-
公开(公告)号：US5126919A
公开(公告)日：1992-06-30
申请号：US261904
申请日：1988-10-25
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G11B11/10586 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译： 冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属 用于在转印板和电路部件之间建立热接触。
-
公开(公告)号：US4712158A
公开(公告)日：1987-12-08
申请号：US843947
申请日：1986-03-26
IPC分类号： H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , F28F3/12 , H01L23/4332 , H01L23/473 , F28F2250/04 , H01L2924/0002
摘要： A cooling system for electronic circuit components mounted on a printed circuit board, includes a cooling plate having a coolant passage, thermal contacts arranged on the cooling plate to be in resilient contact with the surfaces of the electronic components, which are cooled via the thermal contacts by liquid coolant flowing through the coolant passage. The cooling plate has one or more shortcut passages, the cross-sectional area of which is smaller than that of the coolant passage, to mutually connect predetermined portions of the coolant passage. The liquid coolant can be discharged from the cooling plate via the shortcut passage.
摘要翻译： 安装在印刷电路板上的用于电子电路部件的冷却系统包括具有冷却剂通道的冷却板，布置在冷却板上的热接触件，以与电子部件的表面弹性接触，冷却板通过热触头 液体冷却剂流过冷却剂通道。 冷却板具有一个或多个快速通道，其横截面积小于冷却剂通道的快速通道，以相互连接冷却剂通道的预定部分。 液体冷却剂可以通过快捷通道从冷却板排出。
-
公开(公告)号：US20070139206A1
公开(公告)日：2007-06-21
申请号：US11704321
申请日：2007-02-09
申请人： Shunichi Kikuchi , Masumi Suzuki , Michimasa Aoki
发明人： Shunichi Kikuchi , Masumi Suzuki , Michimasa Aoki
CPC分类号： G06K19/0773 , B31D1/028 , G06K19/07749 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/1517 , H01L2924/3025 , Y10T29/49117 , Y10T156/10 , Y10T156/1056 , Y10T156/1062 , H01L2224/0401
摘要： The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.
摘要翻译： 本发明提供了热扩散性优异的RFID标签。 RFID标签包括：基座，设置在基座上并形成通信天线的天线图案，与天线图形电连接并通过天线进行无线通信的电路芯片，与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案，以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。
-
公开(公告)号：US20060145867A1
公开(公告)日：2006-07-06
申请号：US11085491
申请日：2005-03-22
申请人： Shunichi Kikuchi , Masumi Suzuki , Michimasa Aoki
发明人： Shunichi Kikuchi , Masumi Suzuki , Michimasa Aoki
CPC分类号： G06K19/0773 , B31D1/028 , G06K19/07749 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/1517 , H01L2924/3025 , Y10T29/49117 , Y10T156/10 , Y10T156/1056 , Y10T156/1062 , H01L2224/0401
摘要： The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.
摘要翻译： 本发明提供了热扩散性优异的RFID标签。 RFID标签包括：基座，设置在基座上并形成通信天线的天线图案，与天线图形电连接并通过天线进行无线通信的电路芯片，与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案，以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。
-
公开(公告)号：US06399897B1
公开(公告)日：2002-06-04
申请号：US09631683
申请日：2000-08-02
IPC分类号： H01R909
CPC分类号： H05K1/0271 , H01L23/49822 , H01L23/49838 , H01L2224/16 , H01L2924/00014 , H01L2924/01057 , H01L2924/01078 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H05K3/4647 , H05K2201/09781 , H01L2224/0401
摘要： A multi-layer wiring substrate includes a main substrate and a plurality of insulating films stacked on the main substrate. The plurality of insulating films have wiring patterns formed on wiring regions thereof and dummy wiring patterns formed on peripheral regions of the wiring regions. The wiring patterns include signal wiring patterns, power supply wiring patterns, and vias. The dummy wiring patterns correspond to the wiring patterns, respectively.
摘要翻译： 多层布线基板包括主基板和堆叠在主基板上的多个绝缘膜。 多个绝缘膜具有在其布线区域上形成的布线图案和形成在布线区域的周边区域上的虚拟布线图案。 布线图案包括信号布线图案，电源布线图形和通孔。 虚设布线图案分别对应于布线图案。
-
16.发明授权Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together 失效具有多层电路板的多芯片模块，绝缘层和布线导体堆叠在一起
公开(公告)号：US5586006A
公开(公告)日：1996-12-17
申请号：US573577
申请日：1995-12-15
申请人： Kiyotaka Seyama , Shunichi Kikuchi , Makoto Sumiyoshi , Naoki Yasuda , Minoru Hirano , Hitoshi Nori
发明人： Kiyotaka Seyama , Shunichi Kikuchi , Makoto Sumiyoshi , Naoki Yasuda , Minoru Hirano , Hitoshi Nori
IPC分类号： H01L25/18 , H01L21/60 , H01L23/12 , H01L23/498 , H01L25/04 , H01L25/065 , H05K1/14 , H05K3/34 , H05K3/36 , H05K3/46 , H05K7/20
CPC分类号： H01L25/0657 , H01L23/49811 , H05K1/141 , H01L2224/16 , H01L2224/48225 , H01L2224/48227 , H01L2225/0651 , H01L2225/06555 , H01L2225/06572 , H01L2225/06579 , H01L2225/06589 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/10253 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H05K2201/0317 , H05K2201/1031 , H05K2201/10318 , H05K2201/10477 , H05K3/3421 , H05K3/3426 , H05K3/3436 , H05K3/368 , H05K3/467 , Y02P70/611
摘要： A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
摘要翻译： 多芯片模块包括基板，薄膜多层电路板，其设置在基板的第一表面上，并且具有层叠绝缘层和布线导体的多层结构，安装有电路元件 在薄膜多层电路板的主表面上，以及端子，其安装在薄膜多层电路板的主表面上，并将布线导体电连接到形成在其上的电路板上的电路 安装了多芯片模块。
-
公开(公告)号：US4920574A
公开(公告)日：1990-04-24
申请号：US79876
申请日：1987-07-30
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , H01L23/4332 , H01L2924/0002
摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant. A series of projections are provided on the heat transfer plate for producing turbulence in the flow of coolant. Alternatively, a cylindrical tubular plate is mounted on the heat transfer plate for increasing the surface area in contact with the flow of coolant.
摘要翻译： 一种冷却系统，包括冷却模块，该冷却模块具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏压，以将由部件散发的热量传递给冷却剂。 在传热板上提供一系列突起，用于在冷却剂流中产生湍流。 或者，圆柱形管板安装在传热板上，用于增加与冷却剂流接触的表面积。
-
公开(公告)号：US07951249B2
公开(公告)日：2011-05-31
申请号：US11704321
申请日：2007-02-09
申请人： Shunichi Kikuchi , Masumi Suzuki , Michimasa Aoki
发明人： Shunichi Kikuchi , Masumi Suzuki , Michimasa Aoki
IPC分类号： B32B41/00
CPC分类号： G06K19/0773 , B31D1/028 , G06K19/07749 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/1517 , H01L2924/3025 , Y10T29/49117 , Y10T156/10 , Y10T156/1056 , Y10T156/1062 , H01L2224/0401
摘要： The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.
摘要翻译： 本发明提供了热扩散性优异的RFID标签。 RFID标签包括：基座，设置在基座上并形成通信天线的天线图案，与天线图形电连接并通过天线进行无线通信的电路芯片，与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案，以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。
-
公开(公告)号：US06303877B2
公开(公告)日：2001-10-16
申请号：US09109912
申请日：1998-07-02
IPC分类号： H01R909
CPC分类号： H05K1/115 , H01L23/49816 , H01L23/5384 , H01L2224/16225 , H01L2924/15322 , H05K1/113 , H05K3/467 , H05K2201/096 , H05K2201/0979
摘要： A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by laminating the wiring layers so as to be provide through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to the one of the plurality of wiring layers which is placed at a position closest to the base material.
摘要翻译： 一种多层薄膜布线板，包括设置有多个布线层的基材和层叠在基材上的绝缘层，并且包括通过层叠布线层而形成的通孔，以便通过绝缘层提供。 通过在形成通孔的布线层之一中形成多个分支来提供多个分支通孔，多个分支通孔沿着基材的延伸方向放置。 多个分支通孔连接到放置在最接近基材的位置的多个布线层中的一个。
-
公开(公告)号：US06300678B1
公开(公告)日：2001-10-09
申请号：US09184081
申请日：1998-11-02
申请人： Mitsuo Suehiro , Satoshi Osawa , Shunichi Kikuchi
发明人： Mitsuo Suehiro , Satoshi Osawa , Shunichi Kikuchi
IPC分类号： H01L2348
CPC分类号： H01L24/01 , H01L21/4853 , H01L23/49811 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15787 , H05K3/3426 , Y02P70/613 , H01L2224/13099 , H01L2224/29099 , H01L2924/00
摘要： There is provided an I/O pin by which an MCM is positively prevented from being damaged by solder flowing from the fore end to the base of the I/O pin when the I/O pin is soldered in the case of mounting the MCM. An I/O pin used for an electrical connection is provided, one end of which is perpendicularly fixed to an MCM and the other end of which is soldered to a predetermined position on the mother board in the case of mounting the MCM on the mother board. In an intermediate portion of the I/O pin, there is formed a solder dam composed of a plated layer of Ni of low solder wettability, a layer of highly heat-resistant resin or a layer of high-temperature solder.
摘要翻译： 在安装MCM的情况下，当I / O引脚被焊接时，提供了一个I / O引脚，通过该引脚可以有效地防止MCM从焊接头从I / O引脚的前端流到基座的损坏。 设置用于电连接的I / O引脚，其一端垂直固定于MCM，另一端在将MCM安装在母板上的情况下焊接到母板上的预定位置 。 在I / O引脚的中间部分形成有由低焊料润湿性的Ni的镀层，高耐热树脂层或高温焊料层构成的焊料坝。
-
-
-
-
-
-
-
-
-
搜索结果
25 条记录 (耗时 0.025 秒)
