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    Substrate plating device
    1.
    发明授权
    Substrate plating device 有权
    基板电镀装置

    公开(公告)号：US06365017B1

    公开(公告)日：2002-04-02

    申请号：US09530805

    申请日：2000-05-05

    申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroyuki Ueyama ,  Junitsu Yamakawa ,  Mizuki Nagai ,  Kenichi Suzuki ,  Atsushi Chono ,  Satoshi Sendai ,  Koji Mishima

    发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroyuki Ueyama ,  Junitsu Yamakawa ,  Mizuki Nagai ,  Kenichi Suzuki ,  Atsushi Chono ,  Satoshi Sendai ,  Koji Mishima

    IPC分类号： C25D1700

    CPC分类号： C25D21/14 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02

    摘要： The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath. The substrate plating apparatus can also comprise an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath, wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.

    摘要翻译： 本发明涉及一种用于在含有电镀液的电镀液中电镀基板的基板电镀装置。 不同的阳极设置在与基底相对的电镀槽中。 基板电镀装置包括与电镀槽分开设置的循环容器或虚拟容器，其中可溶性阳极和阴极设置在循环容器或假容器中。 阴极交换膜或选择性阳离子交换膜设置在阳极和阴极之间，并隔离其中，其中通过在可溶性阳极和阴极之间流动电流而在循环容器或虚拟容器中产生金属离子，并且所产生的金属离子 被供应到电镀浴。 基板电镀装置还可以包括设置在电镀槽中的基板和阳极之间的离子交换膜或中性多孔隔膜，其中离子交换膜或中性多孔隔膜将电镀槽分成衬底区域和阳极区域。

    Substrate plating apparatus and method
    2.
    发明授权
    Substrate plating apparatus and method 有权
    基板电镀装置及方法

    公开(公告)号：US06793794B2

    公开(公告)日：2004-09-21

    申请号：US10098415

    申请日：2002-03-18

    申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroyuki Ueyama ,  Junitsu Yamakawa ,  Mizuki Nagai ,  Kenichi Suzuki ,  Atsushi Chono ,  Satoshi Sendai ,  Koji Mishima

    发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroyuki Ueyama ,  Junitsu Yamakawa ,  Mizuki Nagai ,  Kenichi Suzuki ,  Atsushi Chono ,  Satoshi Sendai ,  Koji Mishima

    IPC分类号： C25D500

    CPC分类号： C25D21/14 ,  C25D7/12 ,  C25D17/001

    摘要： The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath. The substrate plating apparatus can also comprise an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath, wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.

    摘要翻译： 本发明涉及一种用于在含有电镀液的电镀液中电镀基板的基板电镀装置。 不同的阳极设置在与基底相对的电镀槽中。 基板电镀装置包括与电镀槽分开设置的循环容器或虚拟容器，其中可溶性阳极和阴极设置在循环容器或假容器中。 阴极交换膜或选择性阳离子交换膜设置在阳极和阴极之间，并隔离其中，其中通过在可溶性阳极和阴极之间流动电流而在循环容器或虚拟容器中产生金属离子，并且所产生的金属离子 被供应到电镀浴。 基板电镀装置还可以包括设置在电镀槽中的基板和阳极之间的离子交换膜或中性多孔隔膜，其中离子交换膜或中性多孔隔膜将电镀槽分成衬底区域和阳极区域。

    Plating device
    5.
    发明授权
    Plating device 有权
    电镀装置

    公开(公告)号：US06517689B1

    公开(公告)日：2003-02-11

    申请号：US09463019

    申请日：2000-01-19

    申请人： Akihisa Hongo ,  Kenichi Suzuki ,  Atsushi Chono ,  Mitsuo Tada ,  Akira Ogata ,  Satoshi Sendai ,  Koji Mishima

    发明人： Akihisa Hongo ,  Kenichi Suzuki ,  Atsushi Chono ,  Mitsuo Tada ,  Akira Ogata ,  Satoshi Sendai ,  Koji Mishima

    IPC分类号： B23H302

    CPC分类号： C25D21/12 ,  G01R31/026

    摘要： The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.

    摘要翻译： 本发明提供一种能够检测与基板的导体层的馈电触点的导电性（接触状态）的导电检测装置。 本发明还提供了一种电镀设备，其能够产生均匀的电流以流过每个馈电触点。 该装置具有电镀槽，其中电极与衬底相对设置，该衬底通过多个馈电触点电连接到电镀夹具上，用于在电极和设置在衬底的电镀表面上的导电层之间施加特定电压 。 电镀电流从电镀夹具通过馈电触点流到基板。 提供导电检测装置以检测多个馈电触点与基板上的导电层之间的导电状态。

    Substrate plating apparatus
    6.
    发明授权
    Substrate plating apparatus 有权
    基板电镀装置

    公开(公告)号：US06929722B2

    公开(公告)日：2005-08-16

    申请号：US09945711

    申请日：2001-09-05

    申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    IPC分类号： C25D7/12 ,  H01L21/00 ,  H01L21/288 ,  H01L21/768 ,  C25D17/00 ,  H01M4/29 ,  C23B3/00

    CPC分类号： H01L21/67167 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/76849 ,  H01L21/76877 ,  Y10S134/902

    摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

    摘要翻译： 基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。 基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元， 互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印 第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。 第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。

    Substrate plating apparatus
    7.
    发明授权
    Substrate plating apparatus 有权
    基板电镀装置

    公开(公告)号：US06294059B1

    公开(公告)日：2001-09-25

    申请号：US09154895

    申请日：1998-09-17

    申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    IPC分类号： C25D1700

    CPC分类号： H01L21/67167 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/76849 ,  H01L21/76877 ,  Y10S134/902

    摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

    摘要翻译： 基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。 基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元， 互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印 第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。 第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。

    Method and apparatus for plating substrate and plating facility
    9.
    发明授权
    Method and apparatus for plating substrate and plating facility 有权
    电镀基板和电镀设备的方法和装置

    公开(公告)号：US06558518B1

    公开(公告)日：2003-05-06

    申请号：US09612218

    申请日：2000-07-07

    申请人： Satoshi Sendai ,  Akihisa Hongo ,  Kenya Tomioka ,  Katsumi Tsuda ,  Masayuki Kumekawa ,  Naoaki Ogure ,  Kenichi Sasabe

    发明人： Satoshi Sendai ,  Akihisa Hongo ,  Kenya Tomioka ,  Katsumi Tsuda ,  Masayuki Kumekawa ,  Naoaki Ogure ,  Kenichi Sasabe

    IPC分类号： C25B1500

    CPC分类号： C25D17/12 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/02068 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6723 ,  H01L21/76883

    摘要： A substrate such as a semiconductor wafer is plated to fill a metal such as copper (Cu) or the like in interconnection grooves defined in the substrate. An apparatus for plating such a substrate has a plating chamber for holding a plating solution, the plating chamber housing an anode that is immersible in the plating solution held by the plating chamber. A plating solution ejector pipe produces an upward jet of plating solution from a plating solution supplied to the plating chamber from an external source, and a substrate holder removably holds a substrate and positions the substrate such that a surface to be plated of the substrate is held in contact with the jet of plating solution. The plating chamber has a plating solution outlet defined in a bottom thereof for discharging a portion of the supplied plating solution via through-holes defined in the anode and/or around the anode out of the plating chamber.

    摘要翻译： 电镀衬底如半导体晶片以在衬底中限定的互连槽中填充铜（Cu）等金属。 用于电镀这种基板的装置具有用于保持电镀液的电镀室，电镀室容纳浸入由电镀室保持的镀液中的阳极。 电镀溶液喷射管从外部源产生从供给到电镀室的镀液的向上喷射的电镀溶液，并且衬底保持器可移除地保持衬底并定位衬底，使得保持衬底的待镀表面 与电镀液接触。 电镀室具有限定在其底部的电镀溶液出口，用于通过限定在阳极中和/或阳极周围的通孔从电镀室中排出一部分供应的电镀溶液。