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    SHEET FOR SHOE SOLE AND SHOE SOLE INCLUDING THE SAME
    11.
    发明申请
    SHEET FOR SHOE SOLE AND SHOE SOLE INCLUDING THE SAME 审中-公开
    鞋子的鞋子和鞋子包括其中的鞋子

    公开(公告)号：US20130318835A1

    公开(公告)日：2013-12-05

    申请号：US14000139

    申请日：2011-03-11

    申请人： Mitsuteru Mutsuda ,  Hiroaki Arita ,  Tomohiro Kawahara

    发明人： Mitsuteru Mutsuda ,  Hiroaki Arita ,  Tomohiro Kawahara

    IPC分类号： A43B13/02 ,  C08L77/06 ,  B29C35/02 ,  C08G69/26

    CPC分类号： A43B13/023 ,  A43B13/026 ,  A43B13/04 ,  A43B13/12 ,  A43B13/24 ,  B29C35/0222 ,  B29D35/142 ,  C08G69/26 ,  C08L77/06

    摘要： A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided.The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165° C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).

    摘要翻译： 提供了一种用于形成鞋底的片材，其用于有效地将作为柱的交联橡胶层和作为鞋底的热塑性弹性体层有效地接合。 该片材包含根据ISO178的含有聚酰胺树脂（a）并且氨基浓度不小于10mmol / kg和挠曲模量不小于300MPa的树脂组分（A）。 聚酰胺树脂（a）可以在总聚酰胺树脂（a）中含有预定浓度（例如不低于30重量％）的熔点不低于165℃的聚酰胺树脂。

    POWDERY SEALANT AND SEALING METHOD
    12.
    发明申请
    POWDERY SEALANT AND SEALING METHOD 审中-公开
    粉末密封和密封方法

    公开(公告)号：US20130177704A1

    公开(公告)日：2013-07-11

    申请号：US13822498

    申请日：2011-09-21

    申请人： Hiroaki Arita ,  Yoshiki Nakaie ,  Mitsuteru Mutsuda

    发明人： Hiroaki Arita ,  Yoshiki Nakaie ,  Mitsuteru Mutsuda

    IPC分类号： C09J177/00 ,  C09J177/06

    CPC分类号： C09J177/00 ,  C08G69/02 ,  C08G69/08 ,  C08G69/14 ,  C08G69/26 ,  C08G69/265 ,  C08G69/36 ,  C09J177/02 ,  C09J177/06 ,  H01L23/291 ,  H01L23/293 ,  H01L31/0481 ,  H01L51/5253 ,  H01L2924/0002 ,  H05K3/284 ,  H05K3/285 ,  H05K2203/1316 ,  Y02E10/50 ,  H01L2924/00

    摘要： A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided.The sealant for molding and sealing a device comprises a copolyamide-series resin powder. The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be a multiple copolymer, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C8-16alkylene group (at least one component selected from the group consisting of a C9-17lactam and an aminoC9-17alkanecarboxylic acid).

    摘要翻译： 提供了能够在低温下紧密地密封电子装置的密封剂和使用密封剂的密封方法。 用于模制和密封装置的密封剂包括共聚酰胺系树脂粉末。 共聚酰胺系树脂可以是结晶性树脂。 共聚酰胺系树脂的熔点或软化点可以为75〜160℃。共聚酰胺系树脂可以是多元共聚物，例如二元或三元共聚物。 此外，共聚酰胺类树脂可以含有源自具有C8-16亚烷基的长链成分的单元（至少一种选自C 9-17内酰胺和氨基C 17-17烷羧酸的成分）。

    Thermoplastic resin composition material and formed article comprising said material
    13.
    发明授权
    Thermoplastic resin composition material and formed article comprising said material 失效
    热塑性树脂组合物材料和包含所述材料的成型制品

    公开(公告)号：US07030190B2

    公开(公告)日：2006-04-18

    申请号：US10250509

    申请日：2002-02-26

    申请人： Naoki Wakita ,  Hiroaki Arita

    发明人： Naoki Wakita ,  Hiroaki Arita

    IPC分类号： C08L67/00 ,  C08L77/00

    CPC分类号： C08L67/02 ,  C08J3/00 ,  C08J3/005 ,  C08L23/16 ,  C08L55/02 ,  C08L71/02 ,  C08L101/00 ,  C08L2666/02

    摘要： A thermoplastic resin composition material 1 includes a resin portion (a) 2 made of a thermoplastic resin (A); elastomer portions (b) 3 made of a thermoplastic elastomer (B) having substantially no compatibility with the thermoplastic resin (A) and having a glass transition temperature of lower than or equal to −40° C.; and polymer portions (c) 4 made of a high polymer (C) having substantially no compatibility with the thermoplastic resin (A) and the thermoplastic elastomer (B), having a glass transition temperature or crystallization temperature of lower than or equal to −50° C., and having a viscosity at 40° C. of 0.1 to 200000 cP. The material has a structure in which the elastomer portions (b) 3 are dispersed in the resin portion (a) 2, and the polymer portions (c) 4 are dispersed in the elastomer portions (b) 3. Accordingly, low-temperature impact resistance can significantly be improved without deterioration in the other inherent excellent physical properties of the thermoplastic resin.

    摘要翻译： 热塑性树脂组合物材料1包括由热塑性树脂（A）制成的树脂部分（a）2; 由与热塑性树脂（A）基本上不相容的玻璃化转变温度低于或等于-40℃的由热塑性弹性体（B）制成的弹性体部分（b）3; 以及与热塑性树脂（A）和热塑性弹性体（B）基本上不相容的高聚物（C）制成的聚合物部分（c）4，玻璃化转变温度或结晶温度低于或等于-50℃ ℃，在40℃下的粘度为0.1〜200000cP。 该材料具有弹性体部分（b）3分散在树脂部分（a）2中并且聚合物部分（c）4分散在弹性体部分（b）3中的结构。因此，低温冲击 可以显着改善耐热性，而不会使热塑性树脂的其它固有的优异物理性能下降。

    Cement retarder and cement retardative sheet
    14.
    发明授权
    Cement retarder and cement retardative sheet 失效
    水泥缓凝剂和水泥阻滞片

    公开(公告)号：US06376580B1

    公开(公告)日：2002-04-23

    申请号：US09290549

    申请日：1999-04-12

    申请人： Toru Ikuta ,  Hiroaki Arita

    发明人： Toru Ikuta ,  Hiroaki Arita

    IPC分类号： C08K300

    CPC分类号： C04B24/267 ,  C04B40/0633 ,  C04B41/5323 ,  C04B2103/0086 ,  C04B2103/20 ,  C04B2103/24 ,  Y10T428/8305

    摘要： A polymer comprising an anionic group (e.g. an acid anhydride group, a carboxyl group) and a hydrophilic segment (e.g. a polyoxyalkylene ether unit) is used as a cement retarder. The polymer is obtainable by copolymerization of a monomer including maleic anhydride with a monomer including a vinylalkyl ether-series monomer in which an alkylene oxide is added to allyl alcohol. The polymer may be a copolymer copolymerized with other monomers such as styrene. Use of this cement retarder can provide patterns or washing-finished face on the surface of a concrete product. The cement retarder is suitable for application for a cement retardative sheet.

    摘要翻译： 使用包含阴离子基团（例如酸酐基团，羧基）和亲水链段（例如聚氧化烯醚单元）的聚合物作为水泥缓凝剂。 该聚合物可以通过使包含马来酸酐的单体与包含烯键式醇的烯化氧的乙烯基烷基醚系单体的单体共聚而获得。 聚合物可以是与其它单体如苯乙烯共聚的共聚物。 使用这种水泥缓凝剂可以在混凝土产品的表面上提供图案或洗涤后的表面。 水泥缓凝剂适用于水泥阻滞片。

    Cement retarder and cement retardative sheet
    15.
    发明授权
    Cement retarder and cement retardative sheet 失效
    水泥缓凝剂和水泥阻滞片

    公开(公告)号：US6077910A

    公开(公告)日：2000-06-20

    申请号：US899167

    申请日：1997-07-23

    申请人： Toru Ikuta ,  Hiroaki Arita

    发明人： Toru Ikuta ,  Hiroaki Arita

    IPC分类号： E04F13/14 ,  B28B1/14 ,  B28B7/36 ,  C04B24/16 ,  C04B24/26 ,  C04B24/32 ,  C04B40/06 ,  C04B41/53 ,  C04B41/72 ,  C08L33/02 ,  C08L35/00 ,  C08L55/00 ,  C08L101/00 ,  C08F8/42

    CPC分类号： C04B24/267 ,  C04B40/0633 ,  C04B41/5323 ,  C04B2103/0086 ,  C04B2103/20 ,  C04B2103/24 ,  Y10T428/8305

    摘要： A polymer comprising an anionic group (e.g. an acid anhydride group, a carboxyl group) and a hydro-philic segment (e.g. a polyoxyalkylene ether unit) is used as a cement retarder. The polymer is obtainable by copolymerization of a monomer including maleic anhydride with a monomer including a vinylalkyl ether-series monomer in which an alkylene oxide is added to allyl alcohol. The polymer may be a copolymer copolymerized with other monomers such as styrene. Use of this cement retarder can provide patterns or washing-finished face on the surface of a concrete product. The cement retarder is suitable for application for a cement retardative sheet.

    摘要翻译： 使用包含阴离子基团（例如酸酐基团，羧基）和亲水链段（例如聚氧化烯醚单元）的聚合物作为水泥缓凝剂。 该聚合物可以通过使包含马来酸酐的单体与包含烯键式醇的烯化氧的乙烯基烷基醚系单体的单体共聚而获得。 聚合物可以是与其它单体如苯乙烯共聚的共聚物。 使用这种水泥缓凝剂可以在混凝土产品的表面上提供图案或洗涤后的表面。 水泥缓凝剂适用于水泥阻滞片。

    Manufacturing method for thin-film transistor
    18.
    发明授权
    Manufacturing method for thin-film transistor 有权
    薄膜晶体管的制造方法

    公开(公告)号：US07645630B2

    公开(公告)日：2010-01-12

    申请号：US10545361

    申请日：2004-02-17

    申请人： Katsura Hirai ,  Hiroshi Kita ,  Hiroaki Arita

    发明人： Katsura Hirai ,  Hiroshi Kita ,  Hiroaki Arita

    IPC分类号： H01L51/40

    CPC分类号： C23C16/30 ,  H01L51/0002 ,  H01L51/0005 ,  H01L51/0533 ,  H01L51/0541 ,  H01L51/0545

    摘要： It is an object of the present invention to provide an organic thin-film transistor exhibiting high carrier mobility and a manufacturing method thereof. Disclosed is an organic thin-film transistor possessing a film having a contact angle against pure water of a surface of not less than 50°, wherein an organic semiconductor layer is formed on the film prepared by a CVD (chemical vapor deposition) method employing a reactive gas.

    摘要翻译： 本发明的目的是提供一种显示高载流子迁移率的有机薄膜晶体管及其制造方法。 公开了一种有机薄膜晶体管，其具有与表面的纯水接触角不小于50°的膜，其中在通过CVD（化学气相沉积）方法制备的膜上形成有机半导体层，该方法使用 反应气体。

    Composite member and process for producing the same
    19.
    发明授权
    Composite member and process for producing the same 失效
    复合构件及其制造方法

    公开(公告)号：US5922476A

    公开(公告)日：1999-07-13

    申请号：US817148

    申请日：1997-04-09

    申请人： Hiroaki Arita ,  Haruo Ichikawa ,  Hiroshi Sagane

    发明人： Hiroaki Arita ,  Haruo Ichikawa ,  Hiroshi Sagane

    IPC分类号： B32B25/08 ,  C08J5/12 ,  B32B27/08

    CPC分类号： C08J5/121 ,  B32B25/08 ,  C08J2309/02 ,  C08J2333/20 ,  Y10T428/31909

    摘要： A composite member is obtained which includes a thermoplastic resin and a rubber directly and firmly adhering to each other. A composite member is obtained by adhering a molded element of a thermoplastic resin including a homo- or co-polymer of a vinyl cyanide including acrylonitrile, and a rubber molded element constituting a rubber composition containing a vinyl cyanide as a comonomer by means of heating. The resin molded element may be formed from, for example, AS resin, ABS resin or an polymer alloy containing ABS resin. The rubber molded element may be composed of a vulcanizable rubber composition containing NBR or another rubber. Both the molded elements can adhere to each other by contacting the resin molded element with the rubber molded element closely and heating at least either the resin molded element or the rubber molded element by means of melting, vulcanization or the like.

    摘要翻译： PCT No.PCT / JP96 / 02403 Sec。 371日期1997年04月9日 102（e）1997年4月9日PCT PCT 1996年8月28日PCT公布。 出版物WO97 / 07975 日期1997年3月6日获得包括热塑性树脂和橡胶直接且牢固地粘合的复合构件。 通过将包含丙烯腈的乙烯基氰的均聚物或共聚物的热塑性树脂的模塑元件和构成含有作为共聚单体的乙烯基氰的橡胶组合物的橡胶模制元件通过加热粘合而获得复合构件。 树脂模制元件可以由例如AS树脂，ABS树脂或含有ABS树脂的聚合物合金形成。 橡胶成型体可以由含有NBR或其他橡胶的硫化橡胶组合物构成。 通过使树脂模制元件与橡胶模制件紧密接触并且通过熔化，硫化等加热树脂模制元件或橡胶模制元件中的至少一个，两个模制元件可以彼此粘合。