B11/24 ,  C09B23/06 ,  C09B23/083 ,  C09B29/0808 ,  C09B29/081 ,  C09B29/366 ,  C09B47/10 ,  G02B5/223 ,  G02F1/133514 ,  G03F7/0007 ,  G03F7/004 ,  G03F7/105 ,  H01L27/14 ,  H01L27/14621 ,  H01L27/322

Abstract: A colored curable composition of the present invention contains a compound represented by general formula (1). In general formula (1), X1 to X4 each represents a halogen atom, and M represents a metal atom, a metal oxide, a metal halide or a non-metal. R1 to R4 each represents a group represented by general formula (2) or a substituent other than the group, and at least one of R1 to R4 is a group represented by general formula (2). n1 to n4 each represents an integer of 0 to 4, and m1 to m4 represent an integer of 0 to 4. However, the sum total of n1 to n4 and the sum total of m1 to m4 are each 1 or higher. In general formula (2), L1 represents a divalent linking group, Ar represents an arylene group and A represents a group having a polymerizable group.

Abstract translation: 本发明的着色固化性组合物含有通式（1）表示的化合物。 在通式（1）中，X 1〜X 4各自表示卤素原子，M表示金属原子，金属氧化物，金属卤化物或非金属。 R 1〜R 4各自表示由通式（2）表示的基团或除该基团以外的取代基，R 1〜R 4中的至少一个为通式（2）表示的基团。 n1〜n4分别表示0〜4的整数，m1〜m4表示0〜4的整数。然而，n1〜n4的合计和m1〜m4的合计的总和为1以上。 在通式（2）中，L 1表示二价连接基团，Ar表示亚芳基，A表示具有可聚合基团的基团。

公开(公告)号：US12038689B2

公开(公告)日：2024-07-16

申请号：US17212546

申请日：2021-03-25

Applicant: FUJIFILM Corporation

Inventor： Akihiro Kaneko ,  Kazunari Yagi ,  Takashi Kawashima ,  Akiyoshi Goto

IPC: G03F7/039 ,  C08F212/14 ,  C08F220/18 ,  C08F220/28 ,  C08F220/36 ,  C09D125/18 ,  C09D133/10 ,  C09D133/16 ,  G03F7/004 ,  G03F7/30 ,  G03F7/38

CPC classification number: G03F7/0392 ,  C08F212/22 ,  C08F220/1808 ,  C08F220/1809 ,  C08F220/1812 ,  C08F220/1818 ,  C08F220/281 ,  C08F220/282 ,  C08F220/283 ,  C08F220/365 ,  C09D125/18 ,  C09D133/10 ,  C09D133/16 ,  G03F7/0045 ,  G03F7/039 ,  G03F7/0397 ,  G03F7/30 ,  G03F7/38

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is excellent in LER performance and a collapse suppressing ability. Furthermore, the present invention provides a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes an acid-decomposable resin having a repeating unit represented by General Formula (1), and a compound that generates an acid upon irradiation with actinic rays or radiation.

公开(公告)号：US11953829B2

公开(公告)日：2024-04-09

申请号：US16797035

申请日：2020-02-21

Applicant: FUJIFILM Corporation

Inventor： Kazunari Yagi ,  Takashi Kawashima ,  Tomotaka Tsuchimura ,  Hajime Furutani ,  Michihiro Shirakawa

IPC: G03F7/004 ,  C08F212/14 ,  C08F220/28 ,  G03F7/038 ,  G03F7/039 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38

CPC classification number: G03F7/0045 ,  C08F212/24 ,  C08F220/282 ,  G03F7/0046 ,  G03F7/038 ,  G03F7/039 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/38

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a repeating unit having a group in which a phenolic hydroxyl group is protected with an acid-leaving group; a first photoacid generator that generates an acid having a pKa of −2.00 to 2.00, in which in a case where the acid thus generated is a carboxylic acid, a pKa of the carboxylic acid is −2.00 or more and less than 1.00; and a second photoacid generator that generates a carboxylic acid having a pKa of 1.00 or more.

公开(公告)号：US11604412B2

公开(公告)日：2023-03-14

申请号：US16722026

申请日：2019-12-20

Applicant: FUJIFILM Corporation

Inventor： Akihiro Kaneko ,  Junichi Ito ,  Takashi Kawashima ,  Michihiro Ogawa ,  Tomotaka Tsuchimura

IPC: G03F7/039 ,  G03F7/004 ,  C08F212/14 ,  G03F7/20 ,  G03F7/30

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a group represented by General Formula (1) and a compound that generates an acid upon irradiation with actinic rays or radiation.

公开(公告)号：US20210109446A1

公开(公告)日：2021-04-15

申请号：US17130054

申请日：2020-12-22

Applicant: FUJIFILM Corporation

Inventor： Akiyoshi Goto ,  Takashi Kawashima ,  Kazunari Yagi ,  Daisuke Asakawa ,  Akira Takada

IPC: G03F7/039 ,  G03F7/038 ,  C08F220/18 ,  C08F216/36 ,  C08F220/28

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition in which fewer defects are generated in any development treatment of alkali development and organic solvent development, a pattern forming method, a method for manufacturing an electronic device, and a resin. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin having a repeating unit represented by Formula (1) and a repeating unit having an acid-decomposable group, and a photoacid generator.

公开(公告)号：US10928726B2

公开(公告)日：2021-02-23

申请号：US16299666

申请日：2019-03-12

Applicant: FUJIFILM Corporation

Inventor： Takashi Kawashima ,  Yoshinori Taguchi

IPC: G03F7/00 ,  C09D17/00 ,  C09D4/06 ,  C09D7/45 ,  C09D133/06 ,  C08K3/22 ,  G03F7/105 ,  G03F7/07 ,  C08L101/02 ,  G03F7/004 ,  G03F7/075 ,  G03F7/027

Abstract: Provided are a dispersion liquid and a composition which have excellent particle dispersibility and make it possible to manufacture a film having a high color valency. Also provided are a film, a manufacturing method of a film, and a dispersant. The dispersion liquid contains particles, a solvent, and a dispersant. The dispersant has a particle adsorption portion and a solvophilic portion, and the solvophilic portion includes a moiety which is decomposed or denatured by an external stimulus.

公开(公告)号：US10215898B2

公开(公告)日：2019-02-26

申请号：US15497959

申请日：2017-04-26

Applicant: FUJIFILM Corporation

Inventor： Kouitsu Sasaki ,  Takashi Kawashima ,  Seiichi Hitomi ,  Yasuharu Shiraishi

IPC: C07F1/08 ,  G02B5/20 ,  C07F9/113 ,  H04N5/225

Abstract: Provided are a near infrared ray absorbent composition which can form a cured film having excellent near infrared ray shielding properties, a near infrared ray cut filter, a manufacturing method of a near infrared ray cut filter, a solid image pickup element, and a camera module. The near infrared ray absorbent composition includes a copper complex that is other than a copper phthalocyanine complex and has a maximum absorption wavelength in a wavelength range of 700 to 1,200 nm and in which a molar light absorption coefficient at the maximum absorption wavelength is greater than or equal to 100 (L/mol·cm).

公开(公告)号：US09879108B2

公开(公告)日：2018-01-30

申请号：US14950911

申请日：2015-11-24

Applicant: FUJIFILM CORPORATION

Inventor： Hiroaki Idei ,  Toshihito Kuge ,  Takashi Kawashima

IPC: B32B27/06 ,  B32B27/20 ,  C08L33/14 ,  C08F220/68 ,  G02B5/22 ,  C09B67/46 ,  C08K5/00

CPC classification number: C08F220/68 ,  B32B27/06 ,  B32B27/20 ,  B32B2307/4026 ,  B32B2307/7244 ,  C08K5/0041 ,  C08L33/14 ,  C09B67/009 ,  G02B5/223 ,  C08F220/36 ,  C08F220/34 ,  C08F220/06 ,  C08F220/14 ,  C08F226/10

Abstract: The composition includes (A) a pigment; and (B) a polymer having (b-1) a bulky amine moiety, (b-2) an acid group, and (b-3) a constituent unit derived from a macromonomer having a weight average molecular weight of 1000 to 50000, in which the bulky amine moiety (b-1) has a nitrogen atom, carbon atoms X1 bonded with the nitrogen atom, and carbon atoms Y1 bonded with the carbon atoms X1, and a total carbon number of the carbon atoms X1 and the carbon atoms Y1 is 7 or more.