公开(公告)号：US07994638B2

公开(公告)日：2011-08-09

申请号：US12531819

申请日：2008-05-09

申请人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

发明人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

IPC分类号： H01L23/488

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05076 ,  H01L2224/05554 ,  H01L2224/05576 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.

摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。

公开(公告)号：US20110042808A1

公开(公告)日：2011-02-24

申请号：US12989777

申请日：2009-04-14

申请人： Kentaro Kumazawa ,  Yoshihiro Tomura

发明人： Kentaro Kumazawa ,  Yoshihiro Tomura

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L24/05 ,  B33Y80/00 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0501 ,  H01L2224/0502 ,  H01L2224/05099 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/06051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor device includes a semiconductor element having a plurality of element electrodes formed thereon, a circuit board having board electrodes respectively corresponding to the element electrodes formed thereon and having the semiconductor element mounted thereon, and bumps each of which is provided on at least one of the element electrode and the board electrode, and connects together the element electrode and the board electrode corresponding to each other when the semiconductor element is mounted on the circuit board. Furthermore, at least one of a dielectric layer and a resistive layer is provided between at least one of the bumps and the element or board electrode on which the at least one of the bumps is provided, so that the element or board electrode, the dielectric layer or the resistive layer, and the bump form a parallel-plate capacitor or electrical resistance.

摘要翻译： 半导体器件包括其上形成有多个元件电极的半导体元件，具有分别对应于其上形成有元件电极并且具有安装有半导体元件的基板电极的电路板，以及设置在其上的至少一个上的凸块 元件电极和基板电极，并且当将半导体元件安装在电路板上时，将元件电极和板电极彼此对应连接在一起。 此外，在至少一个凸块和设置有至少一个凸块的元件或电路板电极之间提供电介质层和电阻层中的至少一个，使得元件或基板电极，电介质 层或电阻层，并且凸起形成平行板电容器或电阻。

公开(公告)号：US20090278265A1

公开(公告)日：2009-11-12

申请号：US12431855

申请日：2009-04-29

申请人： Makoto Imanishi ,  Yoshihiro Tomura ,  Kentaro Kumazawa

发明人： Makoto Imanishi ,  Yoshihiro Tomura ,  Kentaro Kumazawa

IPC分类号： H01L23/28 ,  B32B3/02 ,  H05K3/00

CPC分类号： H01L23/3135 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85148 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An electronic component, in which the outer perimeter portion of a component (2) is surrounded with a first sealing resin (4), a second sealing resin (3) is filled within the periphery of the first sealing resin (4), the component (2) and a board (1) are electrically connected by a wire (5), the edge, in the vicinity of which the wire (5) passes, of the outer perimeter edge portions of the component (2) is formed to be a chamfered oblique surface (31), and the wire (5) is provided to extend to the board (1) along the oblique surface (31). By this means, the overall height of the electronic component can be kept low.

摘要翻译： 一种电子部件，其中部件（2）的外周部分被第一密封树脂（4）包围，第二密封树脂（3）填充在第一密封树脂（4）的周围，该部件 （2）和电路板（1）通过电线（5）电连接，组件（2）的外周边缘部分中的线（5）附近的边缘形成为 倒角斜面（31），线（5）设置成沿着倾斜面（31）延伸到基板（1）。 通过这种方式，可以将电子部件的整体高度保持为低。

公开(公告)号：US08415794B2

公开(公告)日：2013-04-09

申请号：US12989777

申请日：2009-04-14

申请人： Kentaro Kumazawa ,  Yoshihiro Tomura

发明人： Kentaro Kumazawa ,  Yoshihiro Tomura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/05 ,  B33Y80/00 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0501 ,  H01L2224/0502 ,  H01L2224/05099 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/06051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor device includes a semiconductor element having a plurality of element electrodes formed thereon, a circuit board having board electrodes respectively corresponding to the element electrodes formed thereon and having the semiconductor element mounted thereon, and bumps each of which is provided on at least one of the element electrode and the board electrode, and connects together the element electrode and the board electrode corresponding to each other when the semiconductor element is mounted on the circuit board. Furthermore, at least one of a dielectric layer and a resistive layer is provided between at least one of the bumps and the element or board electrode on which the at least one of the bumps is provided, so that the element or board electrode, the dielectric layer or the resistive layer, and the bump form a parallel-plate capacitor or electrical resistance.

摘要翻译： 半导体器件包括其上形成有多个元件电极的半导体元件，具有分别对应于其上形成有元件电极并且具有安装有半导体元件的基板电极的电路板，以及设置在其上的至少一个上的凸块 元件电极和基板电极，并且当将半导体元件安装在电路板上时，将元件电极和板电极彼此对应连接在一起。 此外，在至少一个凸块和设置有至少一个凸块的元件或电路板电极之间提供电介质层和电阻层中的至少一个，使得元件或板电极，电介质 层或电阻层，并且凸起形成平行板电容器或电阻。

公开(公告)号：US08264079B2

公开(公告)日：2012-09-11

申请号：US12666860

申请日：2008-06-26

申请人： Teppei Iwase ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

发明人： Teppei Iwase ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

IPC分类号： H01L23/48

CPC分类号： H01L24/75 ,  B30B5/02 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75315 ,  H01L2224/75756 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.

摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。

公开(公告)号：US07985078B2

公开(公告)日：2011-07-26

申请号：US12644571

申请日：2009-12-22

申请人： Kentaro Kumazawa ,  Masahiro Ono ,  Yoshihiro Tomura

发明人： Kentaro Kumazawa ,  Masahiro Ono ,  Yoshihiro Tomura

IPC分类号： H01R12/00

CPC分类号： H01R13/52 ,  H05K1/142 ,  H05K3/284 ,  H05K3/361 ,  H05K2201/10977

摘要： The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.

摘要翻译： 电极结结构包括：玻璃基板; 多个柔性基板在平面图中布置成跨过玻璃基板的边缘并且被布置成沿着边缘彼此具有空间; 用于接合玻璃基板和每个柔性基板的粘合剂; 以及密封树脂，用于覆盖玻璃基板和每个柔性基板之间的接合部分，其中形成密封树脂的边缘，使得密封树脂的边缘在平面图中具有连续的波形部分，其中凸部 并且与假想线交替的凹部作为中心轴，所述假想线平行于所述玻璃基板的边缘并位于所述玻璃基板的边缘的外侧，并且其中所述凸部形成为位于所述柔性 底物。

公开(公告)号：US20110020983A1

公开(公告)日：2011-01-27

申请号：US12933819

申请日：2009-03-30

申请人： Yoshihiro Tomura ,  Kentaro Kumazawa ,  Takayuki Higuchi ,  Koujiro Nakamura

发明人： Yoshihiro Tomura ,  Kentaro Kumazawa ,  Takayuki Higuchi ,  Koujiro Nakamura

IPC分类号： H01L23/14 ,  B32B3/00 ,  B32B37/10

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L21/568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75304 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  Y10T428/249954 ,  H01L2924/00

摘要： A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.

摘要翻译： 倒装芯片安装装置在工具保护片（10）的加压膜（10b）侧具有屏蔽膜（18）。 当通过工具保护片（10）对半导体芯片（1）加热加压时，加压膜（10b）通过片材固定夹具（9）从模具中释放，并通过加压/加热工具 11）抵靠从半导体芯片（1）的周围突出的绝缘树脂膜（5），并施加外部压力使绝缘树脂膜（5）固化。

公开(公告)号：US20100181667A1

公开(公告)日：2010-07-22

申请号：US12666860

申请日：2008-06-26

申请人： Teppei Iwase ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

发明人： Teppei Iwase ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

IPC分类号： H01L23/28 ,  H01L21/56 ,  B32B37/10

CPC分类号： H01L24/75 ,  B30B5/02 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75315 ,  H01L2224/75756 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding use resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding use resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. In the semiconductor chip mounted structure formed in this way, entire side faces at the corner portions of the semiconductor chip are covered with the seal-bonding use resin. As a result, loads generated at corner portions of the semiconductor chip due to board flexures for thermal expansion differences and thermal contraction differences among the individual members caused by heating process and cooling process in mounting operation as well as for mechanical loads after the mounting operation so that internal breakdown of the semiconductor chip can be avoided.

摘要翻译： 当在半导体芯片的焊盘上形成的凸起和具有粘附在其表面上的片状密封用树脂的基板面对面地设置时，用工具将凸块和板彼此挤压，从而形成半导体 分别在半导体芯片和板之间填充密封用树脂并且其中半导体芯片的焊盘和板的电极通过凸块相互连接的芯片安装结构。 在以这种方式形成的半导体芯片安装结构中，用密封接合用树脂覆盖半导体芯片的角部的整个侧面。 结果，由于板弯曲导致的半导体芯片的角部处的负载产生的热膨胀差异和各个部件之间的热收缩差异由安装操作中的加热处理和冷却过程以及安装操作之后的机械负载引起。 可以避免半导体芯片的内部故障。

公开(公告)号：US20090321926A1

公开(公告)日：2009-12-31

申请号：US12486841

申请日：2009-06-18

申请人： Kojiro Nakamura ,  Yoshihiro Tomura ,  Kentaro Kumazawa

发明人： Kojiro Nakamura ,  Yoshihiro Tomura ,  Kentaro Kumazawa

IPC分类号： H01L23/485 ,  H01L21/50 ,  H01L21/60

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13027 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/14104 ,  H01L2224/16227 ,  H01L2224/85148 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/351 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A mounting structure of the present invention includes a semiconductor element 101, a circuit board 301 having electrodes 302 opposed to electrodes 102 of the semiconductor element 101, and conductive two-layer bumps 213. Second bumps 210 joined to the electrodes 302 of the circuit board 301 are formed larger than first bumps 209 joined to the electrodes 102 of the semiconductor element 101. The axis of the first bump 209 and the axis of the second bump 210 are not aligned with each other.

摘要翻译： 本发明的安装结构包括半导体元件101，具有与半导体元件101的电极102相对的电极302的电路板301和导电的双层凸块213.接合到电路板的电极302的第二凸块210 301形成为大于连接到半导体元件101的电极102的第一凸起209.第一凸起209的轴线和第二凸块210的轴线彼此不对准。

公开(公告)号：US20120298310A1

公开(公告)日：2012-11-29

申请号：US13567112

申请日：2012-08-06

申请人： Teppei IWASE ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

发明人： Teppei IWASE ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

IPC分类号： B30B9/00

CPC分类号： H01L24/75 ,  B30B5/02 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75315 ,  H01L2224/75756 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.

摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。