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38 条记录 (耗时 0.042 秒)

    Substrate plating device
    11.
    发明授权
    Substrate plating device 有权
    基板电镀装置

    公开(公告)号：US06365017B1

    公开(公告)日：2002-04-02

    申请号：US09530805

    申请日：2000-05-05

    申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroyuki Ueyama ,  Junitsu Yamakawa ,  Mizuki Nagai ,  Kenichi Suzuki ,  Atsushi Chono ,  Satoshi Sendai ,  Koji Mishima

    发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroyuki Ueyama ,  Junitsu Yamakawa ,  Mizuki Nagai ,  Kenichi Suzuki ,  Atsushi Chono ,  Satoshi Sendai ,  Koji Mishima

    IPC分类号： C25D1700

    CPC分类号： C25D21/14 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02

    摘要： The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath. The substrate plating apparatus can also comprise an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath, wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.

    摘要翻译： 本发明涉及一种用于在含有电镀液的电镀液中电镀基板的基板电镀装置。 不同的阳极设置在与基底相对的电镀槽中。 基板电镀装置包括与电镀槽分开设置的循环容器或虚拟容器，其中可溶性阳极和阴极设置在循环容器或假容器中。 阴极交换膜或选择性阳离子交换膜设置在阳极和阴极之间，并隔离其中，其中通过在可溶性阳极和阴极之间流动电流而在循环容器或虚拟容器中产生金属离子，并且所产生的金属离子 被供应到电镀浴。 基板电镀装置还可以包括设置在电镀槽中的基板和阳极之间的离子交换膜或中性多孔隔膜，其中离子交换膜或中性多孔隔膜将电镀槽分成衬底区域和阳极区域。

    Substrate plating apparatus
    12.
    发明授权
    Substrate plating apparatus 有权
    基板电镀装置

    公开(公告)号：US06294059B1

    公开(公告)日：2001-09-25

    申请号：US09154895

    申请日：1998-09-17

    申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    IPC分类号： C25D1700

    CPC分类号： H01L21/67167 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/76849 ,  H01L21/76877 ,  Y10S134/902

    摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

    摘要翻译： 基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。 基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元， 互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印 第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。 第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。

    Plating apparatus
    14.
    发明授权
    Plating apparatus 有权
    电镀装置

    公开(公告)号：US07297210B2

    公开(公告)日：2007-11-20

    申请号：US10481448

    申请日：2002-10-15

    申请人： Akihisa Hongo ,  Naoki Matsuda ,  Xinming Wang

    发明人： Akihisa Hongo ,  Naoki Matsuda ,  Xinming Wang

    IPC分类号： B05C11/00

    CPC分类号： C25D17/001 ,  C23C18/1617 ,  C23C18/1628 ,  C23C18/1676 ,  C23C18/50 ,  H01L21/288

    摘要： There is provided a plating apparatus which can keep a plating solution always in its optimal condition while minimizing the amount of plating solution used, and which can easily form a uniform plated film on the plating surface of a workpiece.The plating apparatus includes: a plating solution supply system (70) for constantly circulating a plating solution while heating the plating solution in a circulation tank (80) provided with a heating apparatus (78a), and supplying a predetermined amount of plating solution to a plating treatment section (24) when carrying out plating treatment; a plating solution recovery system (72) for recovering the plating solution after the plating treatment in the plating treatment section (24), heating the plating solution and returning the heated plating solution to the circulation tank (80); and a plating solution replenishment system (74) for replenishing the circulation tank (80) with a fresh plating solution or a plating solution component.

    摘要翻译： 提供一种电镀设备，其可以使电镀液始终处于最佳状态，同时最小化所使用的电镀溶液的量，并且可以在工件的电镀表面上容易地形成均匀的镀膜。 电镀装置包括：电镀液供给系统（70），用于在加热设置有加热装置（78a）的循环罐（80）的同时加热电镀液，使电镀液不断循环，并将预定量的电镀液供给到 电镀处理部（24）; 电镀液回收系统（72），用于在所述电镀处理部（24）中回收所述电镀处理后的所述电镀液，加热所述电镀液并将所述被加热的电镀液返回到所述循环罐（80）。 以及用于用新鲜电镀液或电镀液成分补充循环罐（80）的电镀液补充系统（74）。

    Polishing apparatus and substrate processing apparatus
    15.
    发明授权
    Polishing apparatus and substrate processing apparatus 有权
    抛光装置和基板处理装置

    公开(公告)号：US07862402B2

    公开(公告)日：2011-01-04

    申请号：US12699318

    申请日：2010-02-03

    申请人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

    发明人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

    IPC分类号： B24B49/00

    CPC分类号： B24B37/02 ,  B24B9/065 ,  B24B21/002

    摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

    摘要翻译： 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括：用于在其中形成抛光室的壳体，用于保持和旋转基板的旋转台;抛光带供给机构，用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带 用于将抛光带压靠在基板的斜面部分上的抛光头，用于将液体供应到基板的前表面和后表面的液体供应源，以及用于使抛光室的内部压力的调节机构 被设定为低于抛光室的外部压力。

    Polishing apparatus and substrate processing apparatus
    16.
    发明授权
    Polishing apparatus and substrate processing apparatus 有权
    抛光装置和基板处理装置

    公开(公告)号：US07682225B2

    公开(公告)日：2010-03-23

    申请号：US10581669

    申请日：2005-02-23

    申请人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

    发明人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

    IPC分类号： B24B24/00

    CPC分类号： B24B37/02 ,  B24B9/065 ,  B24B21/002

    摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

    摘要翻译： 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括：用于在其中形成抛光室的壳体，用于保持和旋转基板的旋转台;抛光带供给机构，用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带 用于将抛光带压靠在基板的斜面部分上的抛光头，用于将液体供应到基板的前表面和后表面的液体供应源，以及用于使抛光室的内部压力的调节机构 被设定为低于抛光室的外部压力。

    Substrate processing apparatus and method
    19.
    发明授权
    Substrate processing apparatus and method 有权
    基板加工装置及方法

    公开(公告)号：US07172979B2

    公开(公告)日：2007-02-06

    申请号：US10481424

    申请日：2002-12-26

    申请人： Akihisa Hongo ,  Xinming Wang

    发明人： Akihisa Hongo ,  Xinming Wang

    IPC分类号： H01L21/469 ,  B08B3/00 ,  B05C11/00

    CPC分类号： H01L21/76843 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/288 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/76849 ,  H01L21/76873

    摘要： A substrate processing apparatus has a substrate holder for detachably holding a substrate so that a surface, to be processed, of the substrate faces downward, and a sealing ring for sealing a peripheral portion of the surface, to be processed, of the substrate held by the substrate holder. The substrate processing apparatus also has a plurality of ejection nozzles disposed below the substrate holder for ejecting a treatment solution toward the surface, to be processed, of the substrate held by the substrate holder, and a mechanism for rotating and vertically moving the substrate holder and the ejection nozzles relative to each other.

    摘要翻译： 基板处理装置具有：基板保持件，用于可拆卸地保持基板，使得待处理的基板的表面朝下;密封环，用于密封待加工的表面的周边部分 基板支架。 基板处理装置还具有多个喷射喷嘴，其设置在基板保持器的下方，用于向被基板保持器保持的基板的待处理表面喷射处理溶液，以及用于使基板保持器旋转和垂直移动的机构， 喷嘴相对于彼此。