公开(公告)号：US10790174B2

公开(公告)日：2020-09-29

申请号：US15951333

申请日：2018-04-12

Applicant: LAM RESEARCH CORPORATION

Inventor： John Daugherty ,  David Trussell ,  Michael Kellogg ,  Christopher Pena ,  Richard H. Gould ,  Klay Kunkel

IPC: H01L21/67

Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

公开(公告)号：US20180130640A1

公开(公告)日：2018-05-10

申请号：US15346920

申请日：2016-11-09

Applicant: Lam Research Corporation

Inventor： Mariusch Gregor ,  Thorsten Lill ,  David Trussell

IPC: H01J37/32 ,  G01J3/50 ,  H01L21/67 ,  C23C16/505 ,  C23C16/52

CPC classification number: H01J37/32449 ,  C23C16/4401 ,  C23C16/4404 ,  C23C16/45565 ,  C23C16/45574 ,  C23C16/45589 ,  C23C16/505 ,  C23C16/5096 ,  C23C16/52 ,  G01J3/50 ,  H01J37/32091 ,  H01J37/32183 ,  H01J37/32697 ,  H01J37/32715 ,  H01J37/32981 ,  H01L21/67069 ,  H01L21/67253

Abstract: An active showerhead used for a plasma reactor is described. The active showerhead includes a plurality of substrate layers. The substrate layers include at least one actuator and transfer component. The actuator and transfer component is coupled to a gas line via a gas channel. The active showerhead further includes an electrode layer located below the substrate layers. The electrode layer and the actuator and transfer component both share an opening. The actuator and transfer component allows passage of one or more process gases received from the gas line and the gas channel into the opening without the need for a conventional gas box.

公开(公告)号：US20170110354A1

公开(公告)日：2017-04-20

申请号：US14887935

申请日：2015-10-20

Applicant: Lam Research Corporation

Inventor： John Daugherty ,  David Trussell ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67196 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67754 ,  H01L21/67769

Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.

公开(公告)号：US09502275B1

公开(公告)日：2016-11-22

申请号：US14887876

申请日：2015-10-20

Applicant: Lam Research Corporation

Inventor： David Trussell ,  John Daugherty ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67173 ,  H01L21/67155 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67745

Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

Abstract translation: 提供了一种用于处理衬底的系统，包括：晶片传送组件，其被配置为将晶片传送到一个或多个过程模块并从一个或多个过程模块传送晶片传输组件，所述晶片传输组件具有至少一个晶片传送模块，其中所述至少一个晶片的侧面 传输模块被配置为耦合到所述一个或多个处理模块; 在晶片运输组件下面定义的服务楼层，服务楼层被限定在小于系统设置在其中的制造设施楼层的高度的高度。

公开(公告)号：US20160086864A1

公开(公告)日：2016-03-24

申请号：US14495693

申请日：2014-09-24

Applicant: Lam Research Corporation

Inventor： Andreas Fischer ,  Thorsten Lill ,  David Trussell

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L22/26 ,  H01L21/02057 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67253 ,  H01L22/12

Abstract: Provided herein are methods and apparatuses for cleaning wafers by coating an active surface of the wafer with a film of water to clean the wafer, delivering gas from a gas nozzle to the center of the active surface to break a film of water on the active surface to form a wet-dry boundary while spinning the wafer, and moving the gas nozzle radially outward from the center to the edge of the active surface of the wafer by following the wet-dry boundary. Tracking devices, such as cameras or charge-coupled devices, and systems may be used with an apparatus for cleaning wafers by tracking the wet-dry boundary on the wafer to move the gas nozzle to follow the wet-dry boundary. Cleaning apparatuses provided herein may be integrated with etching tools.

Abstract translation: 本文提供了通过用水膜涂覆晶片的活性表面以清洁晶片来清洁晶片的方法和装置，将气体从气体喷嘴输送到活性表面的中心以破坏活性表面上的水膜 以在旋转晶片的同时形成湿干边界，并且通过跟随湿干边界从气体活动表面的中心向边缘径向向外移动气体喷嘴。 跟踪装置，例如照相机或电荷耦合装置以及系统可以与用于通过跟踪晶片上的湿 - 湿边界来清洁晶片的装置一起使用，以移动气体喷嘴以遵循湿 - 干边界。 本文提供的清洁装置可以与蚀刻工具集成。