MANUFACTURING METHOD OF COMPOSITE COPPER FOIL

    公开(公告)号:US20240216947A1

    公开(公告)日:2024-07-04

    申请号:US18184695

    申请日:2023-03-16

    Abstract: A manufacturing method of composite copper foil includes the following steps: providing a copper foil, wherein the copper foil has a first surface and a second surface opposite to each other; performing a surface treatment with a surface treatment solution to form a first surface treatment layer on the first surface of the copper foil; and forming a first lithium metal layer on the first surface treatment layer. Another manufacturing method of composite copper foil includes the following steps: providing a copper foil, wherein the copper foil has a first surface and a second surface opposite to each other; preparing a conductive material; adding a filling material, an adhesive material and a solvent to the conductive material to form a slurry; coating the slurry on the first surface of the copper foil to form a first conductive layer.

    MODIFIED DICYCLOPENTADIENE-BASED RESIN
    14.
    发明公开

    公开(公告)号:US20240166788A1

    公开(公告)日:2024-05-23

    申请号:US18178547

    申请日:2023-03-06

    CPC classification number: C08F232/08

    Abstract: A modified dicyclopentadiene-based resin is provided. The modified dicyclopentadiene-based resin is formed from a dicyclopentadiene-based resin having an amino group, a phenol and a polyoxymethylene by a cyclization reaction. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.

    Rubber resin material with high dielectric constant

    公开(公告)号:US11920036B2

    公开(公告)日:2024-03-05

    申请号:US17740278

    申请日:2022-05-09

    CPC classification number: C08L9/06 B32B15/06 B32B25/02 B32B2307/204

    Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

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