Printed circuit boards and method for manufacturing printed circuit
boards
    19.
    发明授权
    Printed circuit boards and method for manufacturing printed circuit boards 失效
    印刷电路板和制造印刷电路板的方法

    公开(公告)号:US4912020A

    公开(公告)日:1990-03-27

    申请号:US240852

    申请日:1988-09-02

    摘要: A printed circuit board is described in which an electrically insulating laminate material (40) has first and second sides. An electrically conducting first circuit pattern (15) is embedded in the first side of the laminate material (40), and an electrically conducting second circuit pattern (20) is embedded in the second side of the laminate material (40) electrically insulated from the first circuit pattern (15) by the laminate material (40). A solid interconnection member (20) extends through the laminate material (40) and electrically contacts both the first and second circuit patterns (15,20) at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15). A second board panel (30) is also fabricated, having a raised electrically conducting third circuit pattern (35) extending from another base layer (34) of conductive material. The first board panel (10) is laminated to the second board panel (30) with a laminate insulating material (40) disposed therebetween electrically insulating the first circuit pattern (15) from the third circuit pattern (35) and with the second circuit pattern (20) electrically contacting the first circuit pattern (15) at selected portions thereof. Finally, the base layers (14,34) of conductive material are removed from the laminate insulating material (40).

    摘要翻译: 描述了一种印刷电路板,其中电绝缘层压材料(40)具有第一和第二侧面。 导电第一电路图案(15)嵌入在层压材料(40)的第一侧中,并且导电的第二电路图案(20)嵌入在层压材料(40)的第二侧中,与第 第一电路图案(15)由层压材料(40)构成。 固体互连构件(20)延伸穿过层压材料(40)并且在其选定位置处电连接第一和第二电路图案(15,20)。 制造基板的方法包括作为第一步骤制造具有从导电材料的基底层(14)延伸的升高的导电第一电路图案(15)的第一板面板(10)和升高的导电的第二电路 图案(20)从第一电路图案(15)延伸。 还制造了第二板面板(30),其具有从导电材料的另一基底层(34)延伸的凸起的导电第三电路图案(35)。 第一板面板(10)用位于其间的层叠绝缘材料(40)层叠到第二板面板(30),使第一电路图案(15)与第三电路图案(35)电绝缘,并且第二电路图案 (20)在其选定部分与第一电路图案(15)电接触。 最后,将导电材料的基层(14,34)从叠层绝缘材料(40)中去除。